Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
US9668348B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9668348-B2 |
| Application number | US-201514672040-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2015 |
| Priority date | Oct 6, 2014 |
| Publication date | May 30, 2017 |
| Grant date | May 30, 2017 |
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Official abstract text for this publication.
A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.
Opening claim text (preview).
What is claimed is: 1. A multi-terminal electronic component comprising: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals; and a protection layer disposed on a surface of the resistance layer exposed from the first through third terminals, wherein the resistance layer includes a first resistor part connected to the first and second terminals and forming resistance and a second resistor part connected to the second and third terminals and forming resistance, and the first resistor part and the second resistor part are formed integrally in a single layer. 2. The multi-terminal electronic component of claim 1 , wherein the first through third terminals are not disposed on the first and second side surfaces of the base material. 3. The multi-terminal electronic component of claim 1 , wherein the first and second side surfaces of the base material are entirely exposed. 4. The multi-terminal electronic component of claim 1 , wherein the first terminal extends to a third side surface of the base material perpendicular with respect to the first and second side surfaces of the base material, and the second terminal extends to a fourth side surface of the base material opposing the third side surface of the base material. 5. The multi-terminal electronic component of claim 1 , wherein the first resistor part and the second resistor part each determine a resistance level of one of the first and second resistor parts by trimming one of the first and second resistor parts based on a resistance level of the other of the first and second resistor parts determined through trimming. 6. A board having a multi-terminal electronic component, the board comprising: a circuit board on which first through third electrode pads are disposed; and a multi-terminal electronic component disposed on the circuit board, wherein the multi-terminal electronic component disposed on the circuit board includes a base material, a resistance layer disposed on a surface of the base material, a first terminal and a second terminal spaced apart from each other while covering portions of the resistance layer, respectively, and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, first and second side surfaces of the base material opposing each other are exposed from the first through third terminals, and a protection layer disposed on a surface of the resistance layer exposed from the first through third terminals, wherein the resistance layer includes a first resistor part connected to the first and second terminals and forming resistance and a second resistor art connected to the second and third terminals and forming resistance, and the first resistor part and the second resistor part are formed integrally in a single layer. 7. The board having a multi-terminal electronic component of claim 6 , wherein the first through third terminals are not disposed on the first and second side surfaces of the base material. 8. The board having a multi-terminal electronic component of claim 6 , wherein the first and second side surfaces of the base material are entirely exposed. 9. The board having a multi-terminal electronic component of claim 6 , wherein the first terminal extends to a third side surface of the base material perpendicular with respect to the first and second side surfaces of the base material, and the second terminal extends to a fourth side surface of the base material opposing the third side surface of the base material. 10. The board having a multi-terminal electronic component of claim 6 , wherein the first resistor part and the second resistor part each determine a resistance level of one of the first and second resistor parts by trimming one of the first and second resistor parts based on a resistance level of the other of the first and second resistor parts determined through trimming.
Cross-Sectional Technologies · mapped topic
the terminals or tapping points being coated on the resistive element · CPC title
Leadless chip, e.g. chip capacitor or resistor · CPC title
Non-printed resistor · CPC title
associated with surface mounted components · CPC title
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