Heat dissipation system for optical module

Patent metadata

Field	Value
Publication number	US-9660414-B2
Application number	US-201514948558-A
Country	US
Kind code	B2
Filing date	Nov 23, 2015
Priority date	May 24, 2013
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A heat dissipation system for an optical module, related to communication fittings technologies, is provided to improve heat dissipation efficiency of the optical module. The heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing. A first heat dissipation apparatus is fixedly disposed on the circuit card. A heat dissipation window is provided in an area that is above the laser and on the housing of the optical module. The first heat dissipation apparatus performs heat dissipation on the heat dissipation window.

First claim

What is claimed is:

1. A heat dissipation system for an optical module, comprising:
at least one optical module mounted on a circuit card, wherein the optical module comprises a housing and a laser disposed inside the housing; and
a first heat dissipation apparatus is fixedly disposed on a same side of the circuit card as the at least one optical module; and
a heat dissipation window component located between the first heat dissipation apparatus and the at least one optical module, wherein the heat dissipation window component is coupled to the housing above the laser of the optical module, and wherein the first heat dissipation apparatus performs heat dissipation on the heat dissipation window component.

2. The heat dissipation system for the optical module according to claim 1 , wherein the heat dissipation window component is a heat sink fin in a cross structure, wherein the heat sink fin comprises multiple first toothed bars horizontally disposed at intervals and multiple second toothed bars vertically disposed at intervals, wherein the second toothed bars are located on surfaces of the first toothed bars, and wherein the second toothed bars and the first toothed bars are disposed in a cross manner.

3. The heat dissipation system for the optical module according to claim 2 , wherein the multiple first toothed bars are disposed parallel to each other, and wherein the multiple second toothed bars are disposed parallel to each other.

4. The heat dissipation system for the optical module according to claim 2 , wherein the first heat dissipation apparatus is a piezoelectric film fan, wherein the piezoelectric film fan comprises a hollow body, a film, and a piezoelectric plate, wherein the piezoelectric plate and the film are fixedly connected to form a piezoelectric structure, wherein the piezoelectric structure is disposed inside a hollow cavity of the body, wherein a gap exists between the piezoelectric structure and an inner wall of the body, wherein a first opening is provided on a surface on a side, corresponding to the piezoelectric plate, of the body, wherein a nozzle is provided on a surface, opposite to the first opening, of the body, wherein the nozzle is directed towards the heat dissipation window component, and wherein the piezoelectric plate is electrically connected to an alternating current.

5. The heat dissipation system for the optical module according to claim 1 , wherein the first heat dissipation apparatus is a piezoelectric film fan, wherein the piezoelectric film fan comprises a hollow body, a film, and a piezoelectric plate, wherein the piezoelectric plate and the film are fixedly connected to form a piezoelectric structure, wherein the piezoelectric structure is disposed inside a hollow cavity of the body, wherein a gap exists between the piezoelectric structure and an inner wall of the body, wherein a first opening is provided on a surface on a side, corresponding to the piezoelectric plate, of the body, wherein a nozzle is provided on a surface, opposite to the first opening, of the body, wherein the nozzle is directed towards the heat dissipation window component, and wherein the piezoelectric plate is electrically connected to an alternating current.

6. The heat dissipation system for the optical module according to claim 5 , wherein a second opening whose size is close to that of the nozzle is provided on the film at a position opposite to the nozzle.

7. The heat dissipation system for the optical module according to claim 5 , wherein a quantity of nozzles of the first heat dissipation apparatus is equal to a quantity of the optical modules.

8. The heat dissipation system for the optical module according to claim 5 , wherein the first heat dissipation apparatus is disposed on a face plate of the circuit card.

9. The heat dissipation system for the optical module according to claim 5 , wherein the first heat dissipation apparatus is fixed through clamping on the circuit card.

10. The heat dissipation system for the optical module according to claim 1 , further comprising a second heat dissipation apparatus disposed on the housing of the optical module and is located on a side edge of the heat dissipation window component.

11. The heat dissipation system for the optical module according to claim 10 , wherein the second heat dissipation apparatus is a heat sink.

Assignees

• Huawei Tech Co Ltd

Inventors

• Huang Shuliang
• Hao Mingliang
• Liu Zaomeng

Classifications

• H01S5/02208

  characterised by the shape of the housings · CPC title

• H01S5/02407

  Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H01S5/02469 Primary

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title