Print head die with thermal control

US9676190B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9676190-B2
Application numberUS-201615339715-A
CountryUS
Kind codeB2
Filing dateOct 31, 2016
Priority dateSep 25, 2012
Publication dateJun 13, 2017
Grant dateJun 13, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A print head die may include a substrate, an electrical connector and at least three liquid feed slots. The electrical connector is on a first side of the substrate and extends along the major dimension of the substrate. The electrical connector is connectable directly to an electrical interconnect to connect the print head die to a controller. The at least three liquid feed slots are formed in the substrate and extend along the major dimension of the substrate. Wherein at least one and less than all of the at least three liquid feed slots has an associated temperature sensor connected to the electrical connector.

First claim

Opening claim text (preview).

What is claimed is: 1. A print head die comprising: a substrate comprising: a first liquid feed slot extending along a major dimension of the substrate on a first side of the substrate; and a second liquid feed slot extending along the major dimension of the substrate on a second side of the substrate; first columns of nozzles having firing actuators extending along opposite sides of the first liquid feed slot; second columns of nozzles having firing actuators extending along opposite sides of the second liquid feed slot; an electrical connector on the first side of the substrate and extending along the major dimension of the substrate adjacent the first liquid feed slot, the electrical connector being electrically connected to firing actuators of the nozzles of the first columns and the second columns and connectable directly to an electrical interconnect; and a temperature sensor formed on the second side of the substrate adjacent to the second liquid feed slot, wherein the die omits additional temperature sensors between the first side and the second liquid feed slot. 2. The print die of claim 1 , wherein the temperature sensor extends along an entire length of the second columns of nozzles. 3. The print die of claim 1 further comprising: a third liquid feed slot between the first liquid feed slot and the second liquid feed slot; and third columns of nozzles having fire actuators extending along opposite sides of the third liquid feed slot. 4. The print die of claim 3 further comprising: a fourth liquid feed slot between the third liquid feed slot and the second liquid feed slot; and fourth columns of nozzles having fire actuators extending along opposite sides of the third liquid feed slot. 5. The print die of claim 4 , wherein the first liquid feed slot, the second liquid feed slot, the third liquid feed slot and the fourth liquid feed slot are to supply yellow ink, cyan ink, magenta ink and black ink, respectively. 6. The print die of claim 1 , wherein the first liquid feed slot adjacent the electrical connector is to supply a first ink having a first drop volume and wherein the second liquid feed slot adjacent the temperature sensor is to supply a second ink having a second drop volume greater than the first drop volume. 7. The print die of claim 1 , wherein the second liquid feed slot supplies black ink. 8. The print die of claim 1 , wherein the first liquid feed slot supplies yellow ink. 9. A page wide print head assembly comprising: a support holding printhead dies having a collective width to span a corresponding media width, wherein each of the printhead dies comprises: a substrate comprising: a first liquid feed slot extending along a major dimension of the substrate on a first side of the substrate; and a second liquid feed slot extending along the major dimension of the substrate on a second side of the substrate; first columns of nozzles having firing actuators extending along opposite sides of the first liquid feed slot; second columns of nozzles having firing actuators extending along opposite sides of the second liquid feed slot; an electrical connector on the first side of the substrate and extending along the major dimension of the substrate adjacent the first liquid feed slot, the electrical connector being electrically connected to firing actuators of the nozzles of the first columns and the second columns and connectable directly to an electrical interconnect; and a temperature sensor formed on the second side of the substrate adjacent to the second liquid feed slot, wherein the die omits additional temperature sensors between the first side and the second liquid feed slot. 10. The page wide print head assembly of claim 9 , wherein the temperature sensor extends along an entire length of the second columns of nozzles. 11. The page wide print head assembly of claim 10 further comprising: a third liquid feed slot between the first liquid feed slot and the second liquid feed slot; and third columns of nozzles having fire actuators extending along opposite sides of the third liquid feed slot. 12. The page wide print head assembly of claim 11 further comprising: a fourth liquid feed slot between the third liquid feed slot and the second liquid feed slot; and fourth columns of nozzles having fire actuators extending along opposite sides of the third liquid feed slot. 13. The page wide printing assembly of claim 12 , wherein the first liquid feed slot, the second liquid feed slot, the third liquid feed slot and the fourth liquid feed slot are to supply yellow ink, cyan ink, magenta ink and black ink, respectively. 14. The page wide printing assembly of claim 9 , wherein the first liquid feed slot adjacent the electrical connector is to supply a first ink having a first drop volume and wherein the second liquid feed slot adjacent the temperature sensor is to supply a second ink having a second drop volume greater than the first drop volume. 15. The page wide print head assembly of claim 9 , wherein the second liquid feed slot supplies black ink. 16. The page wide print head assembly of claim 9 , wherein the first liquid feed slot supplies yellow ink. 17. The page wide print head assembly of claim 9 , wherein the print head dies are staggered and partially overlap one another. 18. A print head die comprising: a substrate; an electrical connector on a first side of the substrate and extending along the major dimension of the substrate, the electrical connector being connectable directly to an electrical interconnect to connect the print head die to a controller; at least three liquid feed slots formed in the substrate and extending along the major dimension of the substrate, wherein at least one and less than all of the at least three liquid feed slots has an associated temperature sensor connected to the electrical connector. 19. The print die of claim 18 , wherein the at least two of the three liquid feed slots share a single temperature sensor. 20. The print die of claim 18 , wherein the at least three liquid feed slots share a single temperature sensor.

Assignees

Inventors

Classifications

  • controlling heads based on piezoelectric elements · CPC title

  • Electrical connection · CPC title

  • involving calculation of temperature · CPC title

  • for line printing · CPC title

  • controlling heads based on heating elements forming bubbles · CPC title

Patent family

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Frequently asked questions

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What does patent US9676190B2 cover?
A print head die may include a substrate, an electrical connector and at least three liquid feed slots. The electrical connector is on a first side of the substrate and extends along the major dimension of the substrate. The electrical connector is connectable directly to an electrical interconnect to connect the print head die to a controller. The at least three liquid feed slots are formed in…
Who is the assignee on this patent?
Hewlett Packard Development Co Lp
What technology area does this patent fall under?
Primary CPC classification B41J2/1433. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 13 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).