Method for producing a resin composition having a porous structure with independent porosities

US9657153B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9657153-B2
Application numberUS-201514666924-A
CountryUS
Kind codeB2
Filing dateMar 24, 2015
Priority dateMay 28, 2009
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An object of the present invention is to provide a porous material (resin composition) having high heat insulation properties, mechanical properties, and electrical properties by controlling function of a porous film by setting a porosity size, distribution of the porosity size, and a porosity ratio of the porous film in predetermined ranges. The resin composition according to the present invention is comprised of an engineering plastic having porous structure in which not less than 80% of a total porosity is comprised of independent porosities, a mean porosity size is not less than 0.01 μm and not more than 0.9 μm, and not less than 80% of the total porosity has a porosity size within ±30% of the mean porosity size.

First claim

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What is claimed is: 1. A method for producing a resin composition having a porous structure in which 80% to 94% of a total porosity is comprised of independent porosities, the independent porosities having walls having no opening between adjacent porosities, the method comprising: molding a resin solution having a viscosity of 10,000 cP to 1,000,000 cP; and removing a solvent of the resin solution by a phase separation method to perform porosification, wherein the porous structure has a mean porosity size of 0.01 μm to 0.9 μm, and wherein not less than 80% of the total porosity has a porosity size within ±30% of the mean porosity size. 2. The method according to claim 1 , wherein the resin solution comprises at least one selected from the group consisting of a polyimide, a polyamidoimide, a polyamide, a polyether imide, a polycarbonate, a polyether ether ketone, a polysulfone, and a polyether sulfone. 3. The method according to claim 1 , wherein the resin solution contains 1% by weight to 30% by weight based thereon of a conductive controlling agent. 4. The method according to claim 1 , wherein the porous structure has a porosity ratio from 10% to 90%. 5. The method according to claim 1 , wherein the porous structure has a porosity ratio from 30% to 70%. 6. The method according to claim 1 , wherein the porous structure has a porosity ratio from 60% to 70%. 7. The method according to claim 1 , wherein the composition includes an inorganic substance that increases viscosity of a precursor of the resin solution. 8. The method according to claim 7 , wherein the inorganic substance comprises at least one substance selected from the group consisting of lithium chloride, lithium bromide, and lithium oxalate. 9. The method according to claim 1 , wherein the resin composition is a resin film, which is disposed between a substrate and a releasing layer. 10. The method according to claim 9 , wherein the releasing layer has a thickness of 1 mm to 10 mm. 11. The method according to claim 9 , wherein if the resin film has a macro void, a porosity size thereof is less than 10 μm. 12. The method according to claim 9 , wherein the resin film has a thickness of at least 120 μm. 13. The method according to claim 1 , wherein the viscosity of the resin solution is 94,000 cP to 500,000 cP. 14. The method according to claim 1 , wherein the resin composition has a thermal conductivity of less than 0.1 W/m·K, a compression resistance of less than 10%, and a thermal conductivity after compression of less than 0.1 W/m·K. 15. The method according to claim 1 , wherein the resin composition has a thermal conductivity of less than 0.05 W/m·K. 16. The method according to claim 1 , wherein not less than 91% of the total porosity has the porosity size within ±30% of the mean porosity size. 17. The method according to claim 1 , wherein the phase separation method comprises adjusting a solvent substitution rate. 18. The method according to claim 17 , wherein the adjusting of the solvent substitution rate comprises adding a second solvent and a solidifying solvent, wherein the solidifying solvent is water, and wherein the second solvent is at least one selected from the group consisting of ethanol, methanol, propanol, acetone, and methyl ethyl ketone. 19. A for producing a resin composition having a porous structure in which 80% to 94% of a total porosity is comprised of independent porosities, the independent porosities having walls having no opening between adjacent porosities, the method comprising: molding a resin solution having a viscosity of 10,000 cP to 1,000,000 cP; and removing a solvent of the resin solution by a phase separation method, which comprises adjusting a solvent substitution rate, to perform porosification, wherein the porous structure has a mean porosity size of 0.01 μm to 0.9 μm, wherein not less than 80% of the total porosity has a porosity size within ±30% of the mean porosity size, wherein the adjusting of the solvent substitution rate comprises adding a solidifying solvent and changing a temperature of the solidifying solvent, and wherein the solidifying solvent is water. 20. The method according to claim 1 , wherein the phase separation method comprises adjusting a solidifying rate. 21. A method for producing a resin composition having a porous structure in which 80% to 94% of a total porosity is comprised of independent porosities, the independent porosities having walls having no opening between adjacent porosities, the method comprising: molding a resin solution having a viscosity of 10,000 cP to 1,000,000 cP; and removing a solvent of the resin solution by a phase separation method to perform porosification, wherein the porous structure has a mean porosity size of 0.01 μm to 0.9 μm, wherein not less than 80% of the total porosity has a porosity size within ±30% of the mean porosity size, and wherein the phase separation method comprises casting the resin solution on a substrate to form a cast film and covering the cast film with a solvent substitution rate adjustment film. 22. The method according to claim 3 , wherein the conductive controlling agent is at least one of carbon black and a metal oxide.

Assignees

Inventors

Classifications

  • by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum · CPC title

  • C08J9/286Primary

    the liquid phase being a solvent for the monomers but not for the resulting macromolecular composition, i.e. macroporous or macroreticular polymers · CPC title

  • relating to the chemical composition of the heat element and layers thereof · CPC title

  • C08G73/10Primary

    Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

  • Closed cells, i.e. more than 50% of the pores are closed · CPC title

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What does patent US9657153B2 cover?
An object of the present invention is to provide a porous material (resin composition) having high heat insulation properties, mechanical properties, and electrical properties by controlling function of a porous film by setting a porosity size, distribution of the porosity size, and a porosity ratio of the porous film in predetermined ranges. The resin composition according to the present inven…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification C08J9/286. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).