Micrometer scale components
US-9159345-B1 · Oct 13, 2015 · US
Micrometer scale components
US9672847B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9672847-B2 |
| Application number | US-201514853531-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2015 |
| Priority date | Nov 23, 2010 |
| Publication date | Jun 6, 2017 |
| Grant date | Jun 6, 2017 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
Micrometer scale components comprise a component body comprising an alloy of a first solder metal and a second solder metal, the alloy having a higher liquidus temperature than the second solder metal; and a base region of the structure body wetted to a substrate, wherein the component body has a molded surface profile.
First claim
Opening claim text (preview).
What is claimed is: 1. A micrometer scale component, comprising: a component body comprising an alloy of a first solder metal and a second solder metal, the alloy having a higher liquidus temperature than the second solder metal; and a base region of the component body wetted to a substrate, wherein the component body comprises a catoptric structure having a catoptric face with a parabolic profile. 2. The micrometer scale component of claim 1 , wherein the alloy comprises a heat sink material. 3. The micrometer scale component of claim 1 , wherein the catoptric face has an area less than about 1,000 μm 2 and the base region has an area less than about 600 μm 2 . 4. The micrometer scale component of claim 1 , wherein the component body further comprises a surface layer of a third metal, and wherein the alloy comprises an alloy of the first solder metal, the second solder metal, and the third solder metal. 5. The micrometer scale component of claim 1 , wherein the first solder metal and the second solder metal comprise In, Sn, Ag, Au, Ge, Ga, Bi, Cu, or Pb.
Assignees
Inventors
Classifications
- B22D23/06Primary
Melting-down metal, e.g. metal particles, in the mould · CPC title
the arm comprising an optical waveguide, e.g. for thermally-assisted recording · CPC title
relating to soldering or welding · CPC title
Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title
- G11B5/314Primary
where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US9672847B2 cover?
- Micrometer scale components comprise a component body comprising an alloy of a first solder metal and a second solder metal, the alloy having a higher liquidus temperature than the second solder metal; and a base region of the structure body wetted to a substrate, wherein the component body has a molded surface profile.
- Who is the assignee on this patent?
- Western Digital (Fremont) Llc
- What technology area does this patent fall under?
- Primary CPC classification B22D23/06. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).