Polyimide precursor composition, method of producing polyimide precursor composition, method of producing polyimide molded article, polyimide molded article, liquid crystal alignment film, passivation film, wire coating material, and adhesive film

Patent metadata

Field	Value
Publication number	US-9650550-B2
Application number	US-201414263229-A
Country	US
Kind code	B2
Filing date	Apr 28, 2014
Priority date	Dec 16, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A polyimide precursor composition includes a resin having a repeating unit represented by the following Formula (I) and having an imidization ratio equal to or less than 0.2, a cyclic amine compound, and an acyclic aliphatic amine compound, wherein the resin, the cyclic amine compound, and the acyclic aliphatic amine compound are dissolved in an aqueous solvent:

wherein in Formula (I), A represents a tetravalent organic group and B represents a divalent organic group.

First claim

What is claimed is:

1. A polyimide precursor composition comprising a resin having a repeating unit represented by the following Formula (I) and having an imidization ratio equal to or less than 0.2, a cyclic tertiary amine compound, and an acyclic aliphatic tertiary amine compound, wherein the resin, the cyclic tertiary amine compound, and the acyclic aliphatic tertiary amine compound are dissolved in an aqueous solvent:

wherein in Formula (I), A represents a tetravalent organic group and B represents a divalent organic group, and
wherein the molar ratio of the cyclic tertiary amine compound to the acyclic aliphatic tertiary amine compound is from 1:100 to 200:100.

2. The polyimide precursor composition according to claim 1 , wherein the cyclic tertiary amine compound is at least one kind of compound selected from the group consisting of pyridines, imidazoles, morpholines, piperidines, piperazines, pyrrolidines, and pyrazolidines.

3. The polyimide precursor composition according to claim 1 , wherein the resin is synthesized from aromatic tetracarboxylic dianhydride and an aromatic diamine compound.

4. The polyimide precursor composition according to claim 1 , wherein the resin includes an amino group on a terminal end of the polyimide precursor.

5. A method of producing the polyimide precursor composition according to claim 1 , the method comprising: polymerizing tetracarboxylic dianhydride and a diamine compound in an aqueous solvent in the presence of a cyclic tertiary amine compound and an acyclic aliphatic tertiary amine compound, to form a resin.

6. A method of producing the polyimide precursor composition according to claim 1 , the method comprising: polymerizing tetracarboxylic dianhydride and a diamine compound in an aqueous solvent in the presence of a cyclic tertiary amine compound to form a resin and then mixing the aqueous solvent including the formed resin and an acyclic aliphatic tertiary amine compound with each other, or mixing the formed resin, an aqueous solvent, and an acyclic aliphatic tertiary amine compound with each other.

7. A method of producing a polyimide molded article, comprising molding the polyimide precursor composition according to claim 1 by heat treatment.

8. A polyimide molded article produced by the method of producing a polyimide molded article according to claim 7 .

9. A liquid crystal alignment film formed of a polyimide molded article produced by the method of producing a polyimide molded article according to claim 7 .

10. A passivation film formed of a polyimide molded article produced by the method of producing a polyimide molded article according to claim 7 .

11. A wire coating material formed of a polyimide molded article produced by the method of producing a polyimide molded article according to claim 7 .

12. An adhesive film formed of a polyimide molded article produced by the method of producing a polyimide molded article according to claim 7 .

13. The polyimide precursor composition according to claim 1 , wherein the molar ratio of the cyclic tertiary amine compound to the acyclic aliphatic tertiary amine compound is from 1:100 to 10:100.

Assignees

• Fuji Xerox Co Ltd

Inventors

• Miyamoto Tsuyoshi
• Miyazaki Kana

Classifications

• C09J179/08 Primary

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C09D179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G73/1067

  Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

• C09J2479/08

  polyimide · CPC title

• C08G73/105

  with oxygen only in the diamino moiety · CPC title