Transceiver and interface for IC package

Patent metadata

Field	Value
Publication number	US-9651752-B2
Application number	US-201615157548-A
Country	US
Kind code	B2
Filing date	May 18, 2016
Priority date	Jul 1, 2011
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

First claim

What is claimed is:

1. An optical transceiver comprising:
a substrate including:
a top surface including a front top edge;
a bottom surface opposite to the top surface and including a front bottom edge beneath the front top edge;
first lands arranged along the front bottom edge to mate with corresponding contacts of an edge card connector; and
second lands arranged on the bottom surface to mate with corresponding contacts of a back connector;

an optical engine mounted to the top surface; and
an optical cable attached to the optical engine.

2. The optical transceiver according to claim 1 , wherein high-speed signals are transmitted and/or received through the first lands, and low-speed signals are transmitted and/or received through the second lands.

3. The optical transceiver according to claim 1 , wherein the first lands have a 0.5-mm pitch.

4. The optical transceiver according to claim 1 , further comprising third lands arranged along the front top edge of the substrate to mate with the edge card connector.

5. The optical transceiver according to claim 1 , wherein the second lands have a 0.8-mm pitch.

6. The optical transceiver according to claim 1 , wherein the first lands extend along an entire length of the front top edge.

7. The optical transceiver according to claim 6 , wherein the entire length of the front top edge is less than or equal to about 11.25 mm.

8. The optical transceiver according to claim 1 , wherein the second lands are arranged on a back half of the bottom surface.

9. The optical transceiver according to claim 1 , wherein the optical engine is surface mounted to the substrate.

10. The optical transceiver according to claim 1 , wherein the optical engine includes 4, 8, or 12 channels.

11. The optical transceiver according to claim 1 , wherein the substrate is a circuit board.

12. An optical transceiver system comprising:
a host substrate;
a front connector mounted to the host substrate;
a back connector mounted to the host substrate; and
the optical transceiver according to claim 1 that is simultaneously mateable and unmateable with both the edge card connector and the back connector.

13. The optical transceiver system according to claim 12 , wherein the back connector is a compression connector.

14. The optical transceiver system according to claim 12 , wherein the host substrate is a host circuit board.

15. An optical transceiver comprising:
a substrate including:
a first connection area that transmits and/or receives high-speed electrical signals; and
a second connection area separate and spaced away from the first connection area that transmits and/or receives low-speed electrical signals;

an optical engine mounted to the substrate; and
an optical cable attached to the optical engine; wherein
the first connection area and the second connection area arranged to simultaneously mate with a first connector and a second connector, respectively.

16. The optical transceiver according to claim 15 , wherein the first connection area is along a front edge of the substrate, and the second connection area is on a bottom surface of the substrate.

17. The optical transceiver according to claim 15 , wherein the first connection area and the second connection area are separated along a length of the substrate such that a width of the substrate is less than a sum of a length of the first connection area and a length of the second connection area.

Assignees

• Samtec Inc

Inventors

• Zbinden Eric
• Musser Randall
• Verdiell Jean-Marc André
• Mongold John
• Vicich Brian
• Guetig Keith

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• G02B6/4279

  Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations · CPC title

• G02B6/4278

  related to pluggable or demountable opto-electronic or electronic elements · CPC title

• G02B6/4261

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title