Method of preparing expoxidation catalysts
US-2015375200-A1 · Dec 31, 2015 · US
US9656243B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9656243-B2 |
| Application number | US-201414328136-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 10, 2014 |
| Priority date | Jul 10, 2013 |
| Publication date | May 23, 2017 |
| Grant date | May 23, 2017 |
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We provide a mesoporous silicon material (PSi) prepared via a template-free and HF-free process. The production process is facile and scalable, and it may be conducted under mild reaction conditions. The silicon may be produced directly by the reduction of a silicon-halogenide precursor (for example, SiCl 4 ) with an alkaline alloy (for example, NaK alloy). The resulting Si-salt matrix is then annealed for the pore formation and crystallite growth. Final product is obtained by removal of the salt by-products with water.
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We claim: 1. A process for production of porous crystalline silicon, comprising: reducing a silicon-halogenide precursor with at least one of an alkaline metal and an alkaline metal alloy to produce a silicon-salt matrix; annealing the silicon-salt matrix, thereby forming a plurality of salt crystals in a porous silicon structure; and washing the porous silicon structure with water, thereby providing a porous crystalline silicon. 2. The process of claim 1 , wherein the silicon-halogenide precursor is selected from the group consisting of SiCl 4 , SiI 4 , SiBr 4 , and SiF 4 . 3. The process of claim 2 , wherein the silicon-halogenide precursor is SiCl 4 . 4. The process of claim 1 , wherein the alkaline alloy is selected from the group consisting of sodium-potassium alloy (NaK), sodium metal, and sodium naphthanide. 5. The process of claim 1 , wherein the alkaline alloy is NaK and other alkaline metal or alloy, and the silicon-halogenide precursor is SiCl 4 . 6. The process of claim 1 , wherein the process does not include contacting any member of the group consisting of the silicon-halogenide precursor, the silicon-salt matrix, and the porous silicon structure with hydrofluoric acid. 7. The process of claim 1 , wherein the porous silicon structure includes a plurality of pores ranging in size from 1 nm to 200 nm, wherein the pore size is governed by the size of at least one external template. 8. The process of claim 1 , wherein the porous silicon structure includes a plurality of pores distributed in an ordered distribution. 9. The process of claim 1 , wherein the porous silicon structure has a total pore volume between 0.86 and 2.00 cm 3 g −1 . 10. The process of claim 1 , wherein the porous silicon structure has a surface area between 220 and 700 m 2 g −1 . 11. The process of claim 1 , wherein the silicon-halogenide precursor is mixed with an external template, wherein the porous silicon structure has an average pore size greater than 20 nm. 12. The process of claim 1 , wherein the reducing step is conducted in a toluene solution. 13. The process of claim 9 , wherein the porous silicon structure has a total pore volume between 0.86 and 1.44 cm 3 g −1 . 14. The process of claim 10 , wherein the porous silicon structure has a surface area between 220 and 580 m 2 g −1 . 15. The process of claim 14 , wherein the porous silicon structure has a surface area between 400 and 525 m 2 g −1 . 16. The process of claim 1 , wherein the porous silicon structure has a mean average pore diameter between 8 and 12 nm. 17. The process of claim 1 , wherein the porous silicon structure has a mean average pore diameter less than 8 nm. 18. The process of claim 1 further comprising, prior to washing the porous silicon structure with water, calcining the porous silicon structure at a temperature from 600° C. to 950° C. 19. The process of claim 18 further comprising, prior to washing the porous silicon structure with water, calcining the porous silicon structure at a temperature from 650° C. to 900° C. 20. The process of claim 19 , further comprising, prior to washing the porous silicon structure with water, calcining the porous silicon structure at a temperature from 700° C. to 800° C.
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