Method for manufacturing micro-structure

Patent metadata

Field	Value
Publication number	US-9650538-B2
Application number	US-201414305767-A
Country	US
Kind code	B2
Filing date	Jun 16, 2014
Priority date	Jun 11, 2010
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

First claim

What is claimed is:

1. An optically patternable sacrificial film-forming composition for use in surface micro-machining process, comprising
(A-1) (i) a cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000 and a melting temperature of at least 130° C. in which some or all phenolic hydroxyl groups are esterified with 1,2-naphthoquinonediazidosulfonyl halide, or (ii) a mixture of the cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000 and having some or all phenolic hydroxyl groups esterified with 1,2-naphthoquinonediazidosulfonyl halide and a cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000 and a melting temperature of at least 130° C. in which phenolic hydroxyl groups are not esterified, or (A-2) the novolac resin (i) or the novolac resin mixture (ii) of (A-1) and a 1,2-naphthoquinonediazidosulfonic acid ester, and
a crosslinker capable of foiiiiing crosslinks within the cresol novolac resin in the presence of an acid catalyst.

2. The composition of claim 1 wherein the content of component (A-1) or (A-2) is 45 to 98% by weight in the total solids weight of the sacrificial film-forming composition, and the total amount of the esterized cresol novolac resin and the non-esterized cresol novolac resin is at least 67% by weight in component (A-1) or (A-2).

3. The composition of claim 1 wherein said crosslinker is a melamine compound and said sacrificial film-forming composition comprises 2 to 30% by weight of the melamine compound in the total solids weight of the composition.

4. The composition of claim 1 wherein a cresol novolac resin in which 1 to 30 mol % of phenolic hydroxyl groups are esterified with 1,2-naphthoquinonediazidosulfonyl halide is present.

5. The composition of claim 1 which further comprises at least one photoacid generator selected from the group consisting of oximesulfonates and imid-yl-sulfonate derivatives.

6. The composition of claim 5 wherein the photoacid generator is selected from the group consisting of 4-methoxy-α-(p-toluenesulfonyloxyimino)phenylacetonitrile, α-(4-toluenesulfonyloxyimino)-3-thienylacetonitrile, 1,8-naphthalimide-10-camphorsulfonate, 1,8-naphthalimide-10-p-toluenesulfonate, and 5-norbornene-2,3-dicarboxyimid-yl-n-butylsulfonate.

7. A material for manufacturing a micro-structure comprising a substrate and a sacrificial film formed thereon,
said sacrificial film comprising the optically patternable sacrificial film-forcing composition of claim 1 .

8. A material for manufacturing a micro-structure comprising a substrate and a sacrificial film pattern formed thereon,
said sacrificial film pattern being formed from the sacrificial film comprising the optically patternable sacrificial film-forming composition of claim 1 .

9. The material of claim 7 , wherein the sacrificial film has a thickness of 2.0 to 20 μm.

10. The material of claim 8 , wherein the sacrificial film has a sidewall angle from 80°to less than 90°.

11. The composition of claim 1 , wherein component (A-1) is (i) a cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000 and a melting temperature of at least 130° C. in which some or all phenolic hydroxyl groups are esterified with 1,2-naphthoquinonediazidosulfonyl halide.

12. The composition of claim 1 , comprising:
(A-1) (i) a cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000and a melting temperature of at least 130° C. in which some or all phenolic hydroxyl groups are esterified with 1,2-naphthoquinonediazidosulfonyl halide, or (ii) a mixture of the cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000 and having some or all phenolic hydroxyl groups esterified with 1,2-naphthoquinonediazidosulfonyl halide and a cresol novolac resin consisting of at least 40 mol % of p-cresol and the remainder of m-cresol and having a weight average molecular weight of 2,000 to 30,000 and a melting temperature of at least 130° C. in which phenolic hydroxyl groups are not esterified, and
a crosslinker capable of forming crosslinks within the cresol novolac resin in the presence of an acid catalyst.

Assignees

• Shinetsu Chemical Co

Inventors

• Kato Hideto
• Kanbara Hiroshi
• Furihata Tomoyoshi
• Hirano Yoshinori

Classifications

• C09D163/04 Primary

  Epoxynovolacs · CPC title

• G03F7/70466

  Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature (stitching G03F7/70475) · CPC title

• G03F7/0236

  Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

• B81C2201/0108

  Sacrificial polymer, ashing of organics · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title