Method of manufacturing a quantum dot optical component and backlight unit having the quantum dot optical component

Patent metadata

Field	Value
Publication number	US-9651822-B2
Application number	US-201414515313-A
Country	US
Kind code	B2
Filing date	Oct 15, 2014
Priority date	Dec 27, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A method of manufacturing a quantum dot optical component is provided. By the method, a plurality of quantum dot lines are formed on a first substrate, an encapsulation member that encapsulates the quantum dot lines is formed on the first substrate, a second substrate is laminated on the encapsulation member, and the first and second substrates are cut into a plurality of quantum dot optical components each including at least one of the quantum dot lines.

First claim

What is claimed is:

1. A method of manufacturing a quantum dot optical component comprising:
forming a plurality of parallel quantum dot lines on a first substrate, wherein the quantum dot lines are formed in a full-line shape or in a dashed-line shape;
forming an encapsulation member that encapsulates the quantum dot lines on the first substrate;
laminating a second substrate on the encapsulation member; and
cutting the first and second substrates in between each of the quantum dot lines into a plurality of quantum dot optical components each including at least one of the quantum dot lines.

2. The method of claim 1 , wherein the quantum dot lines are coated on a surface of the first substrate.

3. The method of claim 1 , wherein the quantum dot lines are filled in recess portions that are formed by etching a surface of the first substrate.

4. The method of claim 1 , wherein the quantum dot lines are a mixture of a quantum dot luminous-body and a resin.

5. The method of claim 1 , wherein the encapsulation member covers the quantum dot lines and an entire surface of the first substrate.

6. The method of claim 5 , wherein the encapsulation member is formed by laminating an organic layer and an inorganic layer.

7. The method of claim 1 , wherein the encapsulation member is a frit that encloses each of the quantum dot lines.

8. The method of claim 7 , wherein the frit includes a glass material that is cured by a laser exposure.

9. The method of claim 1 , further comprising: forming a reflective layer between the encapsulation member and the second substrate.

10. The method of claim 1 wherein the cutting comprises cutting the first and second substrates in a direction parallel with the quantum dot lines.

Assignees

• Samsung Display Co Ltd

Inventors

• Sim Mun-Ki
• Lee Baek-Hee
• Kim Young-Min
• Kim Hak-Sun
• Roh Nam-Seok
• Park Jae-Byung
• Park Hae-Il

Classifications

• G02F1/133602 Primary

  Direct backlight · CPC title

• G02F2001/01791

  Physics · mapped topic

• G02F2001/133614

  Physics · mapped topic

• G02F1/133614

  using photoluminescence, e.g. phosphors illuminated by UV or blue light · CPC title

• G02F1/01791

  Quantum boxes or quantum dots · CPC title