System interconnect for integrated circuits

Patent metadata

Field	Value
Publication number	US-9660364-B2
Application number	US-201314055506-A
Country	US
Kind code	B2
Filing date	Oct 16, 2013
Priority date	Oct 17, 2012
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.

First claim

What is claimed is:

1. An electronic device to transmit data comprising:
a package substrate; and
a plurality of integrated circuits coupled to the package substrate, at least one integrated circuit comprising a topside connector coupled to a cable receptacle via a first cable, the cable receptacle also coupled to a printed circuit board via a second cable separate from the first cable, the second cable receiving a sideband signal from the printed circuit board, wherein the at least one integrated circuit is connected to a backplane connector through the cable receptacle, and wherein a backplane package substrate enables data transmission between the at least one integrated circuit and a switch fabric silicon without a repeater.

2. The electronic device of claim 1 , wherein the package substrate does not include the first cable.

3. The electronic device of claim 1 , wherein the cable receptacle transmits data to a switch fabric silicon.

4. The electronic device of claim 1 , wherein the first cable is one of a coaxial cable, a micro-coaxial cable, twin-axial cable, or a flexible printed circuit.

5. The electronic device of claim 1 , wherein the cable receptacle is a CXP cable receptacle.

6. An electronic device to transmit data comprising:
an integrated circuit coupled to a package substrate, the integrated circuit having a topside connector coupled to a first cable; and
a double-ended cable receptacle that is electrically coupled to the first cable from the topside connector and a second cable separate from the first cable that is electrically coupled to a chassis panel comprising a printed circuit board, the second cable receiving a sideband signal from the printed circuit board, wherein the integrated circuit is connected to a backplane connector through the double-ended cable receptacle, and wherein a backplane package substrate enables data transmission between the integrated circuit and a switch fabric silicon without a repeater.

7. The electronic device of claim 6 , wherein the double-ended cable receptacle transmits the data from the integrated circuit to the printed circuit board.

8. The electronic device of claim 6 , wherein the topside connector is a network interface connector integrated into the first cable.

9. The electronic device of claim 6 , wherein the topside connector is a network interface connector that attaches to the first cable through one of a low insertion force connector and a land grid array.

10. A system to transmit data comprising:
an integrated circuit coupled to a first package substrate, the integrated circuit to have a topside connector coupled to a first cable;
a double-ended cable receptacle coupled to the first cable that is to transmit the data from the topside connector of the integrated circuit of the first package substrate to a chassis panel comprising a printed circuit board, the double-ended cable receptacle also coupled to a second cable separate from the first cable, the second cable receiving a sideband signal from the printed circuit board; and
a backplane printed circuit board comprising a switch fabric silicon, wherein the integrated circuit is connected to a backplane connector through the double-ended cable receptacle, and wherein the backplane printed circuit board enables data transmission between the integrated circuit and the switch fabric silicon without a repeater.

11. The system of claim 10 , wherein the double-ended cable receptacle resides within the backplane printed circuit board.

12. The system of claim 10 , wherein the first package substrate does not include the first cable.

13. The system of claim 10 , wherein the double-ended cable receptacle transmits data to the switch fabric silicon.

14. The system of claim 10 , wherein the first cable is one of a coaxial cable, a micro-coaxial cable, a twin-axial cable, or a flexible printed circuit board cable.

15. The system of claim 10 , wherein the first cable comprises a connector, wherein the connector is a quad small form-factor pluggable connector.

Assignees

• Intel Corp

Inventors

• Wig Timothy
• Hinck Todd
• Ganesan Sanka

Classifications

• H04L12/40013 Primary

  Details regarding a bus controller · CPC title

• H01R31/06

  Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94) · CPC title

• H01R12/721

  cooperating directly with the edge of the rigid printed circuits · CPC title

• H04B1/3883

  Arrangements for mounting batteries or battery chargers · CPC title

• H04B15/04

  the interference being caused by substantially sinusoidal oscillations, e.g. in a receiver or in a tape-recorder · CPC title