Microfluidic chips and methods of producing microfluidic chips
US-2024351025-A1 · Oct 24, 2024 · US
US9649629B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9649629-B2 |
| Application number | US-201214343614-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 7, 2012 |
| Priority date | Sep 7, 2011 |
| Publication date | May 16, 2017 |
| Grant date | May 16, 2017 |
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A microfluidic assembly includes a planar microfluidic separation device and a support body configured to receive the planar microfluidic separation device therein. The support body is configured to apply a substantially distributed compressive preload to a substrate of the planar microfluidic separation device. The compressive preload applied to the planar microfluidic separation device may increase the achievable operating pressure of the planar microfluidic separation device.
Opening claim text (preview).
What is claimed is: 1. A microfluidic assembly comprising: a planar microfluidic separation device including a substrate comprising at least one of a glass or a ceramic, the substrate having a working portion including at least one separation channel extending from a channel inlet to a channel outlet; and a support body configured to receive the planar microfluidic separation device therein, the support body applies a substantially distributed multiaxial compressive preload of at least about 2 kpsi over the working portion of the substrate of the planar microfluidic separation device to counteract an internal fluid stress within the working portion. 2. The microfluidic assembly of claim 1 wherein the support body comprises a first support member and a second support member, and wherein the first support member and second support member receive the planar microfluidic separation device therebetween. 3. The microfluidic assembly of claim 2 , wherein the first support member defines a first recess, and wherein the planar microfluidic separation device is disposed at least partially within the first recess. 4. The microfluidic assembly of claim 3 , wherein the second support member defines a second recess, and wherein the planar microfluidic separation device is disposed within a cavity defined by the first recess and the second recess. 5. The microfluidic assembly of claim 2 , wherein at least one of the first support member or the second support member at least partially defines an aperture for fluid communication with the planar microfluidic separation device. 6. The microfluidic assembly of claim 1 , wherein the support body further comprises a fitting configured to provide an interface for connecting fluidic tubing to the planar microfluidic separation device. 7. The microfluidic assembly of claim 2 , wherein the planar microfluidic separation device comprises a first material having a first coefficient of thermal expansion, and wherein at least one of the first support member or the second support member comprises a second material having a second coefficient of thermal expansion within about ±1.0×10 −6 in/in ° F. of the first coefficient of thermal expansion. 8. The microfluidic assembly of claim 7 , wherein the second coefficient of thermal expansion is within about ±0.6×10-6 in/in ° F. of the first coefficient of thermal expansion. 9. The microfluidic assembly of claim 1 , further comprising a semi-compliant material disposed between the support body and the planar microfluidic separation device, wherein the support body comprises a support body material and wherein the semi-compliant material has at least one of an elasticity greater than that of the support body material or a malleability greater than that of the support body material. 10. The microfluidic assembly of claim 9 , wherein the semi-compliant material comprises a composite of silicone rubber and fiberglass. 11. The microfluidic assembly of claim 9 , wherein the semi-compliant material has a thermal conductivity within a range of about 0.9 W/m-K to 3.5 W/m-K. 12. The microfluidic assembly of claim 1 , wherein the applied substantially distributed multiaxial compressive preload is within a range of about 2 kpsi to 15 kpsi. 13. The microfluidic assembly of claim 1 , wherein the support body applies sufficient compressive preload to the substrate of the planar microfluidic separation device for operation of the planar microfluidic separation device at a pressure in the range of about 10 kpsi to 12 kpsi. 14. The microfluidic assembly of claim 1 , wherein the applied substantially distributed multiaxial compressive preload is sufficient for operation of the planar microfluidic separation device at a pressure in the range of about 12 kpsi to 20 kpsi without mechanical failure of the assembly. 15. The microfluidic assembly of claim 2 , further comprising a mechanism for applying a compressive force to at least one of the first support member or the second support member. 16. The microfluidic assembly of claim 1 , wherein the applied substantially distributed multiaxial compressive preload is an applied biaxial stress or an applied triaxial stress.
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