Use of polypropyleneimine as curing agent for epoxide resins

US9650542B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9650542-B2
Application numberUS-201414771681-A
CountryUS
Kind codeB2
Filing dateJul 29, 2014
Priority dateAug 13, 2013
Publication dateMay 16, 2017
Grant dateMay 16, 2017

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Abstract

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The present invention relates to the use of substantially linear polypropyleneimine as a hardener for epoxy resins, and also to a corresponding curable composition, to the curing thereof, and to the cured epoxy resin obtainable therefrom.

First claim

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The invention claimed is: 1. A curable composition comprising a resin component and a hardener component, wherein the resin component comprises one or more epoxy resins, the hardener component comprises a polypropyleneimine that is substantially linear, and the resin component and the hardener component are comprised in the curable composition in an approximately stoichiometric ratio, based on the reactive groups of the one or more epoxy resins and any reactive diluents, if present, and on the NH functionality of the hardener component. 2. The curable composition according to claim 1 , wherein the resin component further comprises one or more reactive diluents. 3. The curable composition according to claim 2 , wherein the reactive diluent is a low molecular mass organic compound comprising one or more epoxide groups or a cyclic carbonate having 3 to 10 C atoms. 4. The curable composition according to claim 1 , wherein the polypropyleneimine has a number-average molecular weight M n of 100 g/mol to 1000 g/mol. 5. The curable composition according to claim 1 , wherein the polypropyleneimine has a degree of branching, DB HF , of ≦0.3, where DB HF =2D/(2D+L), with D corresponding to the fraction of tertiary amino groups and L corresponding to the fraction of secondary amino groups. 6. The curable composition according to claim 1 , wherein the polypropyleneimine has an amine number for primary amines of 10 mg to 1000 mg KOH/g, an amine number for secondary amines of 100 mg to 2000 mg KOH/g and an amine number for tertiary amines of 0 mg to 200 mg KOH/g. 7. The curable composition according to claim 1 , wherein the polypropyleneimine is prepared by catalytic polytransamination of propanediamine. 8. The curable composition according to claim 1 , wherein the polypropyleneimine is constructed solely of propanediamine structural elements. 9. The curable composition according to claim 1 , wherein the resin component and the polypropyleneimine are comprised in the curable composition in an approximately stoichiometric ratio, based on the reactive groups of the one or more epoxy resins and any reactive diluents, if present, and on the NH functionality of the polypropyleneimine. 10. The curable composition according to claim 1 , wherein the one or more epoxy resins are selected from the group consisting of diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl ether of hydrogenated bisphenol A, and diglycidyl ether of hydrogenated bisphenol F. 11. A process for preparing a cured epoxy resin, comprising: curing the curable composition according to claim 1 . 12. A cured epoxy resin obtained by the process according to claim 11 . 13. A molding comprising the cured epoxy resin according to claim 12 . 14. A composite material comprising the cured epoxy resin according to claim 12 and one or more reinforcing fibers. 15. A coating comprising the cured epoxy resin according to claim 12 . 16. A cured epoxy resin obtained by curing the curable composition according to claim 1 . 17. A molding comprising the cured epoxy resin according to claim 16 . 18. A composite material comprising the cured epoxy resin according to claim 16 and one or more reinforcing fibers. 19. A coating comprising the cured epoxy resin according to claim 16 .

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What does patent US9650542B2 cover?
The present invention relates to the use of substantially linear polypropyleneimine as a hardener for epoxy resins, and also to a corresponding curable composition, to the curing thereof, and to the cured epoxy resin obtainable therefrom.
Who is the assignee on this patent?
Basf Se
What technology area does this patent fall under?
Primary CPC classification C09D179/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 16 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).