Impact-absorbing pressure-sensitive adhesive sheet and method of producing the same

US9657198B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9657198-B2
Application numberUS-201414470058-A
CountryUS
Kind codeB2
Filing dateAug 27, 2014
Priority dateAug 3, 2006
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An impact-absorbing pressure-sensitive adhesive sheet according to an embodiment of the present invention includes an impact-absorbing pressure-sensitive adhesive layer including an impact-absorbing layer. A side surface of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65° or more.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of producing an impact-absorbing pressure-sensitive adhesive sheet, the method comprising: providing an impact-absorbing pressure-sensitive adhesive layer having therein an impact-absorbing layer, the impact-absorbing pressure-sensitive adhesive layer being formed on one side of a substrate; irradiating the impact-absorbing pressure-sensitive adhesive layer with laser light for cutting so as to form a fully-cut edge of the impact-absorbing pressure-sensitive adhesive layer on the substrate such that the layer becomes separable from the fully-cut edge from the substrate, wherein: a cut surface of said cut edge of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65° or more. 2. The method of producing an impact-absorbing pressure-sensitive adhesive sheet according to claim 1 , wherein said cutting with laser light forms adjacent cut surfaces of the impact-absorbing pressure-sensitive adhesive layer, and a distance between the adjacent cut surfaces is 30 μm or more. 3. The method of producing an impact-absorbing pressure-sensitive adhesive sheet according to claim 1 , wherein the laser light includes light having a wavelength of at least one of 400 nm or less and/or 1.5 μm or more. 4. The method of producing an impact-absorbing pressure-sensitive adhesive sheet according to claim 1 , wherein the laser comprises CO 2 laser. 5. The method of producing an impact-absorbing pressure-sensitive adhesive sheet according to claim 1 , wherein the impact-absorbing pressure-sensitive adhesive layer is cut to provide a plurality of impact-absorbing pressure-sensitive adhesive pieces each having an impact-absorbing layer on the one side of the substrate. 6. The method of producing an impact-absorbing pressure-sensitive adhesive sheet according to claim 1 , wherein the sheet further comprises an optical layer which is cut together with the impact-absorbing pressure-sensitive adhesive layer. 7. The method of producing an impact-absorbing pressure-sensitive adhesive sheet according to claim 1 , wherein the optical layer comprises a polarizing plate or an optical compensation film.

Assignees

Inventors

Classifications

  • Layer or component removable to expose adhesive · CPC title

  • C09J9/00Primary

    Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) · CPC title

  • Chemistry & Metallurgy · mapped topic

  • by boring or cutting · CPC title

  • Web or sheet containing structurally defined element or component and having an adhesive outermost layer · CPC title

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Frequently asked questions

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What does patent US9657198B2 cover?
An impact-absorbing pressure-sensitive adhesive sheet according to an embodiment of the present invention includes an impact-absorbing pressure-sensitive adhesive layer including an impact-absorbing layer. A side surface of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65° or more.
Who is the assignee on this patent?
Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification C09J9/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).