Power semiconductor module

Patent metadata

Field	Value
Publication number	US-9666395-B2
Application number	US-201414903713-A
Country	US
Kind code	B2
Filing date	May 16, 2014
Priority date	Jul 10, 2013
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module ( 1 ) is provided with a substrate ( 2 ), relay terminals ( 9, 10 ), external connecting terminals ( 13, 14 ) and a relay terminal holding member ( 6 ). The relay terminals ( 9, 10 ) are connected to the substrate ( 2 ) with a solder ( 4 ) therebetween. The external connecting terminals ( 13, 14 ) are bonded to the relay terminals ( 9, 10 ), respectively. The non-conductive relay terminal holding member ( 6 ) holds end portions of the relay terminals ( 9, 10 ) said end portions being on the side bonded to the solder ( 4 ).

First claim

The invention claimed is:

1. A power semiconductor module comprising:
a substrate;
a relay terminal connected to the substrate via a solder;
an external connecting terminal joined to the relay terminal and in direct contact with the relay terminal;
a non-conductive relay terminal holding member to hold an end portion of the relay terminal on a side of a joined surface with the solder;
a non-conductive external connecting terminal holding member to hold the external connecting terminal; and
an intermediate member disposed between the substrate and the external connecting terminal holding member,
wherein the relay terminal holding member includes:
a first engagement section engaged with a jig that fixes the substrate at time of connecting the relay terminal and the substrate by soldering;
a fitting section fitted with the relay terminal,
the fitting section positions the relay terminal so as to be defined in a positional relationship that allows the relay terminal and the external connecting terminal to be joined with each other,
the intermediate member has a second engagement section engaged with the substrate, and
the external connecting terminal holding member has a third engagement section engaged with the intermediate member.

2. The power semiconductor module according to claim 1 , wherein
the substrate and the relay terminal holding member are stacked, and
the substrate, the intermediate member, and the external connecting terminal holding member are stacked.

3. The power semiconductor module according to claim 1 , wherein the intermediate member is disposed in direct contact with the substrate and the external connecting terminal holding member.

4. The power semiconductor module according to claim 1 , wherein the second engagement section includes a projecting portion that projects from a bottom surface of the intermediate member and engages with the substrate.

5. The power semiconductor module according to claim 1 , wherein the third engagement section includes a recessed portion into which a projecting portion that projects from an upper surface of the intermediate member and engages with the external connecting terminal holding member.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Watari Shinjiro
• Kokubun Shuichi
• Yamada Takeshi
• Harada Tsuyoshi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• F02N15/067

  the starter comprising an electro-magnetically actuated lever · CPC title

• H05K2201/1031

  Surface mounted metallic connector elements · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• F02N11/087 Primary

  Details of the switching means in starting circuits, e.g. relays or electronic switches · CPC title