Apparatus and method of manufacturing semiconductor package module

Patent metadata

Field	Value
Publication number	US-9673066-B2
Application number	US-201614987490-A
Country	US
Kind code	B2
Filing date	Jan 4, 2016
Priority date	Jun 30, 2015
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

An apparatus for manufacturing a semiconductor package module and a method of manufacturing a semiconductor package are provided. The apparatus for manufacturing a semiconductor package module includes a lower mold installed thereon with a board with at least one element mounted thereon, an upper mold, in a state of accommodating the board, provided above the board, a filler supplier disposed in at least one of the upper mold and the lower mold, and supplying a filler to a molding space between the board and the upper mold, and a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part.

First claim

What is claimed is:

1. An apparatus for manufacturing a semiconductor package module, the apparatus comprising:
a lower mold installed with a board having an element mounted thereon;
an upper mold disposed above the board to accommodate the board;
a filler supplier disposed in at least one of the upper mold and the lower mold, the filler supplier supplying a filler to a molding space between the board and the upper mold; and
a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part,
wherein the pattern forming member comprises:
a main uneven pattern; and
a sub-uneven pattern smaller than the main uneven pattern and disposed in the main uneven pattern.

2. The apparatus of claim 1 , wherein the pattern forming member comprises an uneven mold pattern formed integrally with the upper mold.

3. The apparatus of claim 2 , wherein the pattern forming member comprises a coupling sheet having the uneven mold pattern and attached to the inner surface of the upper mold facing the board, the coupling sheet contacting the filler during curing of the filler to form the molded part.

4. The apparatus of claim 1 , wherein the pattern forming member comprises an uneven sheet having an uneven pattern and attached to the inner surface of the upper mold facing the board.

5. The apparatus of claim 4 , wherein the uneven sheet separates from the molded part after curing the filler.

6. The apparatus of claim 1 , wherein the pattern forming member forms the uneven pattern in such a manner that a cross-section thereof has a circular, oval, triangular, or quadrangular shape with respect to a plane perpendicular to the upper or lower mold.

7. The apparatus of claim 1 , wherein the pattern forming member forms the uneven pattern in such a manner that a cross-section thereof has a solid U shape, a solid V shape, or a needle shape with respect to the plane horizontal to the upper or lower mold.

8. An apparatus for manufacturing a semiconductor package module, the apparatus comprising:
a lower mold having an installation area to position a board having an element mounted thereon;
an upper mold having a pattern forming member, the upper mold being provided above the lower mold to form a molding space between the board and the pattern forming member during molding; and
an inlet provided in at least one of the lower mold or the upper mold, the inlet supplying a filler to the molding space during molding,
wherein the pattern forming member comprises:
a main uneven pattern; and
a sub-uneven pattern smaller than the main uneven pattern and disposed in the main uneven pattern.

9. The apparatus of claim 8 , wherein the pattern forming member is formed integrally with the upper mold.

10. The apparatus of claim 8 , wherein the pattern forming member is provided as a release sheet attached to a surface of the lower mold facing the board.

Assignees

• Samsung Electro Mech

Inventors

• Park No Il
• Park Seung Wook
• Lee Eung Suek
• Jeong Tae Sung

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10W74/017

  Auxiliary layers for moulds, e.g. release layers or layers preventing residue · CPC title

• H10W90/00

  Package configurations · CPC title