Silver-containing film and method for producing same
US-2024279816-A1 · Aug 22, 2024 · US
Method for producing silver-plated product
US9646739B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9646739-B2 |
| Application number | US-201214348118-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 20, 2012 |
| Priority date | Sep 30, 2011 |
| Publication date | May 9, 2017 |
| Grant date | May 9, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing a silver-plated product, the method comprising the steps of: preparing a base material; and forming a surface layer of silver on a surface of the base material or on a surface of an underlying layer formed on the base material, wherein the surface layer is formed by electroplating in a silver plating bath which comprises silver potassium cyanide, potassium cyanide and potassium selenocyanate, the concentration of potassium selenocyanate in the silver plating bath being 11 to 30 mg/L, and wherein a mass ratio of silver to free cyanogen in the silver plating bath is in the range of from 0.9 to 1.8, and wherein a percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 48.1% or more. 2. A method for producing a silver-plated product as set forth in claim 1 , wherein said surface layer is formed on the surface of the base material of copper or a copper alloy, or on the surface of the underlying layer of copper or a copper alloy formed on the base material.
Assignees
Inventors
Classifications
characterised by the material, e.g. plating, or coating materials · CPC title
only coatings of metal elements only · CPC title
Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title
of silver · CPC title
including at least one metal alloy layer · CPC title
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- What does patent US9646739B2 cover?
- There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying …
- Who is the assignee on this patent?
- Dowa Metaltech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C25D7/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).