Structure of physical sensor

Patent metadata

Field	Value
Publication number	US-9651408-B2
Application number	US-201314773122-A
Country	US
Kind code	B2
Filing date	Dec 20, 2013
Priority date	Mar 8, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

To suppress variations of a vacuum pressure atmosphere in a physical sensor, a physical sensor in which a sensing part that measures a physical quantity is provided in a vacuum space, includes a sensor part in which a plurality of substrates are stacked, and a cavity substrate 9 having a space and provided on an upper surface side or a lower surface side of the sensor part by bonding, wherein the sensing part communicates with a space of the cavity substrate via a ventilation passage 11 a provided in the sensor part.

First claim

The invention claimed is:

1. A physical sensor in which a sensing part that measures a physical quantity is provided in a vacuum space, comprising:
a sensor part in which a plurality of substrates are stacked; and
a cavity substrate having a space and provided on an upper surface side or a lower surface side of the sensor part by bonding,
wherein the sensing part communicates with the space of the cavity substrate via a ventilation passage provided in the sensor part, and
wherein an outer diameter of the cavity substrate is the same as an outer diameter of the sensor.

2. A physical sensor in which a sensing part that measures a physical quantity is provided in a vacuum space, comprising:
a device substrate having a sensing part that senses a physical quantity, a handle substrate that supports the device substrate, and an electrode substrate that electrically conducts from the device substrate stacked; and
a cavity substrate having a space and provided in the handle substrate by bonding,
wherein a space of the device substrate in which the sensing part is provided communicates with a space of the cavity substrate via a ventilation passage formed within the handle substrate.

3. A physical sensor having a plurality of sensing parts that measure physical quantities, the sensing parts provided in respective hermetically-sealed spaces, respective pressure of the plurality of sensing parts being different, comprising:
a device substrate having the sensing parts, a handle substrate that supports the device substrate, and an electrode substrate that electrically conducts from the device substrate stacked; and
a cavity substrate having a space and provided in the handle substrate by bonding,
wherein a space in which one sensing part of the plurality of hermetically-sealed sensing parts is provided communicates with a space of the cavity substrate via a ventilation passage formed within the handle substrate.

4. The physical sensor according to claim 1 , wherein the sensing part is one sensor of an accelerometer, a gyroscope, and a pressure sensor.

5. The physical sensor according to claim 3 , wherein the plurality of sensing parts include a sensor of a combination of at least two or more of an accelerometer, a gyroscope, and a pressure sensor.

6. The physical sensor according to claim 1 , wherein an absorbent including a getter is provided in the cavity substrate.

7. The physical sensor according to claim 2 , wherein a spatial volume formed in the cavity substrate is equal to or more than a spatial volume of the sensing part at pressure in high vacuum of the device substrate.

8. The physical sensor according to claim 2 , wherein a space is formed on a lower surface side of the handle substrate and communicates with a space formed in the cavity substrate.

9. The physical sensor according to claim 2 , wherein the cavity substrate is formed using silicon or glass.

10. The physical sensor according to claim 9 , wherein the handle substrate and the device substrate include SOI wafers.

11. The physical sensor according to claim 3 , wherein the plurality of sensing parts include an accelerometer and a gyroscope.

12. The physical sensor according to claim 3 , wherein the plurality of sensing parts include accelerometers having respective sensing parts at different internal pressure.

13. The physical sensor according to claim 9 , wherein the handle substrate, the device substrate, and the electrode substrate are respectively sealed by silicon direct bonding, and
the cavity substrate is sealed by metal bonding.

14. The physical sensor according to claim 9 , wherein the handle substrate, the device substrate, and the electrode substrate are respectively sealed by silicon direct bonding, and
the cavity substrate is sealed by anodic bonding.

15. The physical sensor according to claim 9 , wherein the handle substrate and the device substrate are sealed by silicon direct bonding, and
the electrode substrate is sealed by metal bonding with conductivity.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Kanamaru Masatoshi
• Aono Takanori
• Hayashi Masahide
• Jeong Heewon

Classifications

• G01C19/5783 Primary

  Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719 · CPC title

• G01D11/245 Primary

  Housings for sensors · CPC title

• G01P1/023

  for acceleration measuring devices · CPC title