Interposer, method for manufacturing interposer, and semiconductor device

Patent metadata

Field	Value
Publication number	US-9646924-B2
Application number	US-201414311416-A
Country	US
Kind code	B2
Filing date	Jun 23, 2014
Priority date	Jun 24, 2013
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members.

First claim

What is claimed is:

1. An interposer for cooling an electronic component, the interposer comprising:
a substrate body configured to be mounted with the electronic component, the substrate body being formed with
a flow path thereinside, through which a cooling medium flows,
an inflow port formed in the substrate body to extend from an inner surface of the flow path to a surface of the substrate body, through which the cooling medium flows into the flow path, and
an outflow port formed in the substrate body to extend from the inner surface of the flow path to the surface of the substrate body, through which the cooling medium flows out of the flow path;

a first member that is formed on the inner surface of the flow path and that includes
a first abutment member defining a first opening, wherein the first opening is smaller in section area than the inflow port, and
a first connection member that connects is provided between the first abutment member and the inner surface of the flow path to connect the first abutment member to the inner surface of the substrate body and that defines a second opening, wherein a section area of the second opening is substantially equal to that of the inflow port; and

a second member that is formed on the inner surface of the flow path and that includes
a second abutment member defining a third opening, wherein the third opening is smaller in section area than the outflow port, and
a second connection member that connects is provided between the second abutment member and the inner surface of the flow path to connect the second abutment member to the inner surface of the flow path and that defines a fourth opening, wherein a section area of the fourth opening is substantially equal to that of the outflow port.

2. The interposer according to claim 1 , wherein the first and second abutment members are formed in an annular shape.

3. The interposer according to claim 1 , wherein
the substrate body includes
a first surface configured to be mounted with the electronic component, and
a second surface that is an opposite surface to the first surface, and

the interposer further comprising:
a plurality of through electrodes that pass through the substrate body from the first surface to the second surface and that are configured to be electrically connected to terminals of the electronic component.

4. The interposer according to claim 1 , wherein
the first abutment member includes a first Cu layer,
the first connection member includes
a first Ti layer formed on the inner surface of the flow path, and
a first Ni layer on which the first Cu layer of the first abutment member is formed,

the second abutment member includes a second Cu layer, and
the second connection member includes
a second Ti layer formed on the inner surface of the flow path, and
a second Ni layer on which the second Cu layer of the second abutment member is formed.

5. A semiconductor device comprising:
the interposer according to claim 1 ; and
the electronic component mounted on the interposer.

6. An interposer for cooling an electronic component, the interposer comprising:
a substrate body configured to be mounted with the electronic component, the substrate body being formed with
a flow path thereinside, through which a cooling medium flows,
an inflow port formed in the substrate body to extend from an inner surface of the flow path to a surface of the substrate body, through which the cooling medium flows into the flow path, and
an outflow port formed in the substrate body to extend from the inner surface of the flow path to the surface of the substrate body, through which the cooling medium flows out of the flow path;

a first member that is formed on the inner surface of the flow path and that includes
a first abutment member defining a first opening, wherein the first opening is smaller in section area than the inflow port, and
a first connection member that is provided between the first abutment member and the inner surface of the flow path substrate body to connect the first abutment member to the inner surface of the flow path and that defines a second opening, wherein a section area of the second opening is substantially equal to that of the inflow port;

a second member that is formed on the inner surface of the flow path and that includes
a second abutment member defining a third opening, wherein the third opening is smaller in section area than the outflow port, and
a second connection member that is provided between the second abutment member and the inner surface of the flow path to connect the second abutment member to the inner surface of the flow path and that defines a fourth opening, wherein a section area of the fourth opening is substantially equal to that of the outflow port:

a first pipe including a first end portion, wherein
the first pipe is inserted into the inflow port so that the first end portion of the first pipe abuts against the first member, and
the first pipe protrudes from a first surface of the substrate body:

a first solder portion that extends from the first pipe to the first member and connects the first pipe to the first member;
a second pipe including a second end portion, wherein
the second pipe is inserted into the outflow pipe port so that the second end portion of the second pipe abuts against the second member, and
the second pipe protrudes from the first surface of the substrate body; and

a second solder portion that extends from the second pipe to the second member and connects the second pipe to the second member.

7. The interposer according to claim 6 , further comprising:
a first resin portion that covers the first solder portion; and
a second resin portion that covers the second solder portion.

8. The interposer according to claim 6 , wherein
the first end portion of the first pipe abuts against the first abutment member, and
the second end portion of the second pipe abuts against the second abutment member.

9. The interposer according to claim 8 , wherein
the first abutment member includes a first Cu layer,
the first connection member includes
a first Ti layer formed on the inner surface of the flow path, and
a first Ni layer on which the first Cu layer of the first abutment member is formed,

the second abutment member includes a second Cu layer, and
the second connection member includes
a second Ti layer formed on the inner surface of the flow path, and
a second Ni layer on which the second Cu layer of the second abutment member is formed.

10. The interposer according to claim 6 , wherein
the first surface of the substrate body is configured to be mounted with the electronic component, and
the substrate body further includes a second surface that is an opposite surface to the first surface,
the interposer further comprising:
a plurality of through electrodes that pass through the substrate body from the first surface to the second surface and that are configured to be electrically connected to terminals of the electronic component.

11. The interposer according to claim 6 , further comprising:
a first connection pad formed on the first surface of the substrate body in a periphery of the inflow port; and
a second connection pad formed on the first surface of the substrate body in a periphery of the outflow port, wherein
the first pipe further includes a first flange portion,
the second pipe further includes a second flange portion,
the first solder portion connects the first flange portion to the first connection pad, and
the second solder portion connects the second flange portion to the second connection pad.

12. A semicond

Assignees

• Shinko Electric Ind Co

Inventors

• Sakaguchi Hideaki

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W70/69

  Insulating materials thereof · CPC title