Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon

Patent metadata

Field	Value
Publication number	US-9659682-B2
Application number	US-201414916100-A
Country	US
Kind code	B2
Filing date	Nov 28, 2014
Priority date	Nov 29, 2013
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

First claim

The invention claimed is:

1. A composition for forming a conductive pattern by electromagnetic irradiation, the composition comprising:
a polymer resin; and
a non-conductive metal compound of Chemical Formula 1 including a first metal and a second metal,
wherein a metal core including the first metal, the second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation:
A 3−x B 3+x C 8   [Chemical Formula 1]

in Chemical Formula 1,
A and B are each independently the first and second metals different from each other,
C is oxygen, nitrogen, or sulfur, and
x satisfies 0≦x≦0.6.

2. The composition of claim 1 , wherein A is one or more metals selected from the group consisting of Cu, Ag, Pd, Au, Pt, Ni, and Sn, and B is one or more metals selected from the group consisting of Mn, Al, Cr, Fe, Mo, and W.

3. The composition of claim 1 , wherein the non-conductive metal compound has an average particle size of 1 μm or less.

4. The composition of claim 1 , wherein the polymer resin includes a thermosetting resin or a thermoplastic resin.

5. The composition of claim 4 , wherein the polymer resin includes one or more selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin.

6. The composition of claim 1 , wherein the non-conductive metal compound is included in an amount of 1 to 10 wt %, with respect to the total composition.

7. The composition of claim 1 , further comprising a coloring additive; and one or more additives selected from the group consisting of an inorganic filler, a flame retardant, an impact modifier, a heat stabilizer, a UV stabilizer, a lubricant, and an antioxidant.

8. The composition of claim 7 , wherein the coloring additive includes one or more selected from the group consisting of carbon black, graphite, graphene, clay, talc, TiO 2 , ZrO 2 , Fe 2 O 3 , BaSO 4 , CaCO 3 , SiO 2 , ZnS, ZnO, ZnCrO 4 , Cr 2 O 3 , CoO.nAl 2 O 3 , Co 3 (PO 4 ) 2 , copper phthalocyanine, and quinacridone.

9. The composition of claim 7 , wherein the flame retardant includes a phosphorus based flame retardant and an inorganic flame retardant.

10. A method for forming a conductive pattern by direct electromagnetic irradiation, the method comprising:
molding the composition of claim 1 to a resin product or applying the composition to another product so as to form a resin layer;
irradiating an electromagnetic wave to a predetermined region of the resin product or the resin layer so as to generate a metal core including a first or second metal or an ion thereof from a non-conductive metal compound; and
chemically reducing or plating the region in which the metal core is generated so as to form a conductive metal layer.

11. The method of claim 10 , wherein in the generating of the metal core, a laser electromagnetic wave is irradiated.

12. The method of claim 11 , wherein the laser electromagnetic wave has a wavelength of 200 nm to 11000 nm.

13. The method of claim 10 , wherein in the generating of the metal core, the non-conductive metal compound is partially exposed on a surface of the predetermined region of the resin product or the resin layer to thereby generate the metal core therefrom, and an adhesion-activated surface activated so as to have higher adhesion is formed.

14. The method of claim 13 , wherein the conductive metal layer is formed on the adhesion-activated surface by chemical reduction of the first or second metal ion included in the metal core or electroless plating thereof.

15. The method of claim 10 , wherein in the reducing or plating, the region on which the metal core is generated is treated with an acidic or basic solution including a reducing agent.

16. The method of claim 15 , wherein the reducing agent is one or more selected from the group consisting of formaldehyde, hypophosphite, dimethylamino borane (DMAB), diethylamino borane (DEAB), and hydrazine.

17. A resin structure having a conductive pattern, the resin structure comprising:
a polymer resin substrate;
a non-conductive metal compound of Chemical Formula 1 including a first metal and a second metal and dispersed in the polymer resin substrate;
an adhesion-activated surface including a metal core including the first or second metal or an ion thereof exposed on a surface of a predetermined region of the polymer resin substrate; and
a conductive metal layer formed on the adhesion-activated surface:
A 3−x B 3+x C 8   [Chemical Formula 1]

in Chemical Formula 1,
A and B are each independently the first and second metals different from each other,
C is oxygen, nitrogen, or sulfur, and
x satisfies 0≦x≦0.6.

18. The resin structure of claim 17 , wherein a predetermined region on which the adhesion-activated surface and the conductive metal layer are formed corresponds to a region of the polymer resin substrate to which an electromagnetic wave is irradiated.

Assignees

• Lg Chemical Ltd

Inventors

• Park Chee-Sung
• Kim Jae Hyun
• Jun Shin Hee
• Park Cheol-Hee
• Seong Eun Kyu
• Jung Sang Yun
• Kim Jae Jin
• Jeong Han Nah
• Lee Su Jeong

Classifications

• H05K2203/0514

  Photodevelopable thick film, e.g. conductive or insulating paste · CPC title

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title

• C08K2003/2248

  of copper · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• H05K3/106

  by photographic methods · CPC title