Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Patent metadata

Field	Value
Publication number	US-9647171-B2
Application number	US-201414479100-A
Country	US
Kind code	B2
Filing date	Sep 5, 2014
Priority date	May 12, 2009
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

First claim

We claim:

1. A method for making a printable electronic device on a device substrate, said method comprising the steps of:
providing a printable electronic device having a contact area, wherein said printable electronic device is anchored to a host substrate via one or more homogeneous or heterogeneous anchors;
contacting said contact area of said printable electronic device with a contact surface of a conformable transfer device, wherein said contact surface of said conformable transfer device has an area smaller than said contact area of said printable electronic device, and wherein said contact area and said contact surface are aligned off center from each other, wherein contact between said contact surface and said contact area binds said printable electronic device to said contact surface;
separating said printable electronic device and said host substrate, thereby releasing said one or more homogeneous or heterogeneous anchors;
contacting said printable electronic device disposed on said contact surface with a receiving surface of said device substrate; and
separating said contact surface of said conformable transfer device and said printable electronic device, wherein said printable electronic device is transferred onto said receiving surface, thereby assembling said printable electronic device on said receiving surface of said device substrate.

2. The method of claim 1 , wherein said contact surface of said conformable transfer device is less than 50% of said contact area of said electronic device.

3. The method of claim 1 , wherein said contact surface of said conformable transfer device is 25% to 75% of said contact area of said electronic device.

4. The method of claim 1 , wherein said contact area and said contact surface are aligned off center from each other by at least 1 μm.

5. The method of claim 1 , wherein said contact area and said contact surface are aligned off center from each other by 1 μm to 100 μm.

6. The method of claim 1 , wherein said contact surface is provided on a relief feature of said conformable transfer device.

7. The method of claim 1 , wherein said conformable transfer device comprises a plurality of relief features providing a plurality of contact regions; said method comprising:
providing a plurality of printable electronic devices each having a contact area, wherein each of said printable electronic devices is anchored to a host substrate via one or more homogeneous or heterogeneous anchors;
contacting said contact areas of said printable electronic devices with said contact regions of said conformable transfer device, wherein each of said contact regions of said conformable transfer device has an area smaller than said each of contact areas of said printable electronic device, and wherein said contact areas and said contact regions are aligned off center from each other, wherein contact between said contact regions and said contact areas binds said printable electronic devices to said contact regions;
separating said printable electronic devices and said host substrate, thereby releasing said homogeneous or heterogeneous anchors;
contacting said printable electronic devices disposed on said contact regions with a receiving surface of said device substrate; and
separating said contact surfaces of said conformable transfer device and said printable electronic devices, wherein said printable electronic devices are transferred onto said receiving surface, thereby assembling said printable electronic devices on said receiving surface of said device substrate.

8. The method of claim 1 , wherein said conformable transfer device is a PDMS stamp.

9. The method of claim 1 , wherein said electronic device is a P-N junction, a thin film transistor, a single junction solar cell, a multi-junction solar cell, a photodiode, a light emitting diode, a laser, a CMOS device, a MOSFET device, a MESFET device, a photovoltaic cell, a microelectromechanical device, a HEMT device or any combination of these.

10. The method of claim 1 , wherein said device substrate is a glass substrate, a polymer substrate, a semiconductor substrate, a metal substrate or a ceramic substrate.

11. The method of claim 1 , wherein said device substrate is a flexible substrate, a large area substrate, a pre-metalized substrate, a substrate pre-patterned with one or more device components, or any combination of these.

12. The method of claim 1 , wherein said host substrate comprises a material selected from the group consisting of: polymer, glass, plastic, semiconductor, sapphire, ceramic or any combination of these.

13. The method of claim 1 , wherein said one or more heterogeneous anchors comprise a resist material.

14. The method of claim 1 , wherein said step of separating said printable electronic device and said host substrate comprises fracturing said one or more homogeneous or heterogeneous anchors.

Assignees

• Univ Illinois

Inventors

• Rogers John A
• Nuzzo Ralph
• Kim Hoon-Sik
• Brueckner Eric
• Park Sang Il
• Kim Rak Hwan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• Y10S438/977

  Thinning or removal of substrate · CPC title