RF-isolating sealing enclosure and interconnection junctions protected thereby

US9653852B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9653852-B2
Application numberUS-201514697255-A
CountryUS
Kind codeB2
Filing dateApr 27, 2015
Priority dateMay 14, 2014
Publication dateMay 16, 2017
Grant dateMay 16, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An interconnection junction for communications cables includes: a first connector; a second connector; and a sealing enclosure having a cavity and formed of a polymeric material, the sealing enclosure comprising an RF-isolating material. The first connector and second connector are joined and reside within the cavity of the sealing enclosure.

First claim

Opening claim text (preview).

That which is claimed is: 1. An interconnection junction, comprising: a first connector; a second connector; a sealing enclosure having a cavity and formed of a polymeric material, the sealing enclosure comprising an RF-isolating material; wherein the first connector and second connector are joined and reside within the cavity of the sealing enclosure; wherein the first connector includes a first central conductor and a first outer conductor, and the second connector includes a second central conductor and a second outer conductor, and wherein when the first and second connectors are engaged, a capacitive element is present between the first outer conductor and the second outer conductor. 2. The interconnection junction defined in claim 1 , wherein the polymeric material of the sealing enclosure comprises a rubber material selected from the group consisting of silicone, fluorosilicone, EPDM, and nitrile. 3. The interconnection junction defined in claim 1 , wherein the RF-isolating material of the sealing enclosure comprises a material selected from the group consisting of silver-plated aluminum, nickel-plated graphite, silver-plated copper, and ferrite- or iron-based alloys. 4. The interconnection junction defined in claim 1 , wherein the RF-isolating material comprises a coating on a surface of the sealing enclosure. 5. The interconnection junction defined in claim 1 , wherein the RF-isolating material comprises a filler in the polymeric material. 6. The interconnection junction defined in claim 1 , wherein the RF-isolating material is impregnated into the polymeric material. 7. The interconnection junction defined in claim 1 , wherein the capacitive element comprises air. 8. The interconnection junction defined in claim 1 , further comprising a first cable attached to the first connector at one end. 9. A sealing enclosure for an interconnection junction of connectors, comprising: a body portion having a cavity therein, the cavity configured to house an interconnection junction of a first connector and a second connector; wherein the body portion is formed of a polymeric material that comprises an RF-isolating material; and, further comprising first and second connectors engaged with each other and residing in the cavity, wherein the first connector includes a first central conductor and a first outer conductor, and the second connector includes a second central conductor and a second outer conductor, and wherein a capacitive element is present between the first outer conductor and the second outer conductor. 10. The sealing enclosure defined in claim 9 , wherein the polymeric material of the sealing enclosure comprises a rubber material selected from the group consisting of silicone, fluorosilicone, EPDM, and nitrile. 11. The sealing enclosure defined in claim 9 , wherein the RF-isolating material of the sealing enclosure comprises a material selected from the group consisting of silver-plated aluminum, nickel-plated graphite, silver-plated copper, and ferrite- or iron-based alloys. 12. The sealing enclosure defined in claim 9 , wherein the RF-isolating material comprises a coating on a surface of the sealing enclosure. 13. The sealing enclosure defined in claim 9 , wherein the RF-isolating material comprises a filler in the polymeric material. 14. The sealing enclosure defined in claim 9 , wherein the RF-isolating material is impregnated into the polymeric material. 15. An interconnection junction, comprising: a first connector; a second connector; a sealing enclosure having a cavity and formed of a polymeric material, the sealing enclosure comprising an RF-isolating material; wherein the first connector and second connector are joined and reside within the cavity of the sealing enclosure; wherein the first connector includes a first central conductor and a first outer conductor, and the second connector includes a second central conductor and a second outer conductor, and wherein when the first and second connectors are engaged, a capacitive element is present between the first outer conductor and the second outer conductor; and wherein the sealing enclosure is configured such that the sealing enclosure contacts at most one of the first and second outer conductors.

Assignees

Inventors

Classifications

  • protected by sleeves, e.g. for communication cable (two-part covers H02G15/10 {; preforms having internal stresses B29C61/00}) · CPC title

  • for coaxial cables or hollow conductors (plug and socket connections between HF conductors H01P1/04; plug and socket connections per se H01R24/38) · CPC title

  • in combination with capacitive coupling · CPC title

  • Dielectric material made conductive, e.g. plastic material coated with metal · CPC title

  • H01F38/14Primary

    Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

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Frequently asked questions

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What does patent US9653852B2 cover?
An interconnection junction for communications cables includes: a first connector; a second connector; and a sealing enclosure having a cavity and formed of a polymeric material, the sealing enclosure comprising an RF-isolating material. The first connector and second connector are joined and reside within the cavity of the sealing enclosure.
Who is the assignee on this patent?
Commscope Technologies Llc
What technology area does this patent fall under?
Primary CPC classification H01R13/6599. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 16 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).