Microfluidics sensor package fabrication method and structure

Patent metadata

Field	Value
Publication number	US-9670445-B1
Application number	US-201313793541-A
Country	US
Kind code	B1
Filing date	Mar 11, 2013
Priority date	Mar 11, 2013
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

A microfluidics sensor package includes a microfluidics sensor die having an active surface, bond pads on the active surface, and an active area on the active surface. A standoff pattern is formed on the active surface to extend to a precise height above the active surface. A lid is mounted to the standoff pattern by a lid adhesive. By using the standoff pattern to precisely space the lid above the active surface, a microfluidics cavity between the lid and the active surface is precisely created allowing for precise control of fluid flowing through the microfluidics cavity. By precisely controlling the flow of fluid through the microfluidics cavity, accurate results, e.g., of the laboratory functions performed on the fluid, are provided.

First claim

What is claimed is:

1. A structure comprising:
a sensor die comprising:
an active surface;
a bond pad at the active surface; and
an active area at the active surface;

a standoff pattern coupled to the active surface;
a lid; and
a lid adhesive coupling the lid to the standoff pattern,
wherein the sensor die comprises:
an electrically conductive through via coupled to the bond pad, the through via extending between the active surface and an inactive surface of the sensor die, the through via comprising an inactive surface terminal at the inactive surface, the structure further comprising:
a substrate; and
a flip chip bump coupling the inactive surface terminal to a terminal of the substrate.

2. The structure of claim 1 , further comprising a substrate, wherein the sensor die is a microfluidics sensor die, and an inactive surface of the microfluidics sensor die is coupled to the substrate.

3. The structure of claim 2 wherein the inactive surface of the microfluidics sensor die is coupled to a die pad of the substrate, the structure further comprising a bond wire coupling the bond pad to a lead of the substrate.

4. The structure of claim 1 , further comprising: a first fluid port, a second fluid port, and a fluid channel between the first and second fluid ports.

5. The structure of claim 1 wherein the standoff pattern comprises two bars.

6. The structure of claim 5 wherein the sensor die comprises a plurality of bond pads, wherein the bond pad is one of the plurality of bond pads, and the bars are located on the active surface between at least some of the plurality of bond pads and the active area.

7. The structure of claim 5 wherein the standoff pattern further comprises dummy bumps.

8. The structure of claim 5 wherein the standoff pattern further comprises sub-channel bars between the bars.

9. The structure of claim 8 wherein the standoff pattern further comprises diverter bars.

10. The structure of claim 9 wherein the diverter bars define a variable cavity having a varying width and the sub-channel bars define a fixed cavity having a fixed width.

11. The structure of claim 1 wherein the standoff pattern comprises bar bump columns comprising bar bumps in a line.

12. A structure comprising:
a sensor die comprising:
an active surface; and
an active area at the active surface;

a standoff pattern coupled to the active surface;
a package body comprising lid cavity sidewalls defining a lid cavity exposing the standoff pattern and the active area; and
a lid, wherein fluid ports are defined by sides of the lid and the lid cavity sidewalls,
wherein:
the standoff pattern comprises a lid surface at a height from the active surface, and
the lid comprises a planar first surface located at the height.

13. The structure of claim 12 further comprising a lid adhesive coupling the lid to the standoff pattern, wherein the lid, the lid adhesive, and the active surface define a cavity, the fluid ports extending between the cavity and an ambient environment.

14. The structure of claim 12 wherein the sensor die further comprises a bond pad at the active surface, the structure further comprising:
a substrate comprising a terminal; and
a bond wire coupling the bond pad to the terminal, wherein the package body encloses the bond pad, the bond wire, and the substrate.

15. A structure comprising:
a sensor die comprising:
an active surface;
a bond pad at the active surface; and
an active area at the active surface;

a standoff pattern coupled to the active surface;
a lid; and
a lid adhesive coupling the lid to the standoff pattern,
a substrate comprising a terminal; and
a flip chip bump coupling the bond pad to the terminal.

16. The structure of claim 15 wherein the substrate comprises lid cavity sidewalls defining a lid cavity exposing the standoff pattern and the active area, wherein fluid ports are defined by sides of the lid and the lid cavity sidewalls.

17. The structure of claim 15 wherein the substrate further comprises traces comprising the terminal and a land, the structure further comprising a conductive column coupled to the land.

18. The structure of claim 15 further comprising:
a heat sink coupled to an inactive surface of the sensor die and to the substrate.

Assignees

• Amkor Technology Inc

Inventors

• Kuo Bob Shih-Wei
• Shumway Russell Scott

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title