Integrated circuit provided with a device for detecting its spatial orientation and/or a modification of this orientation

Patent metadata

Field	Value
Publication number	US-9670058-B2
Application number	US-201414501537-A
Country	US
Kind code	B2
Filing date	Sep 30, 2014
Priority date	Apr 2, 2012
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the accommodation. A monitor inside the accommodation defines a displacement area for the metal component and includes electrically conductive elements disposed at the periphery of the displacement area. The component is configured so as to, under the action of the gravity, come into contact with the two electrically conductive elements in response to a given spatial orientation of the integrated circuit. A detector is configured to detect an electrical link passing through the component and the electrically conductive elements.

First claim

What is claimed is:

1. An integrated circuit, comprising:
a substrate;
a metallization region overlying the substrate and comprising a plurality of metallization levels separated by an insulating region;
a device configured to detect a spatial orientation and/or a change in orientation of the integrated circuit, the device comprising:
an enclosure having sides comprising metal portions formed within ones of the metallization levels, wherein the sides of the enclosure comprise sidewalls, a base side and a top side;
a monitor comprising a plurality of electrically conductive elements including electrically conductive pillars extending between the base side and the top side while being electrically isolated from the sidewalls of the enclosure, the electrically conductive elements defining a displacement area; and
a metal component disposed within the enclosure, the component being mobile within the displacement area of the enclosure, wherein the component is configured to come into contact with the electrically conductive elements in response to the spatial orientation and/or the change in orientation of the integrated circuit; and
a detector configured to detect an electrical link passing through the component and the electrically conductive elements.

2. The integrated circuit according to claim 1 , wherein the metal component comprises a first block having a thickness equal to a thickness of one metallization level.

3. The integrated circuit according to claim 1 , wherein the metal component comprises two parallel blocks rigidly fixed together by a lug aligned perpendicularly to the two blocks, each block having a thickness equal to a thickness of a respective metallization level and the lug having a height equal to that of a via level between the respective metallization levels.

4. The integrated circuit according to claim 1 , wherein the sidewalls of the enclosure comprise a through-orifice.

5. The integrated circuit according to claim 1 , wherein the electrically conductive elements of the monitor define a plurality of pairs of the elements corresponding respectively to a plurality of different spatial orientations of the integrated circuit.

6. The integrated circuit according to claim 5 , wherein the detector is configured to detect an electrical link passing through the component and through at least one pair of the electrically conductive elements.

7. The integrated circuit according to claim 1 , wherein the monitor comprises a part of an edge of the component forming, with the electrically conductive elements, a guide for movement of the component.

8. The integrated circuit according to claim 1 ,
wherein the electrically conductive elements of the monitor define a plurality of pairs of the elements corresponding respectively to several different spatial orientations of the integrated circuit;
wherein the detector is configured to detect an electrical link passing through the component and through at least one pair of the electrically conductive elements;
wherein the monitor comprises a part of an edge of the component forming, with the electrically conductive elements, a guide for movement of the component; and
wherein the component comprises two scalloped parallel edges, and the pairs of electrically conductive elements comprise a plurality of pairs of pillars disposed within the scallops of the two parallel edges, the pillars of each pair being respectively situated opposite each other within the two scallops, the guide comprising the scallops and the pillars.

9. The integrated circuit according to claim 1 ,
wherein the electrically conductive elements of the monitor define a plurality of pairs of the elements corresponding respectively to several different spatial orientations of the integrated circuit;
wherein the detector is configured to detect an electrical link passing through the component and through at least one pair of the electrically conductive elements; and
wherein the component is cylindrical and the monitor comprises a plurality of electrically conductive pillars disposed around the component and forming the pairs of electrically conductive elements.

10. The integrated circuit according to claim 1 , wherein the base side of the enclosure comprises two separate metal portions and wherein the top side of the enclosure comprises two separate metal portions and wherein the component comprises two scalloped parallel edges.

11. The integrated circuit according to claim 10 , wherein the monitor comprises:
two pairs of electrically insulating pillars disposed within the scallops of the two parallel edges, the electrically insulating pillars of each pair being respectively situated opposite each other within the two scallops, the scallops and the electrically insulating pillars forming a guide for movement of the component;
the base and top sides of the enclosure;
a bar running across the enclosure between the base side and the top side parallel to these sides and between the two pairs of electrically insulating pillars, the bar forming a support axis for the component; and
the two metal portions, which respectively belong to the base and top sides and are respectively situated on either side of the support axis to form a first pair of the conductive elements, wherein the other two metal portions respectively belong to the base and top sides and are respectively situated on either side of the support axis to form a second pair of the conductive elements.

12. The integrated circuit according to claim 1 , wherein base side of the enclosure comprises two separate metal portions forming a pair of the electrically conductive elements, and wherein the top side of the enclosure comprises two separate metal portions forming another pair of the electrically conductive elements.

13. A method of forming an integrated circuit, the method comprising:
providing a semiconductor substrate with a plurality of transistors formed therein;
forming a plurality of metallization layers over the semiconductor substrate, each metallization layer separated by insulating material and structured to form an interconnect region coupled to electrically connect ones of the transistors and a MEMS device configured to detect a spatial orientation and/or a change in orientation of the integrated circuit, the MEMS device formed within an enclosure having sides comprising metal portions formed from ones of the metallization layers; and
removing at least portions of the insulating material from the enclosure so that a component of the MEMS device is movable, wherein the enclosure comprises a plurality of through-orifices and wherein removing at least portions of the insulating material comprises applying an etchant via the through-orifices.

14. The method according to claim 13 , wherein, upon completion of forming the integrated circuit, the MEMS device comprises:
the enclosure;
the component of the MEMS device that is movable;
a monitor comprising a plurality of electrically conductive elements that define a displacement area for the component, wherein the component is configured to come into contact with the electrically conductive elements in response to the spatial orientation and/or the change in orientation of the integrated circuit; and
a detector configured to detect an electrical link passing through the component of the MEMS device that is movable and the electrically conductive elements.

15. An integrated circuit, comprising:
a substrate;
a metallization region overlying the substrate and comprising a plurality of metallization levels separated by an insulating region;
a device configured to detect a

Assignees

• Stmicroelectronics Rousset

Inventors

• Di-Giacomo Antonio
• Fornara Pascal

Classifications

• B81B2201/0235

  Accelerometers · CPC title

• B81B7/02 Primary

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• B81C2203/0714

  Forming the micromechanical structure with a CMOS process · CPC title

• G01P15/135

  by making use of contacts which are actuated by a movable inertial mass · CPC title

• B81B3/0051

  For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60) · CPC title