Multilayered film element

Patent metadata

Field	Value
Publication number	US-9647327-B2
Application number	US-201113805416-A
Country	US
Kind code	B2
Filing date	Jun 11, 2011
Priority date	Jun 21, 2010
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

The invention relates to a multilayered film element ( 1 ) comprising a first component, more particularly an RFID antenna in the form of a multilayered film element, and to a method for fixing a second component on a film element ( 1 ) of this type. The film element ( 1 ) has a dielectric layer ( 10 ) having a front side ( 10 V) and a rear side ( 10 R). The film element ( 1 ) has a layer ( 11, 12 ) forming a first component, and at least one component contact area ( 23, 24 ) arranged on the front side ( 10 V) and connected to the first component. The film element ( 1 ) has at least one thermode contact layer ( 30 ) which is arranged on the dielectric layer ( 10 ) and which, as seen perpendicularly to the dielectric layer ( 10 ), is arranged in the region of the at least one component contact area ( 23, 24 ). The thermode contact layer ( 30 ) has a thermode contact area ( 32 ) on a side facing away from the dielectric layer ( 10 ), said thermode contact area forming an outer surface of the film element ( 1 ).

First claim

The invention claimed is:

1. A multilayered film element comprising a dielectric layer having a front side and a rear side situated opposite the front side, wherein the film element further has a first electrically conductive layer forming a first component on the front side of the dielectric layer, and wherein the first electrically conductive layer has a surface facing away from the dielectric layer forming at least one component contact area arranged on the front side and connected to the first component and serving for arranging a second component, wherein the film element has at least one thermode contact layer comprising an inner end side which faces the dielectric layer and an outer surface facing away from the dielectric layer, the thermode contact layer being connected to the dielectric layer via the inner end side and which, as seen perpendicularly to the dielectric layer, is arranged in the region of the at least one component contact area and has a thermode contact area on the outer surface of the at least one thermode contact layer facing away from the dielectric layer, said thermode contact area forming an outer surface of the film element, and
wherein the layer forming the first component is a metal layer having a thickness of 1 μm to 50 μm, and wherein that the thermode contact layer is likewise embodied as a metal layer, and
wherein the at least one thermode contact layer is embodied as a rear-side thermode contact layer which is arranged on the rear side of the dielectric layer, and which overlaps and/or encloses the at least one component contact area, as seen perpendicularly to the dielectric layer, at least in regions, and
wherein the thermode contact layer is adapted to conduct heat, applied by a thermode in contact with the thermode contact surface, through the dielectric layer to the component contact area, for mounting the second component on the surface of the component contact area, and
wherein the thermode contact layer further forms a part of a third electrical component of the film element, the part of the third electrical component of the film element formed by the thermode contact layer being at least one of a capacitor area, a resistor area and a coil or coil element having a predefined inductance.

2. The multilayered film element as claimed in claim 1 , wherein the layer forming the first component is a metal layer having a layer thickness of 5 μm to 15 μm.

3. The multilayered film element as claimed in claim 1 , wherein the first component is an antenna structure.

4. The multilayered film element as claimed in claim 1 , wherein the at least one component contact area is electrically connected to the first component.

5. The multilayered film element as claimed in claim 1 , wherein the at least one component contact area is a chip contact area for arranging an electronic microchip.

6. The multilayered film element as claimed in claim 1 , further comprising a front-side thermode contact layer which is arranged on the front side of the dielectric layer and which overlaps or encloses the at least one component contact area at least in regions, as seen perpendicularly to the dielectric layer.

7. The multilayered film element as claimed in claim 1 , wherein the rear-side thermode contact layer completely covers the at least one component contact area, as seen perpendicularly to the dielectric layer.

8. The multilayered film element as claimed in claim 6 , wherein the front-side thermode contact layer and the rear-side thermode contact layer are thermally coupled to one another by a heat-conducting component.

9. The multilayered film element as claimed in claim 1 , wherein the at least one thermode contact layer is formed from a material having a thermal conductivity of greater than 50 W/(m K).

10. The multilayered film element as claimed in claim 1 , wherein the layer forming the first component is a metal layer composed of iron, copper, aluminum, nickel, silver, gold, platinum, tin, zinc or an alloy of these metals and/or a multilayer system.

11. The multilayered film element as claimed in claim 1 , wherein the at least one thermode contact area has a circular or rectangular contour.

12. The multilayered film element as claimed in claim 1 , wherein the at least one thermode contact area, as measured in the plane of the dielectric layer, has a maximum extent in the range of 5 to 25 mm.

13. The multilayered film element as claimed in claim 1 , wherein the at least one thermode contact layer has a maximum layer thickness in the range of 6 to 14 μm.

14. The multilayered film element as claimed in claim 1 , wherein the at least one thermode contact layer, as seen perpendicularly to the dielectric layer, comprises two or more partial regions.

15. The multilayered film element as claimed in claim 1 , wherein the layer forming the first component has a first layer arranged on the front side, a second layer arranged on the rear side, and one or more plated-through holes which penetrate through the dielectric layer and by means of which the first layer and the second layer are electrically conductively connected to one another, wherein the at least one thermode contact layer and the one or more plated-through holes, as seen perpendicularly to the dielectric layer, are arranged without mutual overlap, and preferably have a distance of at least 200 μm.

16. The multilayered film element as claimed in claim 1 , wherein the thermode contact area, as seen perpendicularly to the dielectric layer, has one or more cutouts penetrating completely through the at least one thermode contact layer, wherein the cutouts and/or the thermode contact area surrounding the cutouts provide an optical information item.

17. The multilayered film element as claimed in claim 1 , wherein the thermode contact area has a surface relief, which brings about an optical effect.

18. The multilayered film element as claimed in claim 1 , wherein the at least one thermode contact layer is electrically conductively connected to the layer forming the first component and/or to the at least one component contact area, or is electrically insulated from the layer forming the first component and/or from the at least one component contact area.

19. A method for fixing an electronic chip on a multilayered film element, wherein the method comprises the following steps:
providing a dielectric layer having a front side and a rear side disposed opposite the front side;
applying a first electrically conductive layer on the front side of the dielectric layer, the first electrically conductive layer comprising a metal and having a thickness of 1 μm to 50 μm, and further including at least one chip contact area having a surface for mounting an electronic chip;
applying at least one thermode contact layer on the rear side of the dielectric layer, the at least one thermode contact layer comprising a metal and including a thermode contact surface on a side of the at least one thermode contact layer facing away from the dielectric layer, the thermode contact layer being arranged in the region of the at least one chip contact area as seen perpendicularly to the dielectric layer, said thermode contact surface forming an outer surface of the film element;
applying a thermally activatable adhesive on the surface of the at least one chip contact area of the first electrically conductive layer;
arranging a side of an electronic chip having contact areas on the adhesive applied on the at least one chip contact area of the first electrically conductive layer;
contacting the surface of the at

Assignees

• Schindler Ulrich
• Schumacher Christian
• Mieslinger Stefan
• Leonhard Kurz Stiftung & Co Kg

Inventors

• Schindler Ulrich
• Schumacher Christian
• Mieslinger Stefan

Classifications

• H10W70/699

  for flat cards, e.g. credit cards · CPC title

• G06K19/077 Primary

  Constructional details, e.g. mounting of circuits in the carrier · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K3/38

  Improvement of the adhesion between the insulating substrate and the metal · CPC title

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title