Systems and assemblies for cooling server racks

US9648784B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9648784-B2
Application numberUS-201414216005-A
CountryUS
Kind codeB2
Filing dateMar 17, 2014
Priority dateMar 15, 2013
Publication dateMay 9, 2017
Grant dateMay 9, 2017

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

First claim

Opening claim text (preview).

What is claimed is: 1. A cooling assembly for cooling server racks comprising: a first server rack enclosure sub-assembly comprising: one or more first panel members defining a volume for receiving one or more first server racks having a front portion and a rear portion, at least one of the one or more first panel members being a rear panel member; and at least one frame member defining an opening for receiving the rear portion of the one or more first server racks to form a first hot space between the rear panel member and the combination of the at least one frame member and the rear portion of the one or more first server racks; and a first cooling sub-assembly disposed in thermal communication with the first hot space to enable cooling of at least one first server supported in the at least one first server rack, the first cooling sub-assembly comprising a chassis configured to receive at least one first heat exchange member for exchanging heat between a first fluid flowing through the at least one first heat exchange member and a second fluid flowing through the first hot space that has been heated by the at least one first server, wherein the at least one frame member includes a selectively permeable material, and wherein the selectively permeable material includes a brush assembly. 2. The cooling assembly according to claim 1 , wherein the at least one frame member includes one or more horizontal frame members, one or more vertical frame members, or both. 3. The cooling assembly according to claim 2 , wherein at least one of the one or more horizontal frame members is supported by one or more of the one or more vertical frame members. 4. The cooling assembly according to claim 2 , wherein one or more of the one or more vertical frame members or one or more of the one or more horizontal members or both the one or more of the one or more vertical frame members and the one or more of the one or more horizontal frame members further comprises a sealing member to form a seal between the respective frame member and the rear portion of the at least one first server rack. 5. The cooling assembly according to claim 1 , wherein the rear panel member includes at least one door to enable access to the rear portion of the one or more first server racks. 6. The cooling assembly according to claim 1 , wherein the chassis comprises a set of one or more structural members configured and disposed to support the at least one first heat exchange member, the set of one or more structural members supporting the at least one first heat exchange member to enable the thermal communication with the at least one first server rack enclosure sub-assembly for the cooling of the at least one server. 7. The cooling assembly according to claim 6 , wherein the first fluid is a refrigerant, and wherein the set of one or more structural members of the chassis is configured and disposed to support at least one refrigerant fluid supply line and at least one refrigerant fluid return line, the at least one refrigerant fluid supply line and the at least one refrigerant fluid return line in thermal and fluid communication with the at least one first heat exchange member. 8. The cooling assembly according to claim 6 , wherein the set of one or more structural members of the chassis is configured and disposed to support at least one forced convection cooling member in fluid communication with the at least one first heat exchange member to enable the cooling of the at least one first server. 9. The cooling assembly according to claim 8 , wherein the at least one forced convection cooling member includes a plurality of fans that are disposed to draw the second fluid flowing in the first hot space through the at least one first heat exchange member and over the top of the first cooling sub-assembly. 10. The cooling assembly according to claim 1 , wherein the cooling assembly further comprises: a second server rack enclosure sub-assembly, the second server rack enclosure sub-assembly configured to receive one or more second server racks configured to support at least one second server, the second server rack enclosure sub-assembly defining a frontal position with respect to the at least one second server rack and a rear position with respect to the at least one second server rack, the second server rack enclosure sub-assembly comprising at least one second panel member configured and disposed to selectively seal the rear position of the second server rack enclosure sub-assembly; a second cooling sub-assembly disposed in thermal communication with the second server rack enclosure sub-assembly to enable cooling of the at least one second server when the at least one second server is supported in the at least one second server rack, the second server rack enclosure sub-assembly and the second cooling sub-assembly defining a second confined hot space disposed between the at least one second panel member configured and disposed to selectively seal the rear position of the second server rack enclosure sub- assembly and the rear position of the one or more second server racks enclosed therein, wherein the second cooling sub-assembly comprises a structure configured to receive at least one second heat exchange member for exchanging heat between the first fluid flowing through the at least one second heat exchange member and the second fluid that removes heat from the at least one second server and which flows through the second confined hot space, and wherein the first cooling sub-assembly and the second cooling sub-assembly each comprise at least one respective heat exchange member of the at least one first heat exchange member and the second at least one heat exchange member for exchanging heat between the first fluid flowing through the at least one respective heat exchange member and the second fluid that removes heat from at least one respective server of the at least one first server and the at least one second server, wherein the first cooling sub-assembly and the second cooling sub-assembly comprise a first fluid section and a second fluid section, respectively, configured to enable fluid and thermal communication with the at least one respective heat exchange member and define a first fluid section end and a second fluid section end, each of the first and second fluid section ends enabling the thermal communication, the first fluid section end of the second fluid section of the second cooling sub-assembly configured to couple in series with the second fluid section end of the first fluid section of the first cooling sub-assembly to form a chain of cooling sub-assemblies. 11. The cooling assembly according to claim 10 , wherein the first fluid section and the second fluid section each further defines respective electrical sections having first and second electrical section ends, the first electrical section end of the second electrical section configured to enable electrical communication with the second electrical section end of the first electrical section. 12. A cooling sub-assembly for a cooling assembly for cooling server racks, wherein the cooling assembly comprises a server rack enclosure sub-assembly, the server rack enclosure sub-assembly configured to receive one or more server racks configured to support at least one server, the server rack enclosure sub-assembly defining a frontal position with respect to the at least one server rack and a rear position with respect to the at least one server rack, the server rack enclosure sub-assembly comprising at least one panel member configured and disposed to selectively seal the rear position of the at least one server rack enclosure sub-assembly, the cooling sub-

Assignees

Inventors

Classifications

  • within rooms for removing heat from cabinets · CPC title

  • Details · CPC title

  • within rooms for removing heat from cabinets, e.g. by air conditioning device · CPC title

  • Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

  • Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger · CPC title

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Frequently asked questions

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What does patent US9648784B2 cover?
A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot…
Who is the assignee on this patent?
Inertech Ip Llc
What technology area does this patent fall under?
Primary CPC classification H05K7/20609. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).