Optical semiconductor element mounting package, and optical semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-9673362-B2
Application number	US-30318807-A
Country	US
Kind code	B2
Filing date	May 21, 2007
Priority date	Jun 2, 2006
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

First claim

The invention claimed is:

1. An optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating:
a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and
at least a pair of positive and negative lead electrodes, each of the positive and negative lead electrodes having opposed first and second major surfaces extending continuously from an inner end to an opposite end, the pair of positive and negative lead electrodes being disposed with their inner ends opposite each other so that inner portions of the first major surface of the positive and negative lead electrodes form part of the bottom face of the recessed part, wherein there is no gap at a joint face between the resin molding and the lead electrodes, the inner ends of the positive and negative lead electrodes are separated by the thermosetting light-reflecting resin composition and at least portions of the second major surface of the positive and negative lead electrodes are not in contact with the thermosetting light-reflecting resin composition.

2. The optical semiconductor element mounting package according to claim 1 , wherein the integration of the resin molding and the positive and negative lead electrodes is performed by transfer molding.

3. The optical semiconductor element mounting package according to claim 1 or 2 , wherein the thermosetting light-reflecting resin composition includes a filler.

4. The optical semiconductor element mounting package according to claim 1 or 2 , wherein the thermosetting light-reflecting resin composition includes components: (A) an epoxy resin; (B) a curing agent; (C) a curing accelerator; (D) an inorganic filler; (E) a white pigment; and (F) a coupling agent, and is a resin composition whose optical reflectivity at a wavelength of 350 to 800 nm is at least 80% and which can be press molded at normal temperature (0 to 35° C.).

5. The optical semiconductor element mounting package according to claim 4 , wherein the inorganic filler (D) is at least one type selected from the group consisting of silica, alumina, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate.

6. The optical semiconductor element mounting package according to claim 4 , wherein the average particle size of the white pigment (E) is between 0.1 and 50 μm.

7. The optical semiconductor element mounting package according to claim 4 , wherein the total amount of the inorganic filler (D) and the white pigment (E) is from 70 to 85 vol % with respect to the entire thermosetting light-reflecting resin composition.

8. The optical semiconductor element mounting package according to claim 1 or 2 , wherein disk flow of the thermosetting light-reflecting resin composition is at least 50 mm.

9. The optical semiconductor element mounting package according to claim 1 or 2 , wherein the coefficient of linear expansion of the thermosetting light-reflecting resin composition is 10 to 30 ppm/° C.

10. An optical semiconductor device, comprising: the optical semiconductor element mounting package according to claim 1 or 2 ; an optical semiconductor element mounted on the bottom face of a recessed part of the package; and a transparent sealing resin layer that covers the optical semiconductor element in the recessed part.

11. The optical semiconductor element mounting package according to claim 1 or 2 , wherein the second major surface of each of the positive and negative lead electrodes not in contact with the thermosetting light-reflecting resin composition is exposed at a rear face of the optical semiconductor element mounting package.

12. The optical semiconductor element mounting package according to claim 11 , wherein the positive and negative lead electrodes are not bent.

13. The optical semiconductor element mounting package according to claim 1 , wherein the thermosetting light-reflecting resin composition has an optical reflectivity at a wavelength of 350 to 800 nm of at least 80%.

14. The optical semiconductor element mounting package according to claim 1 , wherein the thermosetting light-reflecting resin composition has an optical reflectivity at a wavelength of 350 to 800 nm of at least 90%.

Assignees

• Urasaki Naoyuki
• Hitachi Chemical Co Ltd

Inventors

• Urasaki Naoyuki

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title