Touch panel stackup

Patent metadata

Field	Value
Publication number	US-9652089-B2
Application number	US-94205610-A
Country	US
Kind code	B2
Filing date	Nov 9, 2010
Priority date	Nov 9, 2010
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A touch panel stackup comprises a substrate having a substantially transparent first region and a substantially opaque second region, a sensing electrode detecting a tactile signal, a conductive circuit electrically coupled with the sensing electrode, and a masking element configured on the second region of the substrate, wherein the sensing electrode, the conductive circuit, and the masking element are integrally formed on the substrate.

First claim

What is claimed is:

1. A touch panel stackup, comprising:
a singular integrated substrate having a display region and a neighboring region next to the display region;
a sensing electrode formed on the singular integrated substrate, wherein the sensing electrode has a first section formed in the display region and a second section formed in the neighboring region, wherein:
the first section of the sensing electrode and a portion of the second section of the sensing electrode lie within a common plane,
the portion of the second section overlies a through hole, and
the first section and the portion of the second section are disposed on a first surface of the singular integrated substrate;

a masking element configured on the neighboring region to cover the second section of the sensing electrode without covering the first section of the sensing electrode, wherein:
the masking element is substantially opaque and has a first surface and a second surface opposite to the first surface, and
the sensing electrode and the masking element are integrally formed so that the first surface of the masking element directly contacts a surface of the second section of the sensing electrode; and

a conductive circuit configured on the neighboring region and electrically connected to the sensing electrode, wherein:
the conductive circuit is formed on the second surface of the masking element, and
the integrally formed sensing electrode and masking element are positioned on the first surface of the singular integrated substrate.

2. The touch panel stackup of claim 1 , wherein the sensing electrode is electrically coupled with the conductive circuit via a conductive path extending from the first surface of the masking element to the second surface of the masking element.

3. The touch panel stackup of claim 1 , wherein:
the through hole is formed in the masking element,
the conductive circuit has a main portion formed on the second surface of the masking element and a branch portion formed in the through hole, and
the branch portion connects to the portion of the second section of the sensing electrode.

4. The touch panel stackup of claim 3 , wherein the main portion of the conductive circuit directly contacts the second surface of the masking element.

5. The touch panel stackup of claim 1 , wherein:
the masking element is an L-shaped structure,
one arm portion of the L-shaped masking element is formed on the first surface of the singular integrated substrate, and
the other arm portion of the L-shaped masking element is formed on the surface of the second section of the sensing electrode.

6. The touch panel stackup of claim 1 , wherein:
the conductive circuit has a main portion formed on the second surface of the masking element and a branch portion vertically connected with the main portion,
the masking element has a first arm portion formed on the first surface of the singular integrated substrate and a second arm portion formed on the surface of the second section of the sensing electrode, and
the branch portion of the conductive circuit penetrates through the second arm portion of the masking element to contact the second section of the sensing electrode.

7. The touch panel stackup of claim 1 , wherein the sensing electrode extends in one direction.

8. The touch panel stackup of claim 1 , wherein the sensing electrode extends in two directions.

9. The touch panel stackup of claim 1 , wherein the singular integrated substrate is made of inorganic non-conductive materials or organic non-conductive materials.

10. The touch panel stackup of claim 1 , wherein:
an element is configured on the singular integrated substrate, and
the element is made of anti-scratch material, anti-glare material, or anti-reflective material.

11. The touch panel stackup of claim 1 , wherein the sensing electrode is made of Indium Tin Oxide, Aluminum Zinc Oxide, Zinc Tin Oxide, conductive glass, conductive polymer, or carbon nanotube.

12. The touch panel stackup of claim 1 , wherein the conductive circuit is made of aluminum, silver, or copper.

13. The touch panel stackup of claim 1 , wherein the sensing electrode and the conductive circuit are made of a same material.

14. The touch panel stackup of claim 1 , wherein the masking element is made of substantially opaque photoresist, resin, or ink.

15. The touch panel stackup of claim 1 , wherein the neighboring region is configured on an edge of the singular integrated substrate.

16. The touch panel stackup of claim 1 , wherein the masking element is pasted, printed, dyed, sputtered, or coated on the singular integrated substrate.

17. The touch panel stackup of claim 1 , wherein:
the first section of the sensing electrode further comprises a sensing electrode pattern and a conductor connected to the sensing electrode pattern, and
the connected sensing electrode pattern and the conductor are extended in one direction.

18. The touch panel stackup of claim 1 , further comprising a plurality of isolating elements, wherein:
the first section of the sensing electrode comprises a plurality of first sensing electrode patterns, a plurality of first conductors each connected between adjacent first sensing electrode patterns, a plurality of second sensing electrode patterns and a plurality of second conductors each connected between adjacent second sensing electrode patterns,
each of the isolating elements is disposed between a corresponding first conductor and a corresponding second conductor
the connected first sensing electrode patterns and the first conductors are extended in a first direction, and
the connected second sensing electrode patterns and the second conductors are extended in a second direction.

19. The touch panel stackup of claim 1 , wherein the through hole is formed in the masking element and has a diameter of less than 30 μm.

20. The touch panel stackup of claim 1 , wherein the second section of the sensing electrode is between the singular integrated substrate and a portion of the masking element.

21. The touch panel stackup of claim 1 , wherein:
the masking element has a third surface opposite to the second surface of the masking element, and
the third surface of the masking element directly contacts the singular integrated substrate.

22. The touch panel stackup of claim 1 , wherein:
the conductive circuit has a main portion formed on the second surface of the masking element and a branch portion formed in the through hole, and
the masking element is disposed between the main portion of the conductive circuit and the singular integrated substrate.

23. The touch panel stackup of claim 22 , wherein the second section of the sensing electrode is between the branch portion of the conductive circuit and the singular integrated substrate.

24. The touch panel stackup of claim 1 , wherein:
the conductive circuit has a main portion formed on the second surface of the masking element and a branch portion formed in the through hole, and
the second section of the sensing electrode is between the branch portion of the conductive circuit and the singular integrated substrate.

Assignees

• Liu Chen-Yu
• Liu cheng-ping
• Tpk Touch Solutions Inc

Inventors

• Liu Chen-Yu
• Liu cheng-ping

Classifications

• G06F2203/04111

  Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/016

  Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

• G06F3/0443

  using a single layer of sensing electrodes · CPC title