Electronic component and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9654081-B2
Application number	US-201614994642-A
Country	US
Kind code	B2
Filing date	Jan 13, 2016
Priority date	Jul 17, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

In an electronic component, a functional circuit, signal wiring electrically connected to the functional circuit, and ground wiring electrically connected to the functional circuit and electrically connected to a ground potential are located on one surface of a circuit substrate, a frame member is provided to secure a region between itself and an outer peripheral edge of a first main surface of the circuit substrate and so as to surround the functional circuit, the ground wiring extends from inside to outside the frame member, and a shield member extends from a second main surface of the circuit substrate to a region on the first main surface via the side surfaces, the shield member being electrically connected to the ground wiring in the region outside the frame member.

First claim

What is claimed is:

1. An electronic component comprising:
a circuit substrate including first and second main surfaces that oppose each other, and side surfaces that connect the first and second main surfaces to each other;
a functional circuit that is located on the first main surface of the circuit substrate;
signal wiring that is located on the first main surface of the circuit substrate and is electrically connected to the functional circuit;
ground wiring that includes a wiring portion located on the first main surface of the circuit substrate, that is electrically connected to the functional circuit and that is electrically connected to a ground potential; and
a frame member that is arranged to secure a region between the frame member and an outer peripheral edge of the first main surface of the circuit substrate and so as to surround the functional circuit; wherein
the ground wiring extends from inside to outside the frame member; and
a shield member extends from the second main surface of the circuit substrate to a region outside the frame member on the first main surface of the circuit substrate via the side surfaces, the shield member including a conductive material so as to be electrically connected to the ground wiring in the region outside the frame member.

2. The electronic component according to claim 1 , further comprising a partition wall that extends to the outer peripheral edge of the first main surface from an outer peripheral edge of the frame member; wherein
the region outside of the frame member is divided into a first area and a second area by the partition wall, the ground wiring is arranged in the first area and the signal wiring extends into the second area.

3. The electronic component according to claim 1 , wherein the shield member covers an entirety of each of the second main surface and the side surfaces of the circuit substrate.

4. The electronic component according to claim 1 , further comprising a cover member that is bonded to the frame member so as to close an opening of the frame member.

5. The electronic component according to claim 1 , wherein the frame member includes a first through hole that faces the signal wiring and a second through hole that faces the ground wiring, the electronic component further comprising first and second conductive members with which the first and second through holes are filled.

6. The electronic component according to claim 5 , further comprising:
a cover member that is bonded to the frame member so as to close an opening of the frame member; wherein
the cover member includes third and fourth through holes that are continuous with the first and second through holes, and the first and second conductive members respectively extend into the third and fourth through holes.

7. The electronic component according to claim 5 , wherein heights of the first and second conductive members are larger than that of the frame member.

8. The electronic component according to claim 5 , wherein the first and second conductive members define and function as bumps or under bump metal layers.

9. The electronic component according to claim 1 , wherein the electronic component is a surface acoustic wave device.

10. The electronic component according to claim 1 , wherein the shield member is lower than an upper end of the frame member on the first main surface of the circuit substrate on which the functional circuit is provided.

11. The electronic component according to claim 1 , wherein the shield member includes a protruding frame that protrudes upward from a portion that covers the side surfaces of the circuit substrate.

12. The electronic component according to claim 11 , further comprising a cover member that is bonded to the frame member so as to close an opening of the frame member, wherein the cover member is located in a region that is surrounded by the protruding frame.

13. The electronic component according to claim 12 , wherein an upper surface of the cover member is lower than upper ends of the first and second conductive members.

14. The electronic component according to claim 1 , further comprising a cover member that is bonded to the frame member so as to close an opening of the frame member, wherein the cover member extends to an outer peripheral edge of the electronic component.

15. The electronic component according to claim 1 , wherein the functional circuit defines one of a ladder filter and a combination of a longitudinally coupled resonator type filter and a transversely coupled resonator type filter.

16. The electronic component according to claim 1 , wherein the circuit substrate is one of a piezoelectric substrate, an insulating substrate, and a semiconductor substrate.

17. A method of manufacturing an electronic device, comprising:
(A) a step of preparing a circuit substrate including first and second main surfaces that oppose each other, and side surfaces that connect the first and second main surfaces to each other;
(B) a step of forming a functional circuit on the first main surface of the circuit substrate;
(C) a step of forming, on the first main surface of the circuit substrate, signal wiring that is electrically connected to the functional circuit, and ground wiring that is electrically connected the functional circuit and that is electrically connected to a ground potential;
(D) a step of forming a frame member on the first main surface of the circuit substrate so as to surround the functional circuit and so as to secure a region between the frame member and an outer peripheral edge of the circuit substrate; and
(E) a step of forming a shield member that includes a conductive material such that the shield member extends from the second main surface of the circuit substrate to a region outside the frame member on the first main surface via the side surfaces and so that the shield member is electrically connected to the ground wiring.

18. The method of manufacturing an electronic component according to claim 17 , wherein
the steps (A) to (E) are performed on a mother circuit substrate and a plurality of electronic component forming sections are formed on the mother circuit substrate with the shield member extending between adjacent electronic component forming sections; and
the mother circuit substrate, on which the plurality of electronic component forming sections are formed, and the shield member are divided into individual electronic components by being cut.

19. The method of manufacturing an electronic component according to claim 17 , further comprising a step of forming a cover member so as to close an opening of the frame member.

20. The method of manufacturing an electronic component according to claim 17 , further comprising a step of forming a partition wall that extends toward the outer peripheral edge of the first main surface of the circuit substrate from the frame member, so that the region is divided into a first area and a second area by the partition wall; wherein
the partition wall is formed such that the ground wiring is located in the first area and the signal wiring is located in the second area.

Assignees

• Murata Manufacturing Co

Inventors

• Tsuda Motoji

Classifications

• H01L41/0533

  Electricity · mapped topic

• H03H9/1092 Primary

  the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's · CPC title

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/64

  using surface acoustic waves · CPC title

• H03H9/1078

  the enclosure being defined by a foil covering the non-active sides of the SAW device · CPC title