Solid electrolytic capacitor including insulating substrate having recessed surface

Patent metadata

Field	Value
Publication number	US-9659714-B2
Application number	US-201514663411-A
Country	US
Kind code	B2
Filing date	Mar 19, 2015
Priority date	Sep 28, 2012
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A solid electrolytic capacitor comprises insulating substrate having an upper surface and a lower surface, a capacitor element disposed on the upper surface, a positive electrode lead-out structure, a negative electrode lead-out structure, and an exterior body configured to cover the capacitor element on the upper surface. The capacitor element has a positive electrode member, a negative electrode member, and a dielectric member. The positive electrode lead-out structure has a positive electrode terminal formed on the lower surface of the insulating substrate and is electrically connected to the positive electrode member. The negative electrode lead-out structure has a negative electrode terminal formed on the lower surface of the insulating substrate and is electrically connected to the negative electrode member. The insulating substrate has a step portion made up of a recessed surface formed by recessing the upper surface and a projected surface formed by projecting the lower surface.

First claim

What is claimed is:

1. A solid electrolytic capacitor comprising:
an insulating substrate having an upper surface and a lower surface;
a capacitor element having a positive electrode member, a negative electrode member, and a dielectric member, and disposed on the upper surface of the insulating substrate;
a positive electrode lead-out structure having a positive electrode terminal formed on the lower surface of the insulating substrate, and electrically connected to the positive electrode member of the capacitor element;
a negative electrode lead-out structure having a negative electrode terminal formed on the lower surface of the insulating substrate, a first negative electrode connection member formed on the upper surface of the insulating substrate, and a second negative electrode connection member configured to electrically connect the first negative electrode connection member to the negative electrode terminal, and the negative electrode lead-out structure being electrically connected to the negative electrode member of the capacitor element;
a conductive member configured to electrically connect the first negative electrode connection member to the negative electrode member of the capacitor element; and
an exterior body configured to cover the capacitor element on the upper surface of the insulating substrate, wherein:
the insulating substrate has a step portion made up of a recessed surface and a projected surface, the recessed surface being formed by recessing the upper surface, the projected surface being formed by projecting the lower surface so as to face the recessed surface in the thickness direction of the insulating substrate,
at least a part of the first negative electrode connection member is disposed on the recessed surface, and
the first negative electrode connection member has a step portion disposed along the step portion of the insulating substrate.

2. The solid electrolytic capacitor according to claim 1 , wherein the insulating substrate is provided separately from the exterior body.

3. The solid electrolytic capacitor according to claim 1 , wherein the step portion of the insulating substrate is formed in a part of the insulating substrate facing the capacitor element.

4. The solid electrolytic capacitor according to claim 1 , wherein the positive electrode lead-out structure further has a first positive electrode connection member formed on the upper surface of the insulating substrate, and a second positive electrode connection member configured to electrically connect the first positive electrode connection member to the positive electrode terminal.

5. The solid electrolytic capacitor according to claim 1 , wherein the projected surface in the step portion, a lower surface of the positive electrode terminal, and a lower surface of the negative electrode terminal are disposed in the same plane.

6. The solid electrolytic capacitor according to claim 1 , wherein the conductive member is disposed between the negative electrode member and the part of the first negative electrode connection member which is disposed on the recessed surface.

7. The solid electrolytic capacitor according to claim 6 , wherein a thickness of the conductive member on the part of the first negative electrode connection member which is disposed on the recessed surface is greater than a thickness of the conductive member on a part of the first negative electrode connection member which is opposed to the negative electrode terminal.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Fujii Eizo

Classifications

• H01G9/08

  Housing; Encapsulation · CPC title

• H01G9/012 Primary

  specially adapted for solid capacitors · CPC title

• H01G2/06

  specially adapted for mounting on a printed-circuit support · CPC title

• H01G9/15

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title

• H01G9/10

  Sealing, e.g. of lead-in wires · CPC title