Magnetic field sensor with immunity to external magnetic influences

Patent metadata

Field	Value
Publication number	US-9664494-B2
Application number	US-201313891519-A
Country	US
Kind code	B2
Filing date	May 10, 2013
Priority date	May 10, 2013
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

A magnetic field sensor with enhanced immunity to external magnetic interference is presented. Included is a magnetic field signal generator and a demodulator. The magnetic field signal generator produces a magnetic field signal having a modulated signal portion in a first frequency band based on a sensed modulated AC bias magnetic field. The modulated AC bias magnetic field is produced by movement of ferromagnetic target relative to a bias coil when an AC signal is applied to the bias coil. When the magnetic field signal also includes an unwanted signal portion in a second frequency band based on external magnetic interference, demodulation performed by the demodulator results in the modulated signal portion being shifted from the first frequency band to a third frequency band and the unwanted signal portion being shifted to the first frequency band. The bias coil may be provided as part of the magnetic field sensor.

First claim

What is claimed is:

1. A magnetic field sensor comprising:
a coil driver circuit to generate an AC signal;
an AC bias coil coupled to the coil driver circuit to receive the AC signal and to generate an AC bias magnetic field modulated by movement of a ferromagnetic target having a target profile pattern with respect to the AC bias coil;
a magnetic field signal generator comprising at least one sensing element to produce, by sensing the modulated AC bias magnetic field, a magnetic field signal indicative of the movement of the ferromagnetic target, the magnetic field signal having a modulated signal portion in a first frequency band based on the sensed modulated AC bias magnetic field and an unwanted signal portion in a second frequency band based on sensing an external magnetic interference;
circuitry including a demodulator to perform a demodulation of the magnetic field signal, wherein the magnetic field signal generator and circuitry are provided on a semiconductor die, further comprising a package that includes a lead frame coupled to the semiconductor die and located between the semiconductor die and the AC bias coil, and further includes a mold portion to enclose the semiconductor die, at least a portion of the lead frame and the AC bias coil together; and
wherein the demodulation results in the modulated signal portion being shifted from the first frequency band to a third frequency band and the unwanted signal portion being shifted to the first frequency band from the second frequency band.

2. The magnetic field sensor of claim 1 , wherein the third frequency band comprises DC.

3. The magnetic field sensor of claim 1 , wherein the demodulator further includes a filter to remove the unwanted signal portion from the magnetic field signal after the unwanted signal portion has been shifted to the first frequency band.

4. The magnetic field sensor of claim 3 , wherein the circuitry produces a sensor output signal based on the magnetic field signal after demodulation.

5. The magnetic field sensor of claim 1 , wherein the coil driver is coupled between a supply input and the AC bias coil, to provide the AC signal to the AC bias coil.

6. The magnetic field sensor of claim 5 , further comprising a frequency select input, coupled to the coil driver, to allow the frequency of the AC signal to be adjusted by an external application.

7. The magnetic field sensor of claim 5 , further comprising a frequency controller, coupled to the coil driver, to provide a frequency select signal based on a frequency selection to the coil driver for adjusting the frequency of the AC signal.

8. The magnetic field sensor of claim 7 , wherein the frequency controller is configured to receive the magnetic field signal after demodulation following multiple frequency adjustments, and modify the frequency selection in response thereto.

9. The magnetic field sensor of claim 1 , wherein a frequency at which the AC bias magnetic field is generated is set so that the first frequency band excludes frequencies associated with the magnetic interference in the second frequency band.

10. The magnetic field sensor of claim 1 , wherein the AC bias coil comprises a solenoid type coil.

11. The magnetic field sensor of claim 10 , wherein the solenoid type coil comprises a soft ferromagnetic core to concentrate the AC bias magnetic field.

12. The magnetic field sensor of claim 1 , wherein the mold portion comprises a first mold portion to enclose the die and at least a portion of the lead frame and a second mold portion to enclose the AC bias coil.

13. The magnetic field sensor of claim 12 , wherein the second mold portion comprises a ferromagnetic mold material.

14. The magnetic field sensor of claim 1 , wherein the at least one sensing element is a selected one of a Hall-effect element, magnetoresistance (MR) element or other type of magnetic field sensitive element.

15. The magnetic field sensor of claim 14 , wherein material used to implement the at least one sensing element is a selected one of type IV semiconductor material or a type III-V semiconductor material.

16. A magnetic field sensor comprising:
a coil driver circuit to generate an AC signal;
an AC bias coil coupled to the coil driver circuit to receive the AC signal and to generate an AC bias magnetic field modulated by movement of a ferromagnetic target having a target profile pattern with respect to the AC bias coil;
a magnetic field signal generator comprising at least one sensing element to produce, by sensing the modulated AC bias magnetic field, a magnetic field signal indicative of the movement of the ferromagnetic target, the magnetic field signal having a modulated signal portion in a first frequency band based on the sensed modulated AC bias magnetic field and an unwanted signal portion in a second frequency band based on sensing an external magnetic interference;
circuitry including a demodulator to perform a demodulation of the magnetic field signal, wherein the demodulation results in the modulated signal portion being shifted from the first frequency band to a third frequency band and the unwanted signal portion being shifted to the first frequency band from the second frequency band; and
wherein the AC bias coil, magnetic field signal generator and circuitry are provided on a semiconductor die.

17. The magnetic field sensor of claim 16 , wherein the AC bias coil comprises a planar spiral coil.

18. The magnetic field sensor of claim 17 , wherein the sensing element comprises at least one spin-valve, AMR, GMR, TMR, or MTJ type sensing element.

19. The magnetic field sensor of claim 17 , further comprising wherein the coil driver is coupled between a supply input and the AC bias coil, to provide the AC signal to the AC bias coil.

20. A method, comprising:
providing an AC signal to an AC bias coil by a coil driver circuit coupled to the AC bias coil;
generating with the AC bias coil an AC bias magnetic field modulated by movement of a ferromagnetic target having a target profile pattern with respect to the AC bias coil;
producing, by a magnetic field signal generator sensing the modulated AC bias magnetic field, a magnetic field signal indicative of the movement of the ferromagnetic target having the target profile pattern, the magnetic field signal comprising a modulated signal portion in a first frequency band based on sensing the modulated AC bias magnetic field and an unwanted signal portion in a second frequency band based on sensing an external magnetic interference; and
performing, by circuitry, a demodulation of the magnetic field signal to shift the modulated signal portion from the first frequency band to a third frequency band and the unwanted signal portion to the first frequency band from the second frequency band, wherein the magnetic field signal generator and circuitry are provided on a semiconductor die, further comprising a package that includes a lead frame coupled to the semiconductor die and located between the semiconductor die and the AC bias coil, and further includes a mold portion to enclose the semiconductor die, at least a portion of the lead frame and the AC bias coil together.

21. The method of claim 20 , wherein the third frequency band comprises DC.

22. The method of claim 20 , wherein performing the demodulation further comprises filtering to remove the unwanted signal portion from the magnetic field signal after the unwanted signal portion has been shifted to the first frequency band.

23.

Assignees

• Allegro Microsystems Llc

Inventors

• Fernandez Devon
• David Paul
• Taylor William P

Classifications

• G01B7/003 Primary

  for measuring position, not involving coordinate determination (coordinate measuring G01B7/004) · CPC title

• G01R33/0023 Primary

  Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration (G01R33/0017 takes precedence) · CPC title