Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board

US9673646B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9673646-B1
Application numberUS-201615241264-A
CountryUS
Kind codeB1
Filing dateAug 19, 2016
Priority dateAug 19, 2016
Publication dateJun 6, 2017
Grant dateJun 6, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Disclosed are novel copper foils used as components of wireless charging systems. The copper foils can be laminated to produce flexible copper clad laminates, which can then be etched to form printed circuits (coils). The coils can be used as either, or both, of a receiver wireless charging circuit and/or a transmitter wireless charging circuit. Regulation of the chemical and physical properties of the copper foil produces higher efficiencies in the wireless charging system components.

First claim

Opening claim text (preview).

The invention claimed is: 1. A surface treated copper foil comprising: (a) a copper content greater than 90%; (b) (R max −Rz)/Rz of a laminate side of the copper foil is lower than 0.9; (c) a tensile strength reduction rate is lower than 15% after 200° C.×1 hr annealing; (d) based on a total sum of texture coefficients of a (111) plane, a (200) plane, a (220) plane and a (311) plane of the surface treated copper foil, a sum of the texture coefficients of the (200) plane and the (220) plane of the surface treated copper foil is greater than 50%, wherein texture coefficients of the surface treated copper foil for each of a (111) plane, a (200) plane, a (220) plane and a (311) plane is obtained by calculation from measurement of X-ray diffraction intensity on a resist side after 200° C.×1 hr. annealing; wherein the tensile strength is in the range of 29 to 39 kg/mm 2 at room temperature. 2. The surface treated copper foil of claim 1 , wherein the surface roughness (Rz) of the laminate side is in the range of 0.7 to 3.0 μm. 3. The surface treated copper foil of claim 1 , wherein a nickel content of the laminate side is lower than 500 μg/dm 2 . 4. The surface treated copper foil of claim 1 , wherein the TC (111) is lower than 1.0 after 200° C.×1 hr. annealing. 5. The surface treated copper foil of claim 1 , wherein the TC (200) is larger than 1.0 after 200° C.×1 hr. annealing. 6. The surface treated copper foil of claim 1 , wherein the surface roughness of resist side is lower than 2.2 μm. 7. The surface treated copper foil of claim 1 , wherein the thickness of the copper foil is in the range of 35 to 210 μm. 8. The surface treated copper foil of claim 7 , wherein the thickness is in the range of 35 to 70 μm. 9. The surface treated copper foil of claim 1 , further comprising a layer of copper nodules. 10. The surface treated copper foil of claim 9 , further comprising a silane coupling agent. 11. The surface treated copper foil of claim 9 , further comprising a Zn treatment. 12. The surface treated copper foil of claim 9 , further comprising a chromate treatment. 13. A flexible copper clad laminate comprising two layers of the surface treated copper foil according to claim 1 laminated to composite film. 14. The flexible copper clad laminate according to claim 13 , wherein the composite film comprises a polyimide sandwiched between two layers of thermoplastic film. 15. A method of making the flexible copper clad laminate of claim 13 comprising; providing two spaced layers of the surface treated copper foil; providing the composite film between the spaced layers of copper foil; feeding the two layers of copper foil and the composite film through a hot press at a temperature in the range of 300°˜400° C. for a time period of about 2 minutes to form a two layer flexible copper clad laminate. 16. The method of claim 15 further comprising etching the copper clad laminate to form a circuit. 17. The method according to claim 16 , wherein the circuit is a coil of a wireless charging flexible printed circuit board. 18. A wireless charging receiver comprising the surface treated copper foil of claim 1 . 19. The wireless charging receiver of claim 18 , wherein the receiver is one selected from the group consisting of smartphones, tablets, wearables, automobiles, industrial machinery and combinations thereof. 20. A wireless charging transmitter comprising the surface treated copper foil of claim 1 . 21. The wireless charging transmitter of claim 20 incorporated into at least one of a desk, a conference table, a coffee table, airport seating, theater seating, airplanes and an automobile.

Assignees

Inventors

Classifications

  • H02J7/70Primary

    characterised by the mechanical construction · CPC title

  • of copper or alloys based thereon · CPC title

  • Layered products · CPC title

  • Printed circuits · CPC title

  • Roller, cylinder or drum types; Band or belt types; Ball types (B29C66/8351 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9673646B1 cover?
Disclosed are novel copper foils used as components of wireless charging systems. The copper foils can be laminated to produce flexible copper clad laminates, which can then be etched to form printed circuits (coils). The coils can be used as either, or both, of a receiver wireless charging circuit and/or a transmitter wireless charging circuit. Regulation of the chemical and physical propertie…
Who is the assignee on this patent?
Chang Chun Petrochemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification H02J7/70. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).