Readily removable film, label for in-mold molding, molded resin article having label attached thereto, wallpaper, glue label, and container having label attached thereto
US-2015375477-A1 · Dec 31, 2015 · US
Base film and pressure-sensitive adhesive sheet provided therewith
US9670382B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9670382-B2 |
| Application number | US-201214005577-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 22, 2012 |
| Priority date | Mar 22, 2011 |
| Publication date | Jun 6, 2017 |
| Grant date | Jun 6, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.
First claim
Opening claim text (preview).
The invention claimed is: 1. A pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer, comprising: a pressure-sensitive adhesive layer (C) on a base film, said base film comprising (A) a layer of a cured product in which a composition including a polyether polyol urethane (meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer, wherein a molecular weight of a polyether polyol moiety of the polyether polyol urethan(meth)acrylate oligomer is 1,000 to 10,000, wherein a compression stress at 23° C. of the pressure-sensitive adhesive sheet is 0.05 to 0.3 MPa, and wherein said pressure-sensitive adhesive layer (C) is formed on said layer (A), and wherein a weight-average molecular weight of the polyether polyol urethane (meth)acrylate oligomer is 40,000 to 100,000. 2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer (C) is re-releasable to the semiconductor wafer. 3. In combination: the pressure-sensitive adhesive sheet according to claim 1 , and a semiconductor wafer, wherein the pressure-sensitive adhesive layer (C) is laminated onto and is re-releasable to the semiconductor wafer.
Assignees
Inventors
Classifications
used to protect an active side of a device or wafer · CPC title
used during dicing or grinding · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
using UV radiation · CPC title
- C09J7/0296Primary
Chemistry & Metallurgy · mapped topic
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9670382B2 cover?
- The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a su…
- Who is the assignee on this patent?
- Tamura Kazuyuki, Akutsu Takashi, Eto Yuki, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification C09J7/0296. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).