Laser microdissection method and laser microdissection device

Patent metadata

Field	Value
Publication number	US-9664599-B2
Application number	US-201214005575-A
Country	US
Kind code	B2
Filing date	Mar 21, 2012
Priority date	Mar 22, 2011
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

First claim

The invention claimed is:

1. A method for laser microdissection, comprising:
adjusting at least one first system parameter of a laser microdissection system, and
automatically adjusting at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection is present;
wherein the cut line parameter is selected from the group comprising a cut width and a parameter describing an interruption freeness of the cut line.

2. The method of claim 1 , further comprising:
initial adjusting of the at least one first system parameter and the at least one second system parameter such that the desired value of the cut line parameter is present,
wherein adjusting of the at least one first system parameter comprises a varying of the at least one first system parameter from a value of the initial adjusting, and
wherein the automatic adjustment of the at least one second system parameter takes place such that the desired cut line parameter is kept constant at least within a predetermined range.

3. The method of claim 2 , further comprising a confirming of the cut line parameter as to be kept to be constant after the initial adjusting.

4. The method of claim 2 , further comprising using a slower cutting speed in conjunction with the initial adjusting, and then using a higher cutting speed for actual cutting of the sample.

5. The method of claim 1 , further comprising cutting of a biologic object with the at least one first system parameter and the at least one second system parameter.

6. The method of claim 1 , wherein the at least one first system parameter is selected from a group comprising an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

7. The method of claim 1 , wherein the at least one second parameter is selected from a group comprising an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

8. The method of claim 1 , wherein the automatically adjusting takes place depending on at least one characteristic curve, which describes a dependency of the at least one second parameter from the at least one first system parameter with at least one predetermined cut line parameter.

9. The method of claim 1 , wherein the adjusting of the at least one first system parameter comprising an adjusting of a laser energy and/or a repetition rate of a laser, and wherein the automatic adjusting of at least one second parameter comprises an adjusting of the cutting speed such that a resulting cut line is free of interruptions.

10. The method of claim 1 , wherein adjusting of the at least one first system parameter comprises an increasing of a cutting speed.

11. The method of claim 1 , wherein the adjusting of the at least one first system parameter is performed by a user of the laser microdissection system.

12. A laser microdissection system, comprising:
a laser device,
a receiving device for a sample to be treated, and
a control device, wherein the control device is configured to enable an adjusting of at least one first system parameter of the laser microdissection system and further to automatically adjust at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection system is obtained;
wherein the cut line parameter describes an interruption freeness of the cut line.

13. The system of claim 12 , further comprising a user interface for adjusting the at least one first system parameter.

14. The system of claim 12 , the system being configured to allow:
an initial adjusting of the at least one first system parameter and the at least one second system parameter such that the desired value of the cut line parameter is present,
wherein adjusting of the at least one first system parameter comprises a varying of the at least one first system parameter from a value of the initial adjusting, and
wherein the control device is configured such that the automatic adjustment of the at least one second system parameter takes place such that the desired cut line parameter is kept constant at least within a predetermined range.

15. The system of claim 12 , wherein the control device is configured such that the automatically adjusting takes place depending on at least one characteristic curve, which describes a dependency of the at least one second parameter from the at least one first system parameter with at least one predetermined cut line parameter.

16. The system of claim 12 , wherein the at least one first system parameter is selected from a group consisting of an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

17. The system of claim 12 , wherein the at least one second parameter is selected from a group consisting of an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

18. The system of claim 12 , wherein the control device is configured to adjust at least one of a laser energy and a repetition rate as adjustment of the at least one second system parameter in response to an increasing of a cutting speed as the adjusting of the at least one first system parameter.

19. A laser microdissection system, comprising:
a laser device,
a receiving device for a sample to be treated, and
a control device, wherein the control device is configured to enable an adjusting of at least one first system parameter of the laser microdissection system and further to automatically adjust at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection system is obtained;
wherein the cut line parameter is the cut width of the cut line.

Assignees

• Gögler Michael
• Zeiss Carl Microscopy Gmbh

Inventors

• Gögler Michael

Classifications

• G01N2001/2886

  Laser cutting, e.g. tissue catapult · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K2103/30

  Organic materials · CPC title

• G05B2219/45041

  Laser cutting · CPC title

• G01N1/286 Primary

  involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising (microtomes G01N1/06; pulverising in general B02C; mixing in general B01F) · CPC title