Heat shield for a spacecraft

US9656769B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9656769-B2
Application numberUS-201414266158-A
CountryUS
Kind codeB2
Filing dateApr 30, 2014
Priority dateMay 1, 2013
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various material compositions of a heat shield for a spacecraft are described. The heat shield can be formed by multi-dimensional weaver or three-dimensional (3-D) printer. Furthermore, the heat shield can be configured with a superconducting coil.

First claim

Opening claim text (preview).

We claim: 1. A spacecraft; a heat shield for minimizing heat transfer to the spacecraft; the heat shield comprising: (a) a carbon phenolic material; and (b) a nanostructural material, wherein the nanostructural material comprises: graphene in an amount of 0.1 wt % to 10 wt % and graphene nanoribbons in an amount of 0.1 wt % to 10 wt %. 2. The spacecraft of claim 1 , wherein the heat shield further comprises: a hollow microsphere or a syntactic microfoam. 3. The spacecraft of claim 1 , wherein the heat shield further comprises: a ceramic material. 4. The spacecraft of claim 1 , wherein the heat shield further comprises: a light silicate frame material. 5. The spacecraft of claim 1 , wherein the heat shield further comprises: a superconducting coil. 6. A spacecraft; a heat shield for minimizing heat transfer to the spacecraft; the heat shield comprising: (a) a matrix material, wherein the matrix material comprises: a carbon phenolic material and a silicon carbide material, wherein the silicon carbide material comprises: carbon fibers; and (b) a nanostructural material, wherein the nanostructural material comprises: graphene in an amount of 0.1 wt % to 10 wt % and graphene nanoribbons in an amount of 0.1 wt % to 10 wt %. 7. The spacecraft of claim 6 , wherein the heat shield further comprises: a hollow microsphere or a syntactic microfoam. 8. The spacecraft of claim 6 , wherein the heat shield further comprises: a ceramic material. 9. The spacecraft of claim 6 , wherein the heat shield further comprises: a light silicate frame material. 10. The spacecraft of claim 6 , wherein the heat shield further comprises: a superconducting coil. 11. A spacecraft; a heat shield for minimizing heat transfer to the spacecraft; the heat shield comprising: (a) a matrix material, wherein the matrix material comprises: a carbon phenolic material and a silicon carbon nitride material, wherein the silicon carbon nitride material comprises: carbon fibers; and (b) a nanostructural material, wherein the nanostructural material comprises: graphene in an amount of 0.1 wt % to 10 wt % and graphene nanoribbons in an amount of 0.1 wt % to 10 wt %. 12. The spacecraft of claim 11 , wherein the heat shield further comprises: a hollow microsphere or a syntactic microfoam. 13. The spacecraft of claim 11 , wherein the heat shield further comprises: a ceramic material. 14. The spacecraft of claim 11 , wherein the heat shield further comprises: a light silicate frame material. 15. The spacecraft of claim 11 , wherein the heat shield further comprises: a superconducting coil. 16. A spacecraft; a heat shield for minimizing heat transfer to the spacecraft; the heat shield comprising: (a) an in-situ planetary material; and (b) a first nanostructural material, wherein the in-situ planetary material is not from planet earth, wherein the first nanostructural material comprises: graphene in an amount of 0.1 wt % to 10 wt % and graphene nanoribbons in an amount of 0.1 wt % to 10 wt %. 17. The spacecraft of claim 16 , wherein the heat shield further comprises: a hollow microsphere or a syntactic microfoam. 18. The spacecraft of claim 16 , wherein the heat shield further comprises: a second nanostructural material. 19. The spacecraft of claim 16 , wherein the heat shield further comprises: a ceramic material. 20. The spacecraft of claim 16 , wherein the heat shield further comprises: a superconducting coil.

Assignees

Inventors

Classifications

  • B64G1/62Primary

    Systems for re-entry into the earth's atmosphere; Retarding or landing devices · CPC title

  • Ion or plasma engines · CPC title

  • Unconventional spacecraft propulsion systems · CPC title

  • Three-dimensional woven fabrics · CPC title

  • Textiles & Paper · mapped topic

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Frequently asked questions

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What does patent US9656769B2 cover?
Various material compositions of a heat shield for a spacecraft are described. The heat shield can be formed by multi-dimensional weaver or three-dimensional (3-D) printer. Furthermore, the heat shield can be configured with a superconducting coil.
Who is the assignee on this patent?
Mazed Mohammad A, Wiig Rex, Martinez Angel
What technology area does this patent fall under?
Primary CPC classification B64G1/62. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).