Optoelectronic component device, method of producing an optoelectronic component device, and method of operating an optoelectronic component device, method of operating an optoelectronic device having improved emission characteristics

Patent metadata

Field	Value
Publication number	US-9664342-B2
Application number	US-201314432007-A
Country	US
Kind code	B2
Filing date	Sep 24, 2013
Priority date	Sep 27, 2012
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.

First claim

The invention claimed is:

1. An optoelectronic component device comprising:
a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation;
a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation;
wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector;
the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device;
the optoelectronic component device has an emission characteristic that is a field distribution;
a configuration of the reflector sets the emission characteristic of the electromagnetic radiation in the image plane of the optoelectronic device, and
the optoelectronic components provide the electromagnetic radiation and are chip-on-board light emitting diodes.

2. The optoelectronic component device as claimed in claim 1 , wherein the optoelectronic components comprise a semiconductor chip or are designed as a semiconductor chip, wherein the semiconductor chip absorbs and/or provides electromagnetic radiation.

3. The optoelectronic component device as claimed in claim 2 , wherein the optoelectronic component comprises a light emitting diode or is designed as a light emitting diode.

4. The optoelectronic component device as claimed in claim 1 , wherein the plurality of optoelectronic components differ in at least one optoelectronic property selected from color valence and/or intensity of the provided and/or absorbed electromagnetic radiation.

5. The optoelectronic component device as claimed in claim 1 , wherein the predefined field distribution comprises homogenizing, changing the color valence and/or forming a predefined shape of the field distribution of the provided electromagnetic radiation in the image plane of the optoelectronic component device.

6. The optoelectronic component device as claimed in claim 1 , wherein the optoelectronic component device physically connects to a further optoelectronic component device.

7. The optoelectronic component device as claimed in claim 1 , furthermore comprising a housing which at least partly surrounds the plurality of optoelectronic components and the reflector, wherein the reflector is applied on the base of the housing and/or the base of the housing is designed as a reflector.

8. The optoelectronic component device as claimed in claim 6 , wherein further optoelectronic components are applied on or above the base of the housing.

9. The optoelectronic component device as claimed in claim 1 , wherein the reflector has a cavity with electronic components arranged in the cavity, and the electronic components control the field distribution of the electromagnetic radiation in the image plane of the optoelectronic component device.

10. The optoelectronic component device as claimed in claim 1 , wherein one optoelectronic component or a plurality of optoelectronic components comprise a wavelength-converting structure in the beam path of the provided electromagnetic radiation, the wavelength-converting structure being designed as remote phosphor.

11. An optoelectronic component device comprising:
at least one optoelectronic component that provides and/or takes up electromagnetic radiation;
a reflector arranged in a beam path of the electromagnetic radiation of the at least one optoelectronic component and has a surface that is at least partly reflective with respect to the provided electromagnetic radiation;
wherein the reflector has a reflective surface formed in a locally variable fashion;
the optoelectronic component device has an emission characteristic that is a field distribution;
a configuration of the reflector sets the emission characteristic of the electromagnetic radiation in the image plane of the optoelectronic device, and
the optoelectronic components provide the electromagnetic radiation and are chip-on-board light emitting diodes.

12. The optoelectronic component device as claimed in claim 11 , further configured to alter the local shape of the reflective surface of the reflector with:
a device that moves the reflector by lifting, lowering and/or rotating the reflector;
a device that alters local angles of incidence which is piezo-operated and/or microelectromechanical, facet-like reflective surface segments; and/or
a reflector composed of an elastic substance and a device that elastically changes the shape of the reflector which is a mechanical spring and/or a device that changes the tensile force and/or the compressive force on a reflector and/or a device that changes pressure in the reflector.

13. A method of producing an optoelectronic component device comprising:
forming an arrangement comprising a plurality of optoelectronic components and a reflector such that the optoelectronic components at least partly surround the reflector;
wherein the plurality of optoelectronic components provide and/or take up electromagnetic radiation;
the reflector is arranged in the beam path of the electromagnetic radiation of the optoelectronic components,
the reflector has a surface at least partly reflective with respect to the provided electromagnetic radiation;
the reflector and/or the optoelectronic components are/is arranged for indirect illumination of the image plane of the optoelectronic component device;
the optoelectronic component device has an emission characteristic that is a field distribution;
a configuration of the reflector sets the emission characteristic of the electromagnetic radiation in the image plane of the optoelectronic device, and
the optoelectronic components provide the electromagnetic radiation and are chip-on-board light emitting diodes.

14. The method as claimed in claim 13 , wherein an optoelectronic component comprises a semiconductor chip or is formed as a semiconductor chip, and the semiconductor chip absorbs and/or provides electromagnetic radiation.

15. The method as claimed in claim 13 , wherein forming an arrangement comprises applying or forming a plurality of optoelectronic components on or above a substrate, and the substrate is mechanically flexible, wherein forming an arrangement comprises at least one process with respect to the substrate selected from: bending; folding; rolling; curving; setting up; and erecting.

16. A method of operating an optoelectronic component device comprising:
providing a field distribution of electromagnetic radiation in an image plane of an optoelectronic component device, wherein the field distribution of electromagnetic radiation is provided and/or absorbed by a plurality of optoelectronic components of the optoelectronic component device, and
changing the field distribution of the electromagnetic radiation in the image plane of the optoelectronic component device,
wherein 1) a reflector having a variable shape is formed in the component device in the beam path of the electromagnetic radiation of the optoelectronic component,
2) the step of changing the field distribution comprises altering an angle of incidence of the electromagnetic radiation relative to the reflective surface of the reflector,
3) the step of changing the angle of incidence is formed by changing the shape of the reflective surface of the reflector,
4) the optoelectronic component device has an emission characteristic that is a field distribut

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Kaiser Stephan
• Albrecht Tony
• Bestele Michael
• Marfeld Jan
• Schneider Albert
• Kirsch Markus

Classifications

• H10W90/00

  Package configurations · CPC title

• G01J1/0414

  using plane or convex mirrors, parallel phase plates, or plane beam-splitters · CPC title

• G01J1/42

  using electric radiation detectors (optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10) · CPC title

• G01J1/4228

  arrangements with two or more detectors, e.g. for sensitivity compensation · CPC title

• F21V14/04 Primary

  by movement of reflectors {(in vehicle head lamps F21S41/675)} · CPC title