Light emitting device with a heat sink composed of two materials

US9651236B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9651236-B2
Application numberUS-201414169914-A
CountryUS
Kind codeB2
Filing dateJan 31, 2014
Priority dateJan 31, 2014
Publication dateMay 16, 2017
Grant dateMay 16, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light emitting device with a heat sink composed of two materials is provided. The device comprises: a light emitting material; and, a heat sink comprising: a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and, a second material bonded to the first material at an interface there between, the second material comprising a second CTE lower than the first CTE, the light emitting material bonded to the first material but not the second material.

First claim

Opening claim text (preview).

What is claimed is: 1. A device comprising: a light emitting material configured to emit light of at least a first wavelength when excited by excitation light of at least a second wavelength different from the first wavelength; and, a heat sink comprising: a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and, a second material bonded to the first material at an interface there between, the second material comprising a second CTE lower than the first CTE, the second material positioned to prevent expansion of the first material at the interface during heating, the second material having one or more surfaces not in contact with the first material, the interface comprising a bond in stress between the first material and the second material, the stress applied to the interface during bonding of the second material to the first material to increase an intersection temperature of respective thermal expansion curves of the light emitting material and the heat sink, such that, at an operating temperature, a thermal expansion deflection between the light emitting material and the heat sink is reduced, the light emitting material bonded to the first material but not the second material, each of the light emitting material, heat sink, the first material, and the interface having circular symmetry, the interface being around respective complementary surfaces of each of the first material and the second material. 2. The device of claim 1 , wherein the first material comprises an aperture, and the second material is located in the aperture, the interface there between located at an edge of the aperture. 3. The device of claim 2 , wherein the first material surrounds the second material. 4. The device of claim 1 , wherein the second material is bonded to the first material at an outer edge of the first material, the interface there between located at the outer edge. 5. The device of claim 4 , wherein the second material surrounds the first material. 6. The device of claim 1 , wherein the interface further comprises one or more of: a bond in shear between the first material and the second material; a bond in peel between the first material and the second material; and, a bond in compression between the first material and the second material. 7. The device of claim 1 , further comprising apparatus for bonding the first material to the second material, the apparatus comprising at least one of: fasteners; screws, dowels; rivets; epoxy; adhesive; a weld located at the interface; solder located at the interface; and brazing located at the interface. 8. The device of claim 1 , wherein the first material comprises at least one planar surface, and the second material is bonded to the first material at the at least one planar surface. 9. The device of claim 1 , wherein the first material is non-planar on a side opposite the light emitting material, and the second material is bonded to the side opposite the light emitting material. 10. The device of claim 1 , wherein the heat sink is in a shape of a cooling plate. 11. The device of claim 1 , wherein the heat sink is in a shape of a cooling drum. 12. The device of claim 1 , wherein the first material comprises one or more of a first metal and aluminum, and the second material comprises one or more of a second metal, stainless steel, copper-tungsten, an alloy of iron-nickel-cobalt, ceramic, and glass. 13. The device of claim 1 , further comprising a third material bonded to the second material at a respective interface there between, such that the second material is sandwiched between the first material and the third material, the third material comprising a third CTE lower than the second CTE.

Assignees

Inventors

Classifications

  • the elements being filters or photoluminescent elements and reflectors · CPC title

  • by adjustment of photoluminescent elements · CPC title

  • using secondary light emission, e.g. luminescence or fluorescence (using different colours G03B33/00; if related to video signals H04N9/3197) · CPC title

  • characterised by the material (liquid coolants F21V29/56) · CPC title

  • Metals · CPC title

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Frequently asked questions

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What does patent US9651236B2 cover?
A light emitting device with a heat sink composed of two materials is provided. The device comprises: a light emitting material; and, a heat sink comprising: a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and, a second material bonded to the first material at an interface there between, the second ma…
Who is the assignee on this patent?
Christie Digital Systems Usa
What technology area does this patent fall under?
Primary CPC classification F21V29/503. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 16 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).