Conductive flooring material and a production method therefor

Patent metadata

Field	Value
Publication number	US-9677286-B2
Application number	US-201013375345-A
Country	US
Kind code	B2
Filing date	Sep 7, 2010
Priority date	Sep 25, 2009
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

The present invention relates to a conductive flooring material containing a conductive deformation-preventing layer containing conductive fibers comprising glass fibers and carbon fibers, and to a production method therefor. The present invention can provide a conductive material which is useful not only in the form of tiles but also in the form of long sheets because the conductive fibers comprise glass fiber and carbon fiber impart not only outstanding electrical conductivity but also stable deformation-preventing properties.

First claim

What is claimed is:

1. A conductive flooring material, comprising:
a conductive deformation-preventing layer comprising carbon fibers and glass fibers formed into conductive fibers, the carbon fibers in an amount of 3 parts by weight to 30 parts by weight based on 100 parts by weight of glass fibers, and the conductive fibers having polymer resin impregnated therein;
a conductive chip layer comprising carbon chips and colored chips formed on a top surface of the conductive deformation-preventing layer, the carbon chips present in an amount of 5 parts by weight to 30 parts by weight based on 100 parts by weight of the colored chips;
a conductive backing layer comprising a carbon material and a polymer resin formed on a bottom side of the conductive deformation-preventing layer, the carbon material present in an amount of 10 parts by weight to 300 parts by weight based on 100 parts by weight of the polymer resin, and the polymer resin includes polyvinyl chloride resin;
a UV coating layer comprising a photocurable resin and conductive particles formed on the conductive chip layer, the conductive particles having an average particle diameter ranging from 5 nm to 200 nm; and
a conductive wax layer formed on the conductive chip layer different from the UV coating layer comprising a wax containing conductive particles, the conductive particles having an average particle diameter ranging from 5 nm to 200 nm.

2. The conductive flooring material of claim 1 , which has an electrical resistance of 10 3 to 10 10 Ω.

3. The conductive flooring material of claim 1 , which has a dimensional change ratio of 0.1% or less being measured after exposure to a temperature of 80° C. for 6 hours.

4. The conductive flooring material of claim 1 , which is in the form of a long sheet type or a tile type.

5. The conductive flooring material of claim 1 , wherein the conductive particles comprise micro-sized particles having conductivity selected from a group consisting of carbon nanotubes, antimony-doped tin oxide (ATO), indium-doped tin oxide (ITO), and antimony-doped zinc oxide (AZO).

6. The conductive flooring material of claim 1 , wherein the carbon chips are conductive chips prepared by grinding a cured polymer resin comprising carbon and the colored chips include a certain color chip.

7. A method for producing a conductive flooring material, comprising:
forming a conductive deformation-preventing layer comprising carbon fibers and glass fibers formed into conductive fibers, and impregnating a polymer resin sol in the conductive fibers, the carbon fibers in an amount of 3 parts by weight to 30 parts by weight based on 100 parts by weight of glass fibers;
forming a conductive chip layer on a top surface of the conductive deformation-preventing layer by scattering a conductive chip on the conductive deformation-preventing layer and thermally compressing the scattered conductive chip; and
forming a conductive backing layer comprising a carbon material and polymer resin on a bottom side of the conductive deformation-preventing layer and thermally compressing the conductive backing layer, the carbon material present in an amount of 10 parts by weight to 300 parts by weight based on 100 parts by weight of the polymer resin and the polymer resin comprising polyvinyl chloride resin;
forming a UV coating layer comprising a photocurable resin and conductive particles formed on the conductive chip layer, the conductive particles having an average particle diameter ranging from 5 nm to 200 nm; and
forming a conductive wax layer formed on the conductive chip layer different from the UV coating layer comprising a wax containing conductive particles, the conductive particles having an average particle diameter ranging from 5 nm to 200 nm.

8. The method for producing the conductive flooring material of claim 7 , further comprising:
coating a photocurable resin composition comprising conductive particles on the conductive chip layer; and
curing the coated photocurable composition by UV-irradiating the coated photocurable composition.

Assignees

• Ha Kyungtae
• Sung Jae Wan
• Park Sung Ha
• Lg Hausys Ltd

Inventors

• Ha Kyungtae
• Sung Jae Wan
• Park Sung Ha

Classifications

• E04F2290/048

  against static electricity · CPC title

• E04F15/102

  of fibrous or chipped materials, e.g. bonded with synthetic resins · CPC title

• E04F15/107 Primary

  composed of several layers, e.g. sandwich panels (layered products in general B32B; producing decorative panels or veneers B44C5/04) · CPC title

• Y10T428/249924

  Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity · CPC title

• Y10T428/249949

  Two or more chemically different fibers · CPC title