Liquid crystal switching barrier thermal control
US-9223167-B2 · Dec 29, 2015 · US
US9674986B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9674986-B2 |
| Application number | US-201514816122-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 3, 2015 |
| Priority date | Aug 3, 2015 |
| Publication date | Jun 6, 2017 |
| Grant date | Jun 6, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A heat spreader including multiple layers of anisotropic material to conduct thermal energy. Multiple graphite sheet layers may be laminated and each sheet may be thermally connected to one or more thermal energy sources in a portable electronic device. Methods for making a heat spreader are also disclosed.
Opening claim text (preview).
We claim: 1. A heat spreader comprising: a group of layers, wherein a given layer in the group of layers has a height and a lateral area and the given layer is formed from an anisotropic thermal material that conducts more heat across the lateral area than along the height of the given layer; and at least one contact region physically and thermally connected to each of the layers in the group of layers, wherein each of the layers in the group of layers is affixed to an adjacent layer of the group of layers. 2. The heat spreader of claim 1 , wherein: the at least one contact region is co-planar with respect to a common plane; and the group of layers extends perpendicularly with respect to the common plane. 3. The heat spreader of claim 1 , further comprising an insulating layer positioned between adjacent first and second layers from the group of layers. 4. The heat spreader of claim 1 , wherein the group of layers includes at least one folded layer of anisotropic thermal material. 5. The heat spreader of claim 1 wherein the group of layers comprises: at least two sheets; and a thermal connector coupling the at least two sheets. 6. The heat spreader of claim 5 , wherein the thermal connector is a metal. 7. The heat spreader of claim 1 , wherein: at least one layer of the group of layers is a graphite layer; another layer of the group of layers is a metal layer; and the metal layer is thermally connected to the graphite layer. 8. The heat spreader of claim 1 , wherein at least one layer of the group of layers is angled with respect to a common plane and the contact regions are co-planar with respect to the common plane. 9. The heat spreader of claim 1 , wherein each layer of the group of layers comprises multiple contact regions. 10. A portable electronic device comprising: a heat source; and a heat spreader connected to the heat source and comprising a group of layers, each of the layers in the group of layers being formed from an anisotropic thermal material; wherein: a given layer of the group of layers is physically adjacent the heat source; and the given layer conducts heat in a first direction and resists heat transfer in a second direction. 11. The portable electronic device of claim 10 , further comprising a heat sink thermally connected to the layer; wherein the given layer preferentially conducts heat from the heat source, in the first direction, to the heat sink. 12. The portable electronic device of claim 11 further comprising: a second heat source; wherein: a second layer of the group of layers is physically and thermally connected to the second heat source by a contact region; and the second layer conducts heat in a third direction, away from the second heat source, and resists heat transfer in a fourth direction. 13. The portable electronic device of claim 12 , wherein the second layer is thermally connected to the heat sink. 14. The portable electronic device of claim 12 , wherein each layer of the group of layers comprises first and second contact regions, the first contact regions being physically and thermally connected to the heat source, and the second contact regions being physically and thermally connected to the second heat source. 15. The portable electronic device of claim 10 , wherein a thickness of the layer is greater than an effective thickness, thereby reducing thermal transfer from the layer to an adjacent layer. 16. The portable electronic device of claim 10 , wherein each of the layers in the group of layers is thermally isolated from all other layers in the group of layers. 17. The portable electronic device of claim 10 , wherein a second layer of the group of layers is formed from a metal. 18. The portable electronic device of claim 17 , wherein the second layer conducts heat isotropically. 19. The portable electronic device of claim 10 , wherein the given layer wraps around the heat source and contacts the heat source on multiple sides. 20. A heat spreader comprising: a first sheet having a first coplanar contact region attached to a first transfer surface; and a second sheet stacked on the first sheet, wherein the second sheet has a second coplanar region, a second transfer surface, and a bent portion coupled between the second transfer surface and the second coplanar contact region, and the first and second coplanar contact regions are coplanar with the first transfer surface.
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
characterised by their materials · CPC title
Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title
Electricity · mapped topic
Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.