Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Patent metadata

Field	Value
Publication number	US-9666746-B2
Application number	US-201214126366-A
Country	US
Kind code	B2
Filing date	Jun 14, 2012
Priority date	Jun 14, 2011
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; and a method for producing a collector sheet for solar cells, said method using the conductive base. A conductive base for forming a wiring pattern of a collector sheet for solar cells, which is a conductive base ( 30 ) wherein a zinc layer ( 320 ) composed of zinc is formed on the surface of a copper foil ( 310 ), is used. The conductive base for forming a wiring pattern of a collector sheet for solar cells is characterized in that the zinc layer ( 320 ) does not contain chromium and the amount of zinc therein is more than 20 mg/m 2 but 40 mg/m 2 or less.

First claim

The invention claimed is:

1. A collector sheet for solar cells,
wherein a zinc layer with an adhesion amount of more than 25 mg/m 2 but 30 mg/m 2 or less is formed on a glossy surface of an electrolytic copper foil having a thickness of 10 μm to 35 μm and the electrolytic copper foil having a glossy surface and a rough surface having a relatively larger surface roughness than the glossy surface, and
chrome is not contained in any layer formed on the glossy surface of the electrolytic copper foil, and
a resin base is joined onto the rough surface of the electrolytic copper foil.

2. The collector sheet according to claim 1 , wherein one or more function reinforcing layers containing no chrome are further formed on the zinc layer.

3. A method for producing a collector sheet for solar cells comprising:
a laminating step by which the conductive base according to claim 1 is laminated with a resin base to obtain a laminate;
an etching step by which an etching mask patterned to have a desired wiring pattern shape is formed on the surface of the laminate followed by an etching treatment to remove the conductive base in an area not covered with the etching mask; and
a peeling step by which the etching mask is removed after the etching step by using an alkaline peeling liquid,
wherein by removing a part of the surface of the zinc layer with peeling of the etching mask by using the alkaline peeling liquid during the peeling step, a rust inhibiting protection layer in which the adhesion amount of zinc is more than 0.5 mg/m 2 but 20 mg/m 2 or less is formed on the surface of the wiring pattern.

4. The method of claim 3 , comprising a laminating step by which the conductive base according to claim 1 is laminated with a resin base to obtain a laminate.

5. The method of claim 3 , comprising a laminating step by which the conductive base according to claim 2 is laminated with a resin base to obtain a laminate.

Assignees

• Komai Takayuki
• Emoto Satoshi
• Dainippon Printing Co Ltd

Inventors

• Komai Takayuki
• Emoto Satoshi

Classifications

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• C25D3/22

  of zinc · CPC title

• C25D7/0607

  Wires · CPC title

• Y10T428/12792

  Zn-base component · CPC title

• C23C30/00 Primary

  Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence) · CPC title