Information handling system carrier
US-2024168528-A1 · May 23, 2024 · US
US9655283B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9655283-B2 |
| Application number | US-201414319926-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 30, 2014 |
| Priority date | Jun 30, 2014 |
| Publication date | May 16, 2017 |
| Grant date | May 16, 2017 |
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Official abstract text for this publication.
The subject disclosure is directed towards a submerged datacenter, which may be made up of modules, into a body of water such as the ocean. The submersion facilitates cooling of the datacenter as well as providing protection of the datacenter from environmental conditions that exist at or near the surface. Power may be generated from the datacenter heat, and power generated by or near the body of water (e.g., via waves, tides, wind, currents, temperature differences) may be used to help power the datacenter.
Opening claim text (preview).
What is claimed is: 1. A system comprising: a submersible datacenter configured for operation while submerged in water, including by having electrical components of the submersible datacenter in at least one sealed container, and the at least one sealed container incorporated into a base located on a platform and submerged in the water; a heat transfer subsystem including a sealed circulation pipe passing through the at least one sealed container within the base, the sealed circulation pipe circulating dielectric fluid through the at least one sealed container housing the submersible datacenter to sink the datacenter, equalize pressure, and transfer heat away from the submersible datacenter, and radiator that transfers heat away from the at least one sealed container to the water outside the base; and at least one sensor to detect a resistance of the dielectric fluid and monitor a leakage rate of the fluid. 2. The system of claim 1 wherein the sealed circulation pipe transfers heat generated by the submersible datacenter into an environment within the base. 3. The system of claim 2 wherein the radiator transfers heat from the environment within the base to the outside environment. 4. The system of claim 1 wherein the heat transfer subsystem includes at least one pump, coil, or fan to circulate the dielectric fluid via the first sealed circulation pipe to cool the submersible datacenter by transferring heat away from the submersible datacenter and to another mechanism. 5. A system comprising: a datacenter module configured for submersion in water on top of a platform, the datacenter module comprising: a plurality of electrical components, a sealed hull housing the plurality of electrical components; a heat transfer subsystem configured to transfer heat away from the sealed hull into the water, including by circulating dielectric fluid throughout the sealed hull to sink the datacenter, equalize pressure, and transfer heat generated by the plurality of electrical components away from the sealed hull to the water outside the system, and further comprising a radiator that transfers heat away from the datacenter module and into the water; and at least one sensor to detect a resistance of the dielectric fluid and monitor a leakage rate of the fluid.
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