Vibration device including support portion

Patent metadata

Field	Value
Publication number	US-9650238-B2
Application number	US-201414475487-A
Country	US
Kind code	B2
Filing date	Sep 2, 2014
Priority date	Sep 3, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A vibration device including a supporting portion formed to cover both ends of a vibration region, and a method of manufacturing the vibration device are provided. The vibration device may include a lower substrate on which an insulating layer is formed, an upper substrate connected onto the insulating layer, and including a vibration region that vibrates and that is separated from the lower substrate by at least a predetermined distance, and a supporting portion formed to cover both ends of the vibration region, to support the vibration region.

First claim

What is claimed is:

1. A vibration device, comprising:
a lower substrate on which an insulating layer is formed;
an upper substrate connected onto the insulating layer, and comprising a vibration region that vibrates and that is separated from the lower substrate by at least a predetermined distance; and
a supporting portion formed to cover both ends of the vibration region and to support the vibration region,
wherein the insulating layer is divided into a first insulating layer part on a first side of the vibration region and a second insulating layer part on a second opposing side of the vibration region, each of the first and second insulating layer parts having a side that faces the vibration region, and
wherein the supporting portion covers the sides of the first and second insulating layer parts that face the vibration region.

2. The vibration device of claim 1 , wherein the supporting portion is formed of a material determined based on a material forming the upper substrate and a material forming the insulating layer.

3. The vibration device of claim 1 , wherein radiation fins are formed on the supporting portion, and radiate heat generated in the upper substrate and the lower substrate.

4. The vibration device of claim 1 , further comprising:
additional electrodes formed above the vibration region and on the supporting portion, to output a signal to the vibration region.

5. The vibration device of claim 1 , further comprising:
a lower electrode formed on the top or the bottom of the lower substrate, to output a signal to the vibration region; and
an upper electrode formed on the upper substrate, to output a signal to the vibration region.

6. The vibration device of claim 5 , wherein the lower substrate comprises a circuit connected from the lower electrode to the vibration region, and
wherein the upper electrode is connected to the circuit through the supporting portion.

7. The vibration device of claim 5 , wherein the vibration region vibrates in response to a signal output from the lower electrode or the upper electrode.

8. The vibration device of claim 1 , wherein the vibration region is separated from the lower substrate by at least the predetermined distance, by etching a portion of the insulating layer connected to the bottom of the vibration region.

9. The vibration device of claim 1 , wherein the supporting portion fills a space between the vibration region and an upper surface of the lower substrate.

10. The vibration device of claim 1 , wherein the vibration region includes a portion of the upper substrate that spans a space between first and second parts of the supporting portion.

11. The vibration device of claim 10 , wherein ends of the portion of the upper substrate that spans the space are covered by the supporting portion.

12. A vibration device, comprising:
a lower substrate on which an insulating layer is formed;
an upper substrate connected onto the insulating layer, and comprising a vibration region that vibrates and that is separated from the lower substrate by at least a predetermined distance;
a supporting portion formed to cover both ends of the vibration region and to support the vibration region; and
radiation fins formed on the supporting portion, to radiate heat generated in the upper substrate and the lower substrate,
wherein the insulating layer is divided into a first insulating layer part on a first side of the vibration region and a second insulating layer part on a second opposing side of the vibration region, each of the first and second insulating layer parts having a side that faces the vibration region, and
wherein the supporting portion covers the sides of the first and second insulating layer parts that face the vibration region.

13. The vibration device of claim 12 , further comprising:
additional electrodes formed above the vibration region and on the supporting portion, to output a signal to the vibration region.

14. A vibration device, comprising:
a lower substrate on which an insulating layer is formed;
an upper substrate connected onto the insulating layer, and comprising a vibration region that vibrates and that is separated from the lower substrate by at least a predetermined distance;
a supporting portion formed to cover both ends of the vibration region and to support the vibration region; and
electrodes formed above the vibration region and on the supporting portion, to output a signal to the vibration region,
wherein the insulating layer is divided into a first insulating layer part on a first side of the vibration region and a second insulating layer part on a second opposing side of the vibration region, each of the first and second insulating layer parts having a side that faces the vibration region, and
wherein the supporting portion covers the sides of the first and second insulating layer parts that face the vibration region.

15. The vibration device of claim 14 , wherein the vibration region vibrates in response to an alternating current (AC) signal output from the electrodes, and outputs a vibration signal having a resonant frequency.

16. The vibration device of claim 15 , wherein the resonant frequency is determined based on a width, a length and a height of a portion of the vibration region that is not covered by the supporting portion.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Baek In Bok
• Yu Han Young
• Kim Yark Yeon
• Kim Young Jun
• Ahn Chang Geun
• Yoon Yong Sun
• Lee Bong Kuk
• Lim Ji Eun
• Jang Won Ick

Classifications

• B81C1/00539

  Wet etching · CPC title

• B81B7/0006

  Interconnects · CPC title

• B81C1/0038

  Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373 · CPC title

• H03H9/08

  Holders with means for regulating temperature · CPC title

• B81B2203/0109

  Bridges · CPC title