Polishing pad and method for making the same

US9669518B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9669518-B2
Application numberUS-201414468621-A
CountryUS
Kind codeB2
Filing dateAug 26, 2014
Priority dateOct 3, 2013
Publication dateJun 6, 2017
Grant dateJun 6, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

First claim

Opening claim text (preview).

What is claimed is: 1. A polishing pad having a grinding layer, the grinding layer comprising: a plurality of fibers crossing each other to form a fiber substrate, the fineness of the fibers being 0.001 den to 6 den; and a main body being a foam and enclosing the fibers, the main body having a plurality of first pores and a plurality of second pores, the first pores being communicated with each other, the second pores being independent from each other, and the size of the first pores being at least 5 times greater than the size of the second pores, wherein the hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%, wherein the first pores are physical pores, and the second pores are foaming pores. 2. The polishing pad according to claim 1 , wherein the density of the fiber substrate is 0.05 to 0.30 g/cm 3 , and the material of the main body comprises a first component and a second component, the first component being polyuisocyanate, and the second component being a foaming agent. 3. The polishing pad according to claim 1 , wherein the main body has a grinding surface, and a portion of the fibers protrude from the grinding surface. 4. The polishing pad according to claim 1 , wherein the size of the first pores is at least 10 times greater than the size of the second pores, wherein the hardness of the grinding layer is 40 to 70 shore D, and the compression ratio thereof is 2% to 5%. 5. The polishing pad according to claim 1 , wherein the material of the fibers is selected from a group consisting of Polyamide Resin, Polyethylene Terephthalate (PET), Nylon, Polyproylene (PP), Polyester Resin, Acrylic Resin, Polyacrylonitrile Resin and composites thereof. 6. The polishing pad according to claim 1 , wherein the fibers are completely enclosed by the main body, and are not exposed in the first pores.

Assignees

Inventors

Classifications

  • Manufacture of flexible abrasive materials · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

  • B24D3/32Primary

    for porous or cellular structure · CPC title

  • Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

  • without embedded abrasive particles · CPC title

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Frequently asked questions

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What does patent US9669518B2 cover?
The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are co…
Who is the assignee on this patent?
San Fang Chemical Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification B24D3/32. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).