Stress isolated differential pressure sensor

Patent metadata

Field	Value
Publication number	US-9663350-B2
Application number	US-201414569068-A
Country	US
Kind code	B2
Filing date	Dec 12, 2014
Priority date	Dec 12, 2014
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

A package includes a MEMS die and a cap element coupled to and stacked with the MEMS die. The MEMS die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure. A first pressure sensor is vented to a first external environment via a first vent extending through the bottom of the MEMS die and is adapted to detect a first pressure of the first external environment. The MEMS die can be coupled to a lead frame having an opening that is aligned with the first vent. A second sensor is vented to a second external environment via a second vent extending through the cap element and is adapted to detect a second pressure of the second external environment. A difference between the first and second pressures is the differential pressure.

First claim

What is claimed is:

1. A package comprising:
a microelectromechanical systems (MEMS) die including:
a substrate having a first recess and a second recess formed therein, said substrate having a first vent extending through said substrate to said first recess;
a first cantilevered platform structure is suspended over said first recess;
a second cantilevered platform structure is suspended over said second recess;
a first MEMS device residing on said first cantilevered platform structure; and
a second MEMS device residing on said second cantilevered platform structure; and

a cap element coupled to and in a stacked relationship with said first and second cantilevered platform structures, said cap element being spaced apart from said MEMS die to provide a first clearance space between said first MEMS device and said cap element, and to provide a second clearance space between said second MEMS device and said cap element, said cap element having a second vent extending through said cap element to said second clearance space.

2. The package of claim 1 further comprising a seal feature physically isolating said second MEMS device from said first MEMS device.

3. The package of claim 1 wherein said substrate does not have another vent extending through said substrate to said second recess.

4. The package of claim 1 wherein said cap element does not have another vent extending through said cap element to said first clearance space.

5. The package of claim 1 wherein said cap element comprises an integrated circuit (IC) die.

6. The package of claim 5 further comprising a through-via extending through said IC die, said through-via being electrically interconnected with said MEMS die.

7. The package of claim 6 further comprising an electrical contact provided on an outer surface of said IC die, wherein said through-via is electrically connected with said electrical contact.

8. The package of claim 5 wherein said second vent extending through said IC die is laterally displaced away from said through-via.

9. The package of claim 1 further comprising a structural layer fixed to a surface of said substrate surrounding each of said first and second recesses, wherein:
said first cantilevered platform structure includes a first platform and a first arm extending from said first platform, said first MEMS device residing on said first platform, and said first arm being a sole attachment point of said first platform to said substrate surrounding said first recess; and
said second cantilevered platform structure includes a second platform and a second arm extending from said second platform, said second MEMS device residing on said second platform, and said second arm being a sole attachment point of said second platform to said substrate surrounding said second recess.

10. The package of claim 1 wherein said MEMS die comprises a differential pressure sensor die, said first MEMS device comprises a first sensor element residing on said first cantilevered platform structure and adapted to detect a first pressure, and said second MEMS device comprises a second sensor element residing on said second cantilevered platform structure and adapted to detect a second pressure.

11. A package comprising:
a microelectromechanical systems (MEMS) pressure sensor die including:
a substrate having a first recess and a second recess formed therein, said substrate having a first vent extending through said substrate to said first recess;
a first cantilevered platform structure suspended over said first recess;
a second cantilevered platform structure suspended over said second recess;
a first pressure sensor element residing on said first cantilevered platform structure; and
a second pressure sensor element residing on said second cantilevered platform structure;

a lead frame having a die attach platform in which an opening is formed, wherein a back side of said substrate is coupled to said die attach platform with said first vent in fluid communication with said opening; and
a cap element coupled to and in stacked relationship with said first and second cantilevered platform structures, said cap element being spaced apart from said MEMS pressure sensor die to provide a first clearance space between said first pressure sensor element and said cap element, and to provide a second clearance space between said second pressure sensor element and said cap element, said cap element having a second vent extending through said cap element to said second clearance space.

12. The package of claim 11 wherein:
said first pressure sensor element is vented to a first external environment via said first vent in said substrate and is adapted to detect a first pressure of said first external environment; and
said second pressure sensor element is vented to a second external environment via said second vent in said cap element and is adapted to detect a second pressure of said second external environment.

13. The package of claim 11 further comprising a seal feature physically isolating said second pressure sensor element from said first pressure sensor element.

14. The package of claim 11 wherein:
said substrate does not have another vent extending through said substrate to said second recess; and
said cap element does not have another vent extending through said cap element to said first clearance space.

15. The package of claim 11 wherein said cap element comprises an integrated circuit (IC) die, said second vent extends through said IC die.

16. The package of claim 15 wherein said IC die includes a through-via extending through said IC die, said through-via being laterally displaced away from said second vent, and said through-via being electrically interconnected with said MEMS die.

17. The package of claim 11 further comprising a structural layer fixed to a surface of said substrate surrounding each of said first and second recesses, wherein:
said first cantilevered platform structure includes a first platform and a first arm extending from said first platform, said first MEMS device residing on said first platform, and said first arm being a sole attachment point of said first platform to said substrate surrounding said first recess; and
said second cantilevered platform structure includes a second platform and a second arm extending from said second platform, said second MEMS device residing on said second platform, and said second arm being a sole attachment point of said second platform to said substrate surrounding said second recess.

18. The differential pressure sensor of claim 11 further comprising a molded body formed at least partially around said pressure sensor die, said lead frame, and said cap element without covering said first and second vents.

19. A method of making a MEMS differential pressure sensor package comprising:
providing a MEMS die, said MEMS die including a substrate, a first cantilevered platform structure, a second cantilevered platform structure, a first MEMS device, and a second MEMS device, said substrate having first and second recesses formed therein, said substrate having a first vent extending through said substrate to said first recess, said first cantilevered platform structure being suspended over said first recess, said second cantilevered platform structure being suspended over said second recess, said first MEMS device residing on said first cantilevered platform structure, and said second MEMS device residing on said second cantilevered platform structure;
coupling a cap element to said MEMS die in a stack

Assignees

• Freescale Semiconductor Inc
• Nxp Usa Inc

Inventors

• Hooper Stephen R
• Dawson Chad S

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• B81B7/0061 Primary

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• G01L13/025

  using diaphragms · CPC title

• G01L15/00

  Devices or apparatus for measuring two or more fluid pressure values simultaneously · CPC title

• B81B2201/0264

  Pressure sensors · CPC title