Molding packaging material and molded case

Patent metadata

Field	Value
Publication number	US-9649827-B2
Application number	US-201514868498-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Sep 30, 2014
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A molding packaging material includes an outer substrate layer made of a heat-resistant resin, an inner sealant layer made of a thermoplastic resin, a metallic foil layer provided between the outer substrate layer and the inner sealant layer, and a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer. The protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm.

First claim

The invention claimed is:

1. A molding packaging material comprising:
an outer substrate layer made of a heat-resistant resin;
an inner sealant layer made of a thermoplastic resin;
a metallic foil layer arranged between the outer substrate layer and the inner sealant layer; and
a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer, wherein
the protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm;
the curing agent is an isocyanate component; and
an amount of the curing agent in the resin composition is 5 to 30 mass parts to 100 mass parts of the main resin.

2. The molding packaging material as recited in claim 1 , wherein a mass ratio of the phenoxy resin and the urethane resin in the main resin is 0.6 to 1.6 urethane resin to 1 phenoxy resin.

3. The molding packaging material as recited in the claim 1 , wherein the outer substrate layer is made of a polyamide resin.

4. The molding packaging material as recited in claim 1 , wherein a thickness of the metallic foil layer is 10 μm to 40 μm.

5. A molded case made by subjecting the molding packaging material as recited in claim 1 to deep-drawing or bulging.

6. The molded case as recited in claim 5 , wherein the molded case is used as a battery case.

7. The molding packaging material as recited in claim 1 , wherein a viscosity of a solution including the main resin and the curing agent of the resin composition and having a solid content concentration of 25 mass % at 20° C. measured with a #4 Zahn cup is in a range of 10 to 30 seconds.

8. A molding packaging material comprising:
an outer substrate layer made of a heat-resistant resin;
an inner sealant layer made of a thermoplastic resin;
a metallic foil layer arranged between the outer substrate layer and the inner sealant layer; and
a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer; wherein
the protection coat layer is made of a resin composition including a main resin and a curing agent, and has a thickness of 0.1 μm to 10 μm;
the main resin contains a phenoxy resin, a urethane resin, and a resin including fluorine and an acrylate resin;
the curing agent is an isocyanate component; and
an amount of the curing agent in the resin composition is 5 to 30 mass parts to 100 mass parts of the main resin.

Assignees

• Showa Denko Packaging Co Ltd

Inventors

• Wang Honglin
• Minamibori Yuji

Classifications

• B32B15/09

  comprising polyesters · CPC title

• B32B2264/10

  Inorganic particles · CPC title

• B32B27/34

  comprising polyamides · CPC title

• H01M10/0525

  Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries · CPC title

• B32B2307/7244

  Oxygen barrier · CPC title