Low warp fan-out processing method and production of substrates therefor
US-11875993-B2 · Jan 16, 2024 · US
US9656910B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9656910-B2 |
| Application number | US-201615016781-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 5, 2016 |
| Priority date | Nov 29, 2012 |
| Publication date | May 23, 2017 |
| Grant date | May 23, 2017 |
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Methods of forming a glass article are disclosed. In one embodiment, a method of forming a glass article includes translating a pulsed laser beam on a glass substrate sheet to form a laser damage region between a first surface and a second surface of the glass substrate sheet. The method further includes applying an etchant solution to the glass substrate sheet to remove a portion of the glass substrate sheet about the laser damage region. The method may further include strengthening the glass substrate sheet by an ion-exchange strengthening process, and coating the glass substrate sheet with an acid-resistant coating. Also disclosed are methods where the laser damage region has an initial geometry that changes to a desired geometry following the reforming of the glass substrate sheet such that the initial geometry of the laser damage region compensates for the bending of the glass substrate sheet.
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The invention claimed is: 1. A method of forming a glass article, comprising: providing a glass substrate sheet; translating a pulsed laser beam on the glass substrate sheet to form a laser damage region extending from a first surface of the glass substrate sheet to a second surface of the glass substrate sheet, wherein: the laser damage region comprises a plurality of defect lines, wherein each defect line is formed at a different depth of the glass substrate sheet; and applying the glass substrate sheet with an etchant solution. 2. The method of claim 1 , wherein the etchant solution comprises about 1M to about 3M Hydrofluoric acid and hydrochloric acid. 3. The method of claim 2 , wherein a concentration of the hydrochloric acid is less than about 1M if a concentration of the hydrofluoric acid is greater than about 2M; and the concentration of the hydrochloric acid is between about 1M and about 3M if the concentration of the hydrofluoric acid is less than about 2M. 4. The method of claim 1 , wherein the glass substrate sheet is strengthened before the pulsed laser beam is translated on the glass substrate sheet, and wherein the pulsed laser has a power of from about 0.1 W to about 0.4 W. 5. The method of claim 1 , wherein the glass substrate sheet is strengthened after the pulsed laser beam is translated on the glass substrate sheet, and wherein the pulsed laser has a power of from about 0.4 W to about 0.6 W. 6. The method of claim 1 , wherein an acid-resistant coating is applied to the glass substrate sheet before the pulsed laser beam is translated on the glass substrate sheet, and wherein the acid-resistant coating is removed from the glass substrate sheet after the pulsed laser beam is translated on the glass substrate sheet. 7. The method of claim 1 , wherein an acid-resistant coating comprising ethylene acrylic acid, wax polymer, and water is applied to the glass substrate sheet. 8. The method of claim 1 , wherein an acid-resistant coating having a thickness of from about 1 μm to about 15 μm is applied to the glass substrate sheet. 9. The method of claim 1 , wherein the glass substrate sheet comprises from about 5 mol % to about 14 mol % alkaline earth metal oxides. 10. The method of claim 1 , wherein the laser damage region does not contact an edge of the glass substrate sheet. 11. The method of claim 1 , wherein applying the etchant solution to the glass substrate sheet comprises spraying the glass substrate sheet with the etchant solution. 12. The method of claim 1 , wherein applying the etchant solution to the glass substrate sheet comprises submerging the glass substrate sheet in a bath of the etchant solution, wherein a temperature of the bath of the etchant solution is less than about 30° C.; and the bath of the etchant solution is agitated at an ultrasonic agitation frequency of about 40 kHz until a portion of the glass substrate sheet about the laser damage region is substantially removed, thereby forming the shaped glass article. 13. The method of claim 1 , wherein: the pulsed laser beam is translated on the glass substrate sheet at multiple passes; and a focus of the pulsed laser beam is modified at each pass such that the laser damage region is defined by a plurality of laser damage lines extending from the first surface to the second surface within a bulk of the glass substrate sheet. 14. The method of claim 1 , wherein the pulsed laser beam has a wavelength in the ultraviolet spectrum and a power of about 0.1 W to about 2.0 W. 15. The method of claim 1 , further comprising strengthening the glass substrate sheet by an ion-exchange strengthening process. 16. The method of claim 1 , further comprising coating the glass substrate sheet with an acid-resistant coating. 17. A method of forming a shaped glass article, comprising: providing a glass substrate sheet; translating a pulsed laser beam on the glass substrate sheet to form a laser damage region extending from a first surface of the glass substrate sheet to a second surface of the glass substrate sheet, wherein: the laser damage region comprises a plurality of defect lines, wherein each defect line is formed at a different depth of the glass substrate sheet; and the laser damage region comprises an initial geometry; submerging the glass substrate sheet in a bath of etchant solution; and agitating the bath of etchant solution until a portion of the glass substrate sheet about the laser damage region is substantially removed, thereby forming the shaped glass article. 18. The method of claim 17 , wherein the pulsed laser beam has a wavelength in the ultraviolet spectrum and a power of about 0.5 W to about 2.0 W. 19. The method of claim 17 , wherein a temperature of the bath of etchant solution is less than about 30° C. 20. The method of claim 17 , wherein the bath of etchant solution is agitated at an ultrasonic agitation frequency of about 40 kHz.
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