Systems and methods for haptic feedback for modular devices

Patent metadata

Field	Value
Publication number	US-9645647-B2
Application number	US-201514710823-A
Country	US
Kind code	B2
Filing date	May 13, 2015
Priority date	May 13, 2015
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

One illustrative haptic output device disclosed herein includes a connector configured to couple the haptic output device to a modular computing device. The modular computing device includes an outer housing configured to mechanically and electrically couple with one or more external electronic modules. The haptic output device also includes a receiver configured to receive a haptic signal from a processor. The processor is configured to receive a signal; determine a haptic effect based in part on the signal; generate the haptic signal based on the haptic effect; and transmit the haptic signal. The haptic output device is configured to output the haptic effect responsive to receiving the haptic signal.

First claim

What is claimed:

1. A haptic output device comprising:
a connector configured to couple the haptic output device to a modular computing device, wherein the modular computing device comprises an outer housing configured to mechanically and electrically couple with one or more external electronic modules; and
a receiver configured to receive a haptic signal;
wherein the haptic output device is configured to output a haptic effect responsive to receiving the haptic signal, and wherein:
the haptic output device is configured to output the haptic effect by tightening or loosening a coupling between the outer housing of the modular computing device and an external electronic module of the one or more external electronic modules, or
the haptic effect is configured to assist a user in coupling the external electronic module to the modular computing device, or
the haptic effect is configured to resist against the external electronic module coupling to the modular computing device.

2. The haptic output device of claim 1 , wherein the haptic output device is enclosed within the modular computing device.

3. The haptic output device of claim 1 , wherein the haptic output device is the external electronic module.

4. The haptic output device of claim 1 , wherein the haptic output device is configured to output the haptic effect by tightening or loosening the coupling between the outer housing and the external electronic module responsive to receiving the haptic signal.

5. The haptic output device of claim 1 , wherein the outer housing of the modular computing device includes a compliant material comprising a shape memory alloy, a smart gel, an electro-rheological fluid, or a magneto-rheological fluid, and wherein a processor is configured to modulate a characteristic of the compliant material to modify an amplitude of the haptic effect.

6. The haptic output device of claim 1 , wherein the haptic effect is configured to assist the user in coupling the external electronic module to the modular computing device.

7. The haptic output device of claim 1 , wherein the haptic output device is configured to generate the haptic effect, in part, by moving a mass comprising an external electronic module.

8. The haptic output device of claim 1 , wherein the modular computing device is associated with a wearable device comprising a sleeve, jacket, glove, ring, watch, wristband, collar, shirt, article of clothing, hat, headband, jewelry, shoes, and/or glasses.

9. The haptic output device of claim 1 , wherein the haptic effect is configured to resist against the external electronic module coupling to the modular computing device.

10. A method comprising:
determining, by a processor of a modular computing device having an outer housing configured to mechanically and electrically couple with one or more external electronic modules, a haptic effect to output;
transmitting, by the processor, a haptic signal associated with the haptic effect to a haptic output device, wherein the haptic output device is configured to receive the haptic signal via a receiver and output the haptic effect, and wherein:
the haptic output device is configured to output the haptic effect by tightening or loosening a coupling between the outer housing of the modular computing device and an external electronic module of the one or more external electronic modules, or
the haptic effect is configured to assist a user in coupling the external electronic module to the modular computing device, or
the haptic effect is configured to resist against the external electronic module coupling to the modular computing device.

11. The method of claim 10 , wherein the haptic output device is the external electronic module.

12. The method of claim 10 , wherein the haptic output device is configured to output the haptic effect by tightening or loosening the coupling between the outer housing and the external electronic module responsive to receiving the haptic signal.

13. The method of claim 10 , further comprising:
modulating a characteristic of a compliant material in the outer housing of the modular computing device to modify an amplitude of the haptic effect, the compliant material comprising a shape memory alloy, a smart gel, an electro-rheological fluid, or a magneto-rheological fluid.

14. The method of claim 10 , wherein the haptic effect is configured to resist against the external electronic module coupling to the modular computing device.

15. The method of claim 10 , wherein the haptic output device is configured to generate the haptic effect, in part, by moving a mass comprising an external electronic module.

16. The method of claim 10 , wherein the modular computing device is associated with a wearable device comprising a sleeve, jacket, glove, ring, watch, wristband, collar, shirt, article of clothing, hat, headband, jewelry, shoes, and/or glasses.

17. The method of claim 10 , wherein the haptic effect is configured to assist the user in coupling the external electronic module to the modular computing device.

18. The method of claim 10 , wherein the haptic output device is the external electronic module.

19. A non-transient computer readable medium comprising program code that is executable by a processor of a modular computing device having an outer housing configured to receive one or more external electronic modules, the program code being executable by the processor to cause the processor to:
determine a haptic effect to output; and
transmit a haptic signal associated with the haptic effect to a haptic output device, wherein the haptic output device is configured to receive the haptic signal and output the haptic effect, and wherein:
the haptic output device is configured to output the haptic effect by tightening or loosening a coupling between the outer housing of the modular computing device and an external electronic module of the one or more external electronic modules, or
the haptic effect is configured to assist a user in coupling the external electronic module to the modular computing device, or
the haptic effect is configured to resist against the external electronic module coupling to the modular computing device.

20. The non-transient computer readable medium of claim 19 , wherein the haptic output device is configured to output the haptic effect by tightening or loosening the coupling between the outer housing and the external electronic module responsive to receiving the haptic signal.

21. The non-transient computer readable medium of claim 19 , further comprising program code which when executed by the processor is configured to cause the processor to:
modulate a characteristic of a compliant material in the outer housing of the modular computing device to modify an amplitude of the haptic effect, the compliant material comprising a shape memory alloy, a smart gel, an electro-rheological fluid, or a magneto-rheological fluid.

22. The non-transient computer readable medium of claim 19 , wherein the haptic effect is configured to resist against the external electronic module coupling to the modular computing device.

23. The non-transient computer readable medium of claim 19 , wherein the haptic effect is configured to assist the user in coupling the external electronic module to the modular computing device.

24. The non-transient computer readable medium of claim 19 , wherein the haptic output device is the external electronic module.

Assignees

• Immersion Corp

Inventors

• Levesque Vincent

Classifications

• G06F2203/013

  Force feedback applied to a game · CPC title

• G06F3/016 Primary

  Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

• G06F2200/1635

  Stackable modules · CPC title

• G06F3/0416

  Control or interface arrangements specially adapted for digitisers · CPC title

• G06F2203/014

  Force feedback applied to GUI · CPC title