Heat-conductive sealing member and electroluminescent element

Patent metadata

Field	Value
Publication number	US-9647242-B2
Application number	US-201013496973-A
Country	US
Kind code	B2
Filing date	Sep 29, 2010
Priority date	Sep 30, 2009
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.

First claim

The invention claimed is:

1. A heat-conductive sealing member, comprising: a metal base material; an insulating layer that is formed directly on the metal base material, has heat conductivity, and contains at least polyimide; and a tacky adhesive layer that is formed on the insulating layer and has heat resistance, wherein the insulating layer and the tacky adhesive layer are formed in an area excluding the outer peripheral area of the surface of the metal base material on which the insulating layer is formed, wherein a moisture-proof section is formed in the outer peripheral area of the surface of the metal base material, and wherein the tacky adhesive layer contains a thermosetting resin, a photocurable resin, or a thermoplastic resin.

2. The heat-conductive sealing member according to claim 1 , wherein the insulating layer contains the polyimide as a main component.

3. The heat-conductive sealing member according to claim 1 , wherein a peeling layer is formed on the tacky adhesive layer.

4. The heat-conductive sealing member according to claim 3 , wherein the peeling layer has gas barrier properties.

5. The heat-conductive sealing member according to claim 1 , wherein a thickness of the insulating layer is in the range of 0.5 μm to 100 μm.

6. The heat-conductive sealing member according to claim 1 , wherein a coefficient of hygroscopic expansion of the insulating layer is in the range of 0 ppm %/RH to 15 ppm %/RH.

7. The heat-conductive sealing member according to claim 1 , wherein a coefficient of linear thermal expansion of the insulating layer is in the range of 0 ppm/° C. to 30 ppm/° C.

8. The heat-conductive sealing member according to claim 1 , wherein in that a difference between a coefficient of linear thermal expansion of the insulating layer and a coefficient of linear thermal expansion of the metal base material is 15 ppm/° C. or less.

9. The heat-conductive sealing member according to claim 1 , wherein a 5% weight loss temperature of a tacky adhesive that constitutes the tacky adhesive layer is 80° C. or higher.

10. The heat-conductive sealing member according to claim 1 , wherein the tacky adhesive layer contains a curable tacky adhesive.

11. The heat-conductive sealing member according to claim 1 , wherein the tacky adhesive layer contains a polyimide resin.

12. The heat-conductive sealing member according to claim 1 , wherein the tacky adhesive layer contains an acrylic resin.

13. The heat-conductive sealing member according to claim 1 , wherein the tacky adhesive layer contains a polyester resin.

14. The heat-conductive sealing member according to claim 1 , wherein the tacky adhesive layer contains a silicone resin.

15. The heat-conductive sealing member according to claim 1 , wherein a glass transition temperature (Tg) of a tacky adhesive that constitutes the tacky adhesive layer is 100° C. or lower.

16. The heat-conductive sealing member according to claim 1 , wherein a storage modulus at room temperature of the tacky adhesive layer is from 1.0×10 2 Pa to 1.0×10 7 Pa.

17. The heat-conductive sealing member according to claim 1 , wherein the tacky adhesive layer contains a moisture absorbent.

18. The heat-conductive sealing member according to claim 1 , wherein the metal base material has irregularities on a surface that is brought into contact with air.

19. An electroluminescent element comprising: a transparent substrate; a transparent electrode layer formed on the transparent substrate; an electroluminescent layer that is formed on the transparent electrode layer and includes at least a light emitting layer; a back surface electrode layer formed on the electroluminescent layer; and a heat-conductive sealing member formed so as to cover the transparent electrode layer, the electroluminescent layer and the back surface electrode layer,
wherein the heat-conductive sealing member comprises: a metal base material; an insulating layer that is formed directly on the metal base material, has heat conductivity and contains at least polyimide; and a tacky adhesive layer that is formed on the insulating layer and has heat resistance,
wherein the tacky adhesive layer is adhered to the transparent substrate so as to cover the transparent electrode layer, the electroluminescent layer and the back surface electrode layer,
wherein the insulating layer and the tacky adhesive layer are formed in an area excluding the outer peripheral area the surface of of the metal base material on which the insulating layer is formed,
wherein a moisture-proof section is formed in the outer peripheral area of the surface of the metal base material, and
wherein the tacky adhesive layer contains a thermosetting resin, a photocurable resin, or a thermoplastic resin.

20. The electroluminescent element according to claim 19 , wherein a sealing resin section is formed on the transparent substrate so as to surround an outer boundary of the heat-conductive sealing member.

21. The electroluminescent element according to claim 20 , wherein the sealing resin section contains a moisture absorbent.

22. The electroluminescent element according to claim 19 , wherein the back surface electrode layer has transparency, and a white light reflective layer is formed between the back surface electrode layer and the heat-conductive sealing member.

Assignees

• Fukuda Shunji
• Sakayori Katsuya
• Iizumi Yasuhiro
• Dainippon Printing Co Ltd

Inventors

• Fukuda Shunji
• Sakayori Katsuya
• Iizumi Yasuhiro

Classifications

• H10K59/8794

  Arrangements for heating and cooling · CPC title

• H10K59/874

  including getter material or desiccant · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/8721

  Metallic sealing arrangements · CPC title

• H10K50/87

  Arrangements for heating or cooling · CPC title