Flexible printed circuit board and circuit-board connection structure

Patent metadata

Field	Value
Publication number	US-9668346-B2
Application number	US-201314037645-A
Country	US
Kind code	B2
Filing date	Sep 26, 2013
Priority date	Sep 27, 2012
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad.

First claim

What is claimed is:

1. A flexible printed circuit board having a multilayer structure in which first, second, and third conductor layers are stacked with a dielectric layer therebetween, the flexible printed circuit board comprising:
a terminal portion configured to obtain an electrical connection with a printed circuit board; and
a transmission line portion having a transmission line to be connected to the printed circuit board through the terminal portion formed therein, wherein
the transmission line is formed of a ground layer formed in the first conductor layer and a signal line formed in the second conductor layer in parallel with the ground layer,
the terminal portion includes
a first signal pad that is formed in the first conductor layer and is electrically separated from the ground layer,
a pair of first ground pads that is formed in the first conductor layer and is arranged such that the first ground pads sandwich the first signal pad from both sides thereof,
a second signal pad that is formed in the second conductor layer such that the second signal pad is connected to the signal line,
a pair of second ground pads that is formed in the second conductor layer, is electrically separated from the signal line, and is arranged such that the second ground pads sandwich the second signal pad from both sides thereof,
a third signal pad that is formed in the third conductor layer,
a pair of third ground pads that is formed in the third conductor layer and is arranged such that the third ground pads sandwich the third signal pad from both sides thereof,
a ground via that connects the first ground pads, the second ground pads, and the third ground pads with each other, and
a signal via that connects the first signal pad, the second signal pad, and the third signal pad with each other,

the pairs of first, second, and third ground pads are electrically connected to the ground layer, and
the second signal pad is wider than the third signal pad.

2. The flexible printed circuit board according to claim 1 , wherein the transmission line is a differential line including two signal lines.

3. The flexible printed circuit board according to claim 1 , wherein the second signal pad is wider than the signal line, and a width of a conductor between the second signal pad and the signal line changes continuously.

4. The flexible printed circuit board according to claim 1 , wherein the first signal pad and the third signal pad are formed not to protrude from the second signal pad.

5. The flexible printed circuit board according to claim 1 , wherein the dielectric layer formed between the second conductor layer and the third conductor layer is thinner than the dielectric layer formed between the first conductor layer and the second conductor layer.

6. The flexible printed circuit board according to claim 1 , wherein the ground layer is partially removed at a plurality of positions.

7. The flexible printed circuit board according to claim 1 , wherein the flexible printed circuit board is a multilayer circuit board including five or more layers.

8. The flexible printed circuit board according to claim 1 , wherein
the first signal pad and the third signal pad have a same shape, and the pair of first ground pads and the pair of third ground pads have a same shape, and
the transmission line portion includes a ground layer having a same shape as the ground layer formed in the first conductor layer, in the third conductor layer.

9. The flexible printed circuit board according to claim 1 , wherein the transmission line portion has no conductor formed in the third conductor layer.

10. The flexible printed circuit board according to claim 1 , wherein the ground layer is wider than the signal line.

11. The flexible printed circuit board according to claim 10 , wherein
the pair of first ground pads extends to the transmission line portion, and the pair of first ground pads and the ground layer are connected to each other in the first conductor layer, and
each of the first ground pads is wider than each of the third ground pads and is arranged such that the pair of first ground pads projects toward the first signal pad.

12. The flexible printed circuit board according to claim 10 , wherein
the pair of second ground pads extends to the transmission line portion,
the transmission line portion includes a transmission-line-portion ground via that connects the pair of second ground pads and the ground layer, and
each of the second ground pads is wider than each of the first ground pads and each of the third ground pads and is arranged such that the pair of second ground pads projects toward the second signal pad.

13. The flexible printed circuit board according to claim 1 , further comprising a fourth conductor layer that is stacked on a side of the first conductor layer with a dielectric layer therebetween, the side being opposite to a side on which the second conductor layer is stacked, wherein
the terminal portion includes
a fourth signal pad that is formed in the fourth conductor layer and is connected to the first signal pad, the second signal pad, and the third signal pad through the signal via, and
a pair of fourth ground pads that is formed in the fourth conductor layer and is connected to the pair of first ground pads, the pair of second ground pads, and the pair of third ground pads through the ground via, and

an interval between the pair of fourth ground pads and the fourth signal pad is larger than an interval between the pair of first ground pads and the first signal pad.

14. A circuit-board connection structure comprising:
a printed circuit board having a multilayer structure in which first and second printed-circuit-board conductor layers are provided to be stacked with a printed-circuit-board dielectric layer therebetween; and
the flexible printed circuit board according to claim 1 , wherein
the printed circuit board and the flexible printed circuit board are connected to each other,
the printed circuit board includes
a printed-circuit-board terminal portion configured to obtain an electrical connection with the flexible printed circuit board, and
a printed-circuit-board transmission line portion having a printed-circuit-board transmission line to be connected to the flexible printed circuit board through the printed-circuit-board terminal portion formed therein,

the printed-circuit-board transmission line is formed of a printed-circuit-board signal line and a printed-circuit-board ground layer,
the printed-circuit-board terminal portion includes
a printed-circuit-board signal pad that is formed in the first printed-circuit-board conductor layer and is connected to the printed-circuit-board signal line, and
a pair of printed-circuit-board ground pads that is formed in the first printed-circuit-board conductor layer such that the printed-circuit-board ground pads sandwich the printed-circuit-board signal pad from both sides thereof and is connected to the printed-circuit-board ground layer, and

the printed-circuit-board signal pad and the third signal pad are electrically connected, and the pair of printed-circuit-board ground pads and the pair of third ground pads are electrically connected.

15. A circuit-board connection structure comprising:
a printed circuit board having a multilayer structure in which first and second printed-circuit-board conductor layers are provided to be stacked with a printed-circuit-board dielectric layer therebetween; and
the flexible printed circuit board according to claim 1 , wherein
the printed circuit board and the flexible printed circuit board are

Assignees

• Mitsubishi Electric Corp

Inventors

• Shirao Mizuki
• Ohata Nobuo
• Yasui Nobuyuki
• Aruga Hiroshi

Classifications

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H05K2201/0969

  Apertured conductors · CPC title

• H05K2201/09727

  Varying width along a single conductor; Conductors or pads having different widths · CPC title

• H05K2201/09609

  Via grid, i.e. two-dimensional array of vias or holes in a single plane · CPC title

• H01P3/081

  Microstriplines · CPC title