Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US9660147B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9660147-B2 |
| Application number | US-201214002202-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 9, 2012 |
| Priority date | Mar 18, 2011 |
| Publication date | May 23, 2017 |
| Grant date | May 23, 2017 |
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The present invention relates to a method for providing a reflective coating ( 114 ) to a substrate ( 104 ) for a light-emitting device ( 112 ), comprising the steps of: providing ( 201 ) a substrate ( 104 ) having a first surface portion ( 116 ) with a first surface material and a second surface portion ( 106, 108 ) with a second surface material different from the first surface material; applying ( 202 ) a reflective compound ( 401 ) configured to attach to said first surface material to form a bond with the substrate ( 104 ) in the first surface portion ( 116 ) that is stronger than a bond between the reflective compound ( 401 ) and the substrate ( 104 ) in the second surface portion ( 106, 108 ); curing ( 203 ) said reflective compound ( 401 ) to form a reflective coating ( 114 ) having said bond between the reflective coating ( 114 ) and the substrate ( 104 ) in the first surface portion ( 116 ); and subjecting said substrate ( 104 ) to a mechanical treatment with such an intensity as to remove ( 205 ) said reflective coating ( 114 ) from said second surface portion ( 106, 108 ) while said reflective coating ( 114 ) remains on said first surface portion ( 116 ).
Opening claim text (preview).
What is being claimed is: 1. A method for fabricating a structure including a reflective coating on a substrate for a light-emitting device, the method comprising: providing a substrate having a first surface portion with a first surface material and a second surface portion with a second surface material different from the first surface material; applying a reflective compound to said first surface material and said second surface material; at least partly curing said reflective compound to form a reflective coating on the first surface portion and the second surface portion, wherein a bond the reflective coating forms with the substrate in the first surface portion that is stronger than a second bond that the reflective coating forms with the substrate in the second surface portion; and subjecting said reflective coating on the first and second surface portions to a mechanical treatment that overcomes the bond with the substrate in the second surface portion to thereby remove said reflective coating from at least a part of said second surface portion while said reflective coating remains on said first surface portion, wherein subjecting the reflective coating to the mechanical treatment comprises applying a fluid spray that removes the reflective coating from at least part of the second surface portion. 2. The method according to claim 1 , further comprising the step of soaking said substrate in a solvent prior to subjecting the substrate to said mechanical treatment. 3. The method according to claim 1 , wherein the reflective compound comprises a sol-gel binder. 4. The method according to claim 3 , wherein said sol-gel binder comprises a reaction product of at least partly hydrolyzed silane monomers. 5. The method according to claim 1 , wherein the first surface material is a ceramic material. 6. The method according to claim 1 , wherein the second surface material is a metal. 7. The method according to claim 6 , wherein the metal comprises gold. 8. The method according to claim 1 , wherein said second surface portion comprises connection pads for electrical connection of a light-emitting device to the substrate. 9. The method according to claim 1 , wherein said reflective compound is applied by spraying. 10. The method according to claim 1 , wherein said first and second bonds are chemical bonds. 11. The method according to claim 1 , wherein said mechanical treatment has substantially the same intensity in the first surface portion and in the second surface portion. 12. The method according to claim 1 , further comprising attaching a light-emitting device to the part of the second surface portion from which the reflective coating was removed. 13. The method of claim 1 , wherein the fluid spray is applied at substantially the same intensity on the first and second surface portions, and the bond of the reflective coating with the first surface portion being stronger than the bond of the reflective coating with the second surface portion prevents removal of the reflective coating from the first surface portion. 14. A method for fabricating a structure including a reflective coating on a substrate for a light-emitting device, the method comprising: providing a substrate with a first surface material in a first surface portion where a reflective coating is desired and with a second surface material in a second surface portion where the reflective coating is not desired, wherein the second surface material comprises a releasing agent on a metal layer, and the first surface material comprises the metal layer with no releasing agent; applying a reflective compound to said first surface material in the first surface portion and to said second surface material in the second surface portion; at least partly curing said reflective compound to form a reflective coating on the first surface portion and the second surface portion, wherein a first bond that the reflective coating forms with the substrate in the first surface portion is stronger than a second bond that the reflective coating forms with the substrate in the second surface portion; and applying a mechanical treatment uniformly to said reflective coating on the first and second surface portions, wherein the mechanical treatment overcomes the second bond of said reflective coating with the substrate in the second surface portion to thereby remove said reflective coating from at least a part of said second surface portion while said reflective coating remains on said first surface portion. 15. The method of claim 14 , wherein the releasing agent is selected from a group consisting of a photo-resist and a self-assembled layer of functionalized thiols. 16. A method for fabricating a structure including a reflective coating on a substrate for a light-emitting device, the method comprising: providing a substrate with a first surface material in a first surface portion where a reflective coating is desired and with a second surface material in a second surface portion where the reflective coating is not desired, wherein the first surface material comprises an adhesion promoter on a metal layer, and the second surface material comprises the metal layer with no adhesion promoter; applying a reflective compound to said first surface material in the first surface portion and to said second surface material in the second surface portion; at least partly curing said reflective compound to form a reflective coating on the first surface portion and the second surface portion, wherein a first bond that the reflective coating forms with the substrate in the first surface portion is stronger than a second bond that the reflective coating forms with the substrate in the second surface portion; and applying a mechanical treatment uniformly to said reflective coating on the first and second surface portions, wherein the mechanical treatment overcomes the second bond of said reflective coating with the substrate in the second surface portion to thereby remove said reflective coating from at least a part of said second surface portion while said reflective coating remains on said first surface portion. 17. The method of claim 16 , wherein the adhesion promoter comprises a mercapto group that reacts with the metal layer and a methoxy group that chemically links to the reflective compound.
Light emitting diode [LED] · CPC title
Electricity · mapped topic
Electricity · mapped topic
On flat or curved insulated base, e.g., printed circuit, etc. · CPC title
Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics · CPC title
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